AMD Ryzen AI 9 HX 370 socket: FP8

What the Ryzen AI 9 HX 370 is

The Ryzen AI 9 HX 370 is the lead 12-core SKU of the Ryzen AI 300 series that AMD announced at Computex in June 2024, with laptops reaching shelves in July 2024. Four full-size Zen 5 cores and eight compact Zen 5c cores give 24 threads at 2.0 GHz base, with the fast cores boosting to 5.1 GHz and the compact cores to 3.3 GHz. Cache totals 12 MB of L2 plus 24 MB of L3. The chip is built on TSMC 4 nm as a single monolithic Strix Point die, and its default TDP is 28 W inside a 15 to 54 W configurable range.

Graphics come from the Radeon 890M with 16 RDNA 3.5 cores at up to 2900 MHz, the largest integrated GPU in the Strix Point line. It drives the laptop display directly and handles photo work plus light play without a separate card. An XDNA 2 NPU adds up to 50 TOPS of AI throughput, or up to 80 TOPS combined with the CPU and GPU, which clears the bar for Copilot+ features when the system ships with enough memory.

Against the 10-core AMD Ryzen AI 9 365 below it, the HX 370 adds two compact cores and steps graphics up from the 12-core 880M to the 16-core 890M. Against the AMD Ryzen AI 9 HX 375 above it the silicon matches and only NPU speed differs. The multiplier is locked, and ECC memory is not offered on this consumer platform.

Socket and motherboard compatibility

The HX 370 fits the FP8 package, a 25 x 40 mm grid array with 1,140 contacts that solders to the laptop mainboard. There is no socket retention, no aftermarket board choice and no processor upgrade: the chip is fixed at the factory. Buying advice centers on choosing core count, graphics size and memory capacity at order time, since none of them change later.

System makers pair it with DDR5 SODIMM slots or soldered LPDDR5X depending on chassis thickness. Thicker performance laptops use socketed DDR5-5600 modules that owners can expand, while thin designs solder LPDDR5X-8000 for speed at the cost of fixed capacity. Either way the board is designed around the 28 W class with heat pipes sized for short bursts above it.

Shoppers comparing nearby options meet the same package across the stack: the AMD Ryzen AI 9 HX PRO 370 business version shares the die with added manageability, while Hawk Point parts such as the AMD Ryzen AI 7 450 use FP8 with older Zen 4 cores. Board support lists do not apply here the way they do on socketed desktops.

Memory, PCIe and cooling

Memory support covers DDR5-5600 through slots and LPDDR5X-8000 soldered, over two channels to 256 GB. Dual-channel operation feeds both the processor and the 890M graphics, so matched pairs matter in SODIMM systems: a 2 x 16 GB kit is the sweet spot for AI features plus everyday multitasking. Single-channel builds cut graphics pace noticeably and are worth avoiding.

PCIe arrives as 16 lanes of PCIe 4.0 from the APU for NVMe storage plus radios and card readers on the board. There is no PCIe 5.0 on Strix Point, so Gen5 drives installed here run at Gen4 speed. That ceiling matches the laptop market of 2024, where Gen4 SSDs remained the standard fit.

Cooling belongs to the laptop maker, with heat pipes and fans tuned for the configured TDP between 15 and 54 W. No cooler ships with the processor itself. Buyers should read maker figures for sustained power in the exact chassis, since a thin body may hold lower clocks under long loads than a thick one with the same chip.

Upgrade paths

There is no CPU upgrade path on FP8 because the processor is soldered. The performance step inside the same generation is chosen at purchase: the AMD Ryzen AI 9 365 for lower cost with 10 cores, the HX 370 for full graphics, or the AMD Ryzen AI 9 HX 375 where the faster NPU matters. Storage and, on SODIMM boards, memory are the only parts that change afterward.

A move beyond Strix Point means replacing the whole laptop. Successor platforms such as Gorgon Point on FP8 keep the same package idea with higher clocks, so the buying decision repeats: pick the chassis, display and memory size for the years ahead. The previous socketed era covered in the LGA, PGA and BGA: CPU package types explained guide does not apply to these soldered designs.