AMD Ryzen AI 9 HX PRO 375 socket: FP8
The AMD Ryzen AI 9 HX PRO 375 uses the FP8 package, a 25 × 40 mm grid array that solders to the laptop board. It is a 12-core Strix Point APU with a 28 W default TDP, and the soldered processor cannot be replaced.
- Socket
- FP8
- Launched
- January 2025
- Cores and threads
- 12 and 24
- Default TDP
- 28 W
- Codename
- Strix Point
- Segment
- Mobile (soldered)
- Family
- AMD Ryzen AI 9
- Clocks
- 2.0 / 5.1 GHz
AMD Ryzen AI 9 HX PRO 375 specifications
| Cores | 12 (4 Zen 5 and 8 Zen 5c) |
|---|---|
| Threads | 24 |
| Core architecture | Zen 5 and Zen 5c, monolithic Strix Point die |
| Clocks | 2.0 GHz base, up to 5.1 GHz maximum boost (Zen 5c cores up to 3.3 GHz) |
| Cache | 24 MB L3 and 12 MB L2 (36 MB total) |
| Default TDP | 28 W |
| Configurable TDP | 15 to 54 W |
| Manufacturing process | TSMC 4 nm |
| Memory support | DDR5-5600 or soldered LPDDR5X up to 8000 MT/s, two channels, up to 256 GB, ECC with platform support |
| PCI Express | PCIe 4.0, 16 total lanes and 16 usable, for NVMe storage and expansion |
| Integrated graphics | Radeon 890M, 16 compute units, up to 2900 MHz |
| NPU | XDNA 2, up to 55 TOPS (up to 85 TOPS platform total) |
| Multiplier | Locked |
| Package | FP8 (BGA1140, 25 × 40 mm, soldered) |
Motherboard compatibility
AMD Ryzen AI 9 HX PRO 375 needs a motherboard with a FP8 socket. Chipset by chipset data for this codename is not recorded yet. See the FP8 chipset list and the board maker's CPU support list.
FP8 at a glance
| Type | BGA, 1,140 contacts |
|---|---|
| Package size | 25 × 40 mm |
| Introduced | 2023 |
| Memory | DDR5 SODIMM or soldered LPDDR5X depending on board design, up to LPDDR5X-8533 on Gorgon Point, dual channel with ECC and Link-ECC options on embedded P100 boards |
| Cooler mounting holes | Not applicable (soldered) |
What the Ryzen AI 9 HX PRO 375 is
The Ryzen AI 9 HX PRO 375 stands at the top of the Ryzen AI PRO 300 stack for business laptops. Four full-size Zen 5 cores and eight compact Zen 5c cores give 24 threads at 2.0 GHz base, with the fast cores boosting to 5.1 GHz and the compact cores to 3.3 GHz. Cache totals 12 MB of L2 plus 24 MB of L3. The chip is built on TSMC 4 nm as a single monolithic Strix Point die, and its default TDP is 28 W inside a 15 to 54 W configurable range.
Graphics come from 16 RDNA 3.5 compute units as Radeon 890M at up to 2900 MHz, the largest integrated GPU in the PRO lineup. That size suits GPU accelerated office work, video processing and model assisted tasks without a discrete card. The XDNA 2 NPU reaches up to 55 TOPS, which is higher than every other PRO 300 SKU, and combined platform throughput reaches up to 85 TOPS. Systems with enough memory qualify for Copilot+ features that run locally on the NPU.
AMD PRO Technologies separate this chip from the otherwise similar consumer HX parts. Fleet tools for remote management sit beside hardware backed security features, which is why corporate buyers pay for the PRO badge. Laptops with this processor, such as the HP EliteBook X G1a that AMD used for its own performance testing, shipped through business channels after the January 2025 availability window. Buyers who live in managed fleets get the management story; buyers outside them get the same Strix Point performance without it.
Socket and motherboard compatibility
The chip solders into FP8, the 25 × 40 mm BGA that carries recent AMD mobile generations, so it cannot be removed or swapped after manufacture. Buyers choose a complete laptop with fixed processor, memory and cooling, and service means board replacement. There is no socket lever, no retention bracket and no secondhand upgrade market for the processor itself. The LGA, PGA and BGA: CPU package types explained guide explains how soldered packages differ from socketed ones.
Business designs pair the PRO 375 with vPro class competition from Intel, and the choice of laptop matters more than the choice of silicon. HP, Lenovo and Dell each shipped PRO 300 systems in their EliteBook, ThinkPad and Latitude lines during 2025. Firmware and drivers come from the laptop maker, so check that support page rather than expecting a generic AMD board update path.
Memory, PCIe and cooling
Systems pair the PRO 375 with DDR5 SODIMM modules or soldered LPDDR5X, over two channels to 256 GB. DDR5-5600 is the fastest socketed speed AMD lists, while soldered LPDDR5X reaches 8000 MT/s for extra graphics bandwidth. ECC works where the platform supports it, which matters for workstation style reliability. Soldered memory sizes freeze at purchase, and Copilot+ features need 16 GB or more in the system.
Expansion comes from 16 usable PCIe Gen4 lanes for NVMe storage and add-on devices, with boot and RAID0 and RAID1 modes supported for the boot drive. Two native USB4 ports and three USB 3.2 Gen 2 ports come from the SoC, and display outputs drive up to four monitors. Designs that need heavy 3D work add a discrete GPU over those lanes, while thin office designs skip it entirely and keep the battery.
Cooling spans 15 to 54 W around the 28 W default and belongs to the laptop maker, with heat pipes and fans drawn for the configured TDP of each model. Boost behavior tracks power and temperature on each machine, so the same APU scores differently in a thin ultrabook and a thicker performance chassis. Sustained loads settle where the chassis allows, which is why reviewers test complete laptops rather than bare chips.
Upgrade paths
Soldered laptop silicon cannot be upgraded, so buyers pick the core count, graphics size and memory at purchase and judge used machines on battery health, panel quality and chassis condition. The PRO 375 suits buyers who want the fastest business APU of its generation with the largest integrated graphics. Buyers who need less can step to an 8-core PRO part at the same 28 W envelope without leaving the managed fleet story.
The PRO badge is the deciding factor against the consumer HX parts, which share Strix Point silicon and clocks but lack the fleet management set. A company that images and manages thousands of laptops buys PRO; a home buyer with one machine gains nothing from it. Compare complete laptops on display, keyboard, battery and service options, which decide daily experience more than the APU badge.
Frequently asked questions
What socket does the Ryzen AI 9 HX PRO 375 use?
It uses FP8, a 25 × 40 mm grid array. The chip is soldered, so a laptop upgrade means replacing the whole system.
How are the 12 cores of the PRO 375 arranged?
Four full-size Zen 5 cores reach up to 5.1 GHz, and eight compact Zen 5c cores reach up to 3.3 GHz, sharing 24 MB of L3 cache for 24 threads in total.
What memory does the PRO 375 support?
Boards use DDR5 SODIMM modules at up to DDR5-5600 or soldered LPDDR5X up to 8000 MT/s, over two channels to 256 GB, with ECC where the platform supports it.
Does the PRO 375 include an NPU?
Yes, an XDNA 2 NPU with up to 55 TOPS, the highest NPU rating in the PRO 300 stack, plus up to 85 TOPS of combined platform throughput for local AI features.
Sources and verification
Facts last checked against these sources on . Page last edited on .