AMD Ryzen AI 7 450 socket: FP8
The AMD Ryzen AI 7 450 uses the FP8 package, a 25 × 40 mm grid array that solders to the laptop board. It is an 8-core Gorgon Point APU with a 28 W default TDP, and the soldered processor cannot be replaced.
- Socket
- FP8
- Launched
- January 2026
- Cores and threads
- 8 and 16
- Default TDP
- 28 W
- Codename
- Gorgon Point
- Segment
- Mobile (soldered)
- Family
- AMD Ryzen AI 7
- Clocks
- 2.0 / 5.1 GHz
AMD Ryzen AI 7 450 specifications
| Cores | 8 (4 Zen 5 and 4 Zen 5c) |
|---|---|
| Threads | 16 |
| Core architecture | Zen 5 and Zen 5c cores (4 fast cores and 4 compact cores) |
| Clocks | 2.0 GHz base, up to 5.1 GHz maximum boost (compact cores to 3.6 GHz) |
| Cache | 16 MB L3 and 8 MB L2 (24 MB total) |
| Default TDP | 28 W |
| Configurable TDP | 15 to 54 W |
| Manufacturing process | TSMC 4 nm FinFET |
| Memory support | DDR5-5600 or soldered LPDDR5X up to 8533 MT/s, two channels, up to 256 GB |
| PCI Express | PCIe 4.0, 16 native lanes, for NVMe storage and expansion |
| Integrated graphics | Radeon 860M, 8 compute units, up to 3100 MHz |
| NPU | XDNA 2, up to 50 TOPS (66 TOPS whole chip) |
| ECC memory | No (AMD lists no ECC support) |
| Package | FP8 (BGA, 25 × 40 mm, soldered) |
Motherboard compatibility
AMD Ryzen AI 7 450 needs a motherboard with a FP8 socket. Chipset by chipset data for this codename is not recorded yet. See the FP8 chipset list and the board maker's CPU support list.
FP8 at a glance
| Type | BGA, 1,140 contacts |
|---|---|
| Package size | 25 × 40 mm |
| Introduced | 2023 |
| Memory | DDR5 SODIMM or soldered LPDDR5X depending on board design, up to LPDDR5X-8533 on Gorgon Point, dual channel with ECC and Link-ECC options on embedded P100 boards |
| Cooler mounting holes | Not applicable (soldered) |
What the Ryzen AI 7 450 is
The Ryzen AI 7 450 is the 8-core mid step of the Gorgon Point laptop refresh, announced at CES in January 2026. Four full-size Zen 5 cores and four compact Zen 5c cores give 16 threads at a 2.0 GHz base, boosting to 5.1 GHz on the fast cores and 3.6 GHz on the compact cores. Cache totals 8 MB of L2 plus 16 MB of L3. Graphics are 8 RDNA 3.5 compute units as Radeon 860M at up to 3100 MHz, and the XDNA 2 NPU reaches 50 TOPS inside 66 TOPS for the whole chip. Default TDP is 28 W inside a 15 to 54 W configurable range on TSMC 4 nm FinFET.
Against the 6-core AMD Ryzen AI 7 445 below it, the 450 adds two compact cores, doubles the graphics units from 4 to 8 and doubles L3 from 8 MB to 16 MB, with 500 MHz more boost. Buyers who edit photos, compile code or drive high resolution external monitors feel that gap daily, while light office work runs identically on either chip. Both APUs share the Gorgon Point platform with LPDDR5X support to 8533 MT/s, so chassis and board designs carry over between them.
The 50 TOPS NPU places local AI acceleration on a dedicated engine instead of the CPU cores, which keeps assistants, transcription and background effects running without draining the battery. Thin performance laptops pair the 450 with soldered LPDDR5X to feed the 8 graphics units, while value designs take DDR5 modules and accept lower graphics bandwidth. Either way the 28 W default suits machines that balance carry weight against sustained speed.
Socket and motherboard compatibility
The chip solders into FP8, the 25 × 40 mm BGA that carries recent AMD mobile generations, so it cannot be removed or swapped after manufacture. Buyers choose a complete laptop with fixed processor, memory and cooling, and service means board replacement. There is no socket lever, no retention bracket and no secondhand upgrade market for the processor itself. The LGA, PGA and BGA: CPU package types explained guide explains how soldered packages differ from socketed ones.
Gorgon Point reuses Strix Point board designs with updated firmware, which is why 450 laptops reached shelves early in 2026 on mature chassis. Laptop makers set the configured TDP per model anywhere from 15 to 54 W, so the same APU behaves differently in a thin ultrabook and a thicker performance chassis. Check the maker specification sheet for the configured power before comparing benchmark figures across machines.
Because the processor never changes, purchase decisions should weigh the whole laptop: display, keyboard, battery size, port layout and warranty service. A well cooled 450 at 28 W or higher outruns a thermally starved higher tier part, and memory size decides AI feature eligibility and multitasking headroom.
Memory, PCIe and cooling
Systems pair the 450 with DDR5 modules at up to 5600 MT/s or soldered LPDDR5X up to 8533 MT/s, over two channels to 256 GB. Soldered LPDDR5X gives the Radeon 860M the bandwidth its 8 compute units want, while socketed DDR5 keeps repair options open at lower graphics throughput. Sizes freeze at purchase on soldered designs, so order memory for the machine lifetime rather than the first year.
Expansion comes from 16 native PCIe 4.0 lanes for NVMe storage and board devices, beside two native USB4 ports for docks, fast external drives and display output. The platform skips PCIe 5.0, so Gen5 drives negotiate down to Gen4 speed where fitted. Lane splits are fixed per board, and a second full speed SSD slot is never guaranteed.
Cooling belongs to the laptop maker, with heat pipes and fans drawn for the configured TDP of each model. Boost behavior tracks power and temperature on each machine, which is why thin and thick chassis score differently with the same silicon. AMD lists no ECC support on this APU, so buyers who need error coverage look to workstation lines instead.
Upgrade paths
Soldered laptop silicon cannot be upgraded, so buyers pick between Gorgon Point core counts at purchase and judge used machines on battery health, memory size and panel quality. The 450 suits buyers who want eight cores with meaningful graphics without stepping to a 10-core flagship. Heavier rendering and virtualization loads point higher in the stack, while pure office use saves money lower down.
Compare complete laptops on display, keyboard, battery and service options, which decide daily experience more than the APU badge. A 450 with 32 GB of fast LPDDR5X and a good screen beats a flagship APU with weak memory and a dim panel for most owners. Warranty length and local service weigh heavily where the board is the whole computer.
Desktop buyers who expect a later processor swap should choose a socketed platform instead and accept the larger chassis it requires. The laptop purchase is final at the processor level from day one.
Frequently asked questions
What socket does the Ryzen AI 7 450 use?
It uses FP8, a 25 × 40 mm grid array. The chip is soldered and laptop upgrades mean replacing the system.
How are the 8 cores of the 450 arranged?
Four full-size Zen 5 cores boost to 5.1 GHz and four compact Zen 5c cores reach 3.6 GHz, sharing 16 MB of L3 for 16 threads in total.
What memory does the 450 support?
Boards use DDR5 modules at up to DDR5-5600 or soldered LPDDR5X up to 8533 MT/s, over two channels to 256 GB. Soldered memory sizes freeze at purchase.
Does the 450 include an NPU?
Yes, an XDNA 2 NPU with up to 50 TOPS for local AI features, inside 66 TOPS counted across NPU, CPU and graphics together.
Sources and verification
Facts last checked against these sources on . Page last edited on .