AMD Ryzen AI 9 HX 375 socket: FP8

What the Ryzen AI 9 HX 375 is

The Ryzen AI 9 HX 375 is the top NPU SKU of the Strix Point generation, added quietly in July 2024 after the initial HX 370 launch wave. CPU and graphics mirror the HX 370 exactly: four Zen 5 cores plus eight Zen 5c cores for 24 threads, 2.0 GHz base with 5.1 GHz boost on the fast cores, 12 MB of L2 with 24 MB of L3, and Radeon 890M graphics with 16 cores at up to 2900 MHz on TSMC 4 nm. Default TDP stays 28 W in the 15 to 54 W range.

The difference sits in the neural processor. XDNA 2 throughput rises from up to 50 TOPS to up to 55 TOPS, lifting combined platform throughput from up to 80 to up to 85 TOPS. That margin matters for buyers who run local assistants and image tools all day while keeping the CPU and GPU free. For gaming and rendering the two chips behave identically, since clocks, cache and GPU match.

Side by side with the AMD Ryzen AI 9 HX 370, the 375 costs more for NPU headroom alone. Against the 10-core AMD Ryzen AI 9 365 it adds two compact cores, four GPU cores and the faster NPU together. The multiplier is locked and ECC is absent across these consumer SKUs.

Socket and motherboard compatibility

The HX 375 uses the FP8 soldered package at 25 x 40 mm. Laptop makers attach it at the factory with no socket, no retention and no upgrade path. Shoppers evaluate the whole machine instead of the chip: display quality, memory size, battery and cooling design decide satisfaction more than the 5 TOPS NPU gap.

Memory configurations mirror the HX 370 with DDR5-5600 SODIMM or soldered LPDDR5X-8000 across two channels to 256 GB. Makers aiming at AI demos favor 32 GB or more of fast memory so large models stay resident. Storage rides on PCIe 4.0 NVMe like the rest of Strix Point.

The business twin of this class is the AMD Ryzen AI 9 HX PRO 375 line where offered, while Hawk Point systems such as the AMD Ryzen AI 7 450 sit below on older cores. None of these soldered boards accept a later processor swap.

Memory, PCIe and cooling

DDR5-5600 and LPDDR5X-8000 support matches the HX 370 across two channels to 256 GB. NPU workloads favor capacity and bandwidth together, so 32 GB of dual-channel memory is the practical floor for buyers who chose the 375 for AI rather than gaming. Single-stick SODIMM builds throttle both graphics and NPU data rates and deserve an early second stick.

PCIe 4.0 lanes number 16 from the APU for storage and board peripherals. Gen5 SSDs fall back to Gen4 speed, which changes little in real laptop use. External graphics over USB4 or OCuLink remain possible on boards that wire those ports, though the 890M already covers portable play.

Thermal design follows the laptop chassis in the 15 to 54 W configured band. No processor cooler ships separately. Long AI batch jobs settle at the sustained power the chassis can reject, so cooling reviews of the exact model predict behavior better than the NPU rating alone.

Upgrade paths

Soldering removes the CPU upgrade, so the 375 is a buy-once choice for maximum Strix Point NPU speed. Shoppers who skip it fall back to the AMD Ryzen AI 9 HX 370 with identical CPU and graphics, or to the AMD Ryzen AI 9 365 for lower cost. Only storage, and memory on SODIMM boards, change after purchase.

Future generations replace the machine rather than the chip. Gorgon Point laptops on FP8 raise clocks and NPU throughput further for buyers who can wait. The LGA, PGA and BGA: CPU package types explained guide explains why these grid-array mobile designs never offered the swap path of desktop sockets.