AMD Ryzen AI 7 350 socket: FP8
The AMD Ryzen AI 7 350 uses the FP8 package, a 25 × 40 mm grid array that solders to the laptop board. It is an 8-core Krackan Point APU with a 28 W default TDP, and the soldered processor cannot be replaced.
- Socket
- FP8
- Launched
- February 18, 2025
- Cores and threads
- 8 and 16
- Default TDP
- 28 W
- Codename
- Krackan Point
- Segment
- Mobile (soldered)
- Family
- AMD Ryzen AI 7
- Clocks
- 2.0 / 5.0 GHz
AMD Ryzen AI 7 350 specifications
| Cores | 8 (4 Zen 5 and 4 Zen 5c) |
|---|---|
| Threads | 16 |
| Core architecture | Zen 5 and Zen 5c, monolithic Krackan Point die |
| Clocks | 2.0 GHz base, up to 5.0 GHz maximum boost (Zen 5c cores up to 3.5 GHz) |
| Cache | 16 MB L3 and 8 MB L2 (24 MB total) |
| Default TDP | 28 W |
| Configurable TDP | 15 to 54 W |
| Manufacturing process | TSMC 4 nm |
| Memory support | DDR5-5600 or soldered LPDDR5X up to 8000 MT/s, two channels, up to 256 GB (16 GB or more for Copilot+) |
| PCI Express | PCIe 4.0, 16 total lanes and 16 usable, for NVMe storage and expansion |
| Integrated graphics | Radeon 860M, 8 compute units, up to 3000 MHz |
| NPU | XDNA 2, up to 50 TOPS (up to 66 TOPS platform total) |
| Multiplier | Locked |
| Package | FP8 (BGA1140, 25 × 40 mm, soldered) |
Motherboard compatibility
AMD Ryzen AI 7 350 needs a motherboard with a FP8 socket. Chipset by chipset data for this codename is not recorded yet. See the FP8 chipset list and the board maker's CPU support list.
FP8 at a glance
| Type | BGA, 1,140 contacts |
|---|---|
| Package size | 25 × 40 mm |
| Introduced | 2023 |
| Memory | DDR5 SODIMM or soldered LPDDR5X depending on board design, up to LPDDR5X-8533 on Gorgon Point, dual channel with ECC and Link-ECC options on embedded P100 boards |
| Cooler mounting holes | Not applicable (soldered) |
What the Ryzen AI 7 350 is
The Ryzen AI 7 350 is the consumer 8-core of the Krackan Point family for mainstream laptops. Four full-size Zen 5 cores and four compact Zen 5c cores give 16 threads at 2.0 GHz base, with the fast cores boosting to 5.0 GHz and the compact cores to 3.5 GHz. Cache totals 8 MB of L2 plus 16 MB of L3. The chip is built on TSMC 4 nm as a single monolithic die that is smaller than Strix Point, and its default TDP is 28 W inside a 15 to 54 W configurable range.
Graphics come from 8 RDNA 3.5 compute units as Radeon 860M at up to 3000 MHz. That size plays light games at modest settings and accelerates video and photo work without a discrete card, which keeps thin laptops thin. The XDNA 2 NPU reaches up to 50 TOPS, with combined platform throughput up to 66 TOPS. Systems with enough memory earn Copilot+ certification, so background effects, transcription and on-device assistance run on the NPU.
Against the Ryzen AI 5 340 below it, the 350 adds two cores, a larger GPU and 200 MHz of boost clock at the same 28 W envelope. Buyers who edit video, program with large projects or keep many applications open will feel the difference, while pure office work runs the same on either chip. AMD lists a February 18, 2025 launch date, and laptops from Acer, Asus, Lenovo, HP and Dell carried this APU through that year.
Socket and motherboard compatibility
The chip solders into FP8, the 25 × 40 mm BGA that carries recent AMD mobile generations, so it cannot be removed or swapped after manufacture. Buyers choose a complete laptop with fixed processor, memory and cooling, and service means board replacement. There is no socket lever, no retention bracket and no secondhand upgrade market for the processor itself. The LGA, PGA and BGA: CPU package types explained guide explains how soldered packages differ from socketed ones.
Mainstream ultrabooks and all-round laptops pair this APU with either socketed DDR5 or soldered LPDDR5X, depending on whether the design favors serviceability or thinness. Firmware and drivers come from the laptop maker, so the support page for the exact laptop model is the reference that matters. Gaming designs add a discrete GPU over the PCIe lanes, while thin designs rely on the integrated Radeon alone.
Memory, PCIe and cooling
Systems pair the 350 with DDR5 SODIMM modules or soldered LPDDR5X, over two channels to 256 GB. DDR5-5600 is the fastest socketed speed AMD lists for the platform, while soldered LPDDR5X reaches 8000 MT/s for extra graphics bandwidth. Eight compute units reward fast memory, so a dual-channel LPDDR5X configuration gives the best graphics result. Soldered memory sizes freeze at purchase, and Copilot+ features need 16 GB or more in the system.
Expansion comes from 16 usable PCIe Gen4 lanes for NVMe storage and add-on devices. USB4 ports from the SoC handle docking stations, fast external drives and extra displays, with up to four monitors supported from the integrated graphics. Lane splits are fixed per board, so check the laptop specification sheet before assuming a second fast SSD slot.
Cooling spans 15 to 54 W around the 28 W default and belongs to the laptop maker, with heat pipes and fans drawn for the configured TDP of each model. Boost behavior tracks power and temperature on each machine, so the same APU scores differently in a thin ultrabook and a thicker performance chassis. Reviews of the exact laptop model show what sustained performance to expect.
Upgrade paths
Soldered laptop silicon cannot be upgraded, so buyers pick the core count, graphics size and memory at purchase and judge used machines on battery health, memory size and panel quality. The 350 suits buyers who want a capable all-round laptop for study, office work, creation and light play. Buyers who only browse and write can save money with the 6-core below it, while buyers who want more should look at Strix Point 12-core designs.
The PRO 350 twin shares the die and clocks but adds fleet management features that only IT departments use. A home buyer with one machine gains nothing from the PRO badge and should compare complete laptops on display, keyboard, battery and service options instead. Gaming laptops with this APU plus a discrete card are judged on the card and the screen as much as on the processor.
Frequently asked questions
What socket does the Ryzen AI 7 350 use?
It uses FP8, a 25 × 40 mm grid array. The chip is soldered, so a laptop upgrade means replacing the whole system.
How are the 8 cores of the Ryzen AI 7 350 arranged?
Four full-size Zen 5 cores reach up to 5.0 GHz, and four compact Zen 5c cores reach up to 3.5 GHz, sharing 16 MB of L3 cache for 16 threads in total.
What memory does the Ryzen AI 7 350 support?
Boards use DDR5 SODIMM modules at up to DDR5-5600 or soldered LPDDR5X up to 8000 MT/s, over two channels to 256 GB.
Does the Ryzen AI 7 350 include an NPU?
Yes, an XDNA 2 NPU with up to 50 TOPS, plus up to 66 TOPS of combined platform throughput, which earns Copilot+ certification with enough system memory.
Sources and verification
Facts last checked against these sources on . Page last edited on .