AMD Ryzen AI 7 PRO 360 socket: FP8

The AMD Ryzen AI 7 PRO 360 uses the FP8 package, a 25 × 40 mm grid array that solders to the laptop board. It is an 8-core Strix Point APU with a 28 W default TDP, and the soldered processor cannot be replaced.

Socket
FP8
Launched
January 2025
Cores and threads
8 and 16
Default TDP
28 W
Codename
Strix Point
Segment
Mobile (soldered)
Clocks
2.0 / 5.0 GHz

AMD Ryzen AI 7 PRO 360 specifications

Cores8 (3 Zen 5 and 5 Zen 5c)
Threads16
Core architectureZen 5 and Zen 5c, monolithic Strix Point die
Clocks2.0 GHz base, up to 5.0 GHz maximum boost (Zen 5c cores up to 3.3 GHz)
Cache16 MB L3 and 8 MB L2 (24 MB total)
Default TDP28 W
Configurable TDP15 to 54 W
Manufacturing processTSMC 4 nm
Memory supportDDR5-5600 or soldered LPDDR5X up to 8000 MT/s, two channels, up to 256 GB, ECC with platform support
PCI ExpressPCIe 4.0, 16 total lanes and 16 usable, for NVMe storage and expansion
Integrated graphicsRadeon 880M, 12 compute units, up to 2900 MHz
NPUXDNA 2, up to 50 TOPS (up to 72 TOPS platform total)
MultiplierLocked
PackageFP8 (BGA1140, 25 × 40 mm, soldered)

Motherboard compatibility

AMD Ryzen AI 7 PRO 360 needs a motherboard with a FP8 socket. Chipset by chipset data for this codename is not recorded yet. See the FP8 chipset list and the board maker's CPU support list.

FP8 at a glance

TypeBGA, 1,140 contacts
Package size25 × 40 mm
Introduced2023
MemoryDDR5 SODIMM or soldered LPDDR5X depending on board design, up to LPDDR5X-8533 on Gorgon Point, dual channel with ECC and Link-ECC options on embedded P100 boards
Cooler mounting holesNot applicable (soldered)

Read the full FP8 socket guide

What the Ryzen AI 7 PRO 360 is

The Ryzen AI 7 PRO 360 is the 8-core business member of the Strix Point PRO family. Three full-size Zen 5 cores and five compact Zen 5c cores give 16 threads at 2.0 GHz base, with the fast cores boosting to 5.0 GHz and the compact cores to 3.3 GHz. Cache totals 8 MB of L2 plus 16 MB of L3. The chip is built on TSMC 4 nm as a single monolithic die, and its default TDP is 28 W inside a 15 to 54 W configurable range.

Graphics come from 12 RDNA 3.5 compute units as Radeon 880M at up to 2900 MHz. That size covers office work, presentations, video playback and light creation tasks without a discrete card, and it keeps thermals inside thin business chassis. The XDNA 2 NPU reaches up to 50 TOPS, with combined platform throughput up to 72 TOPS. Background blur, transcription and on-device assistance run on the NPU while the CPU stays free for the actual workload.

Against the 12-core PRO parts above it, the PRO 360 trades four cores and some cache for lower power draw under full load and usually a lower laptop price. Lenovo used the PRO 360 in ThinkPad designs that AMD measured for its own office productivity testing, which shows where this SKU lives: mainstream corporate fleets. AMD PRO Technologies bring remote management and hardware backed security to those fleets, and both arrived in business channels in the January 2025 window.

Socket and motherboard compatibility

The chip solders into FP8, the 25 × 40 mm BGA that carries recent AMD mobile generations, so it cannot be removed or swapped after manufacture. Buyers choose a complete laptop with fixed processor, memory and cooling, and service means board replacement. There is no socket lever, no retention bracket and no secondhand upgrade market for the processor itself. The LGA, PGA and BGA: CPU package types explained guide explains how soldered packages differ from socketed ones.

Mainstream business lines such as ThinkPad, EliteBook and Latitude carried PRO 300 chips through 2025, with the 8-core SKUs in the volume models. Firmware and management support come from the laptop maker, so the support page for the exact laptop model is the reference that matters. A failed board is replaced as a unit under the service plan.

Memory, PCIe and cooling

Systems pair the PRO 360 with DDR5 SODIMM modules or soldered LPDDR5X, over two channels to 256 GB. DDR5-5600 is the fastest socketed speed AMD lists, while soldered LPDDR5X reaches 8000 MT/s for extra graphics bandwidth. ECC works where the platform supports it, which suits reliability sensitive deployments. Soldered memory sizes freeze at purchase, and Copilot+ features need 16 GB or more in the system.

Expansion comes from 16 usable PCIe Gen4 lanes for NVMe storage and add-on devices, with boot and RAID0 and RAID1 modes supported for the boot drive. Two native USB4 ports and three USB 3.2 Gen 2 ports come from the SoC, and display outputs drive up to four monitors. Most office desks get their extra screens and wired networking from a USB4 dock rather than from inside the chassis.

Cooling spans 15 to 54 W around the 28 W default and belongs to the laptop maker, with heat pipes and fans drawn for the configured TDP of each model. Boost behavior tracks power and temperature on each machine, so the same APU scores differently in a thin ultrabook and a thicker performance chassis. Fleet buyers should compare complete laptop models on noise and sustained performance, not on the APU name alone.

Upgrade paths

Soldered laptop silicon cannot be upgraded, so buyers pick the core count, graphics size and memory at purchase and judge used machines on battery health, panel quality and chassis condition. The PRO 360 suits buyers who want a fast 8-core for office multitasking with headroom to spare. Heavier multitaskers who compile code or edit video regularly should step to a 12-core PRO part at the same 28 W envelope.

The PRO badge is the deciding factor against consumer 8-core Strix and Krackan silicon, which matches much of the performance but lacks the fleet management set. A company that images and manages many laptops buys PRO; a home buyer with one machine gains nothing from it. Compare complete laptops on display, keyboard, battery and service options, which decide daily experience more than the APU badge.

Frequently asked questions

What socket does the Ryzen AI 7 PRO 360 use?

It uses FP8, a 25 × 40 mm grid array. The chip is soldered, so a laptop upgrade means replacing the whole system.

How are the 8 cores of the PRO 360 arranged?

Three full-size Zen 5 cores reach up to 5.0 GHz, and five compact Zen 5c cores reach up to 3.3 GHz, sharing 16 MB of L3 cache for 16 threads in total.

What memory does the PRO 360 support?

Boards use DDR5 SODIMM modules at up to DDR5-5600 or soldered LPDDR5X up to 8000 MT/s, over two channels to 256 GB, with ECC where the platform supports it.

Does the PRO 360 include an NPU?

Yes, an XDNA 2 NPU with up to 50 TOPS, plus up to 72 TOPS of combined platform throughput, which clears the bar for Copilot+ features with enough system memory.

Sources and verification

  1. AMD Ryzen AI 7 PRO 360 (AMD)
  2. AMD Ryzen AI 7 PRO 360 Specs (TechPowerUp)

Facts last checked against these sources on . Page last edited on .