AMD Ryzen AI 7 PRO 350 socket: FP8
The AMD Ryzen AI 7 PRO 350 uses the FP8 package, a 25 × 40 mm grid array that solders to the laptop board. It is an 8-core Krackan Point APU with a 28 W default TDP, and the soldered processor cannot be replaced.
- Socket
- FP8
- Launched
- March 27, 2025
- Cores and threads
- 8 and 16
- Default TDP
- 28 W
- Codename
- Krackan Point
- Segment
- Mobile (soldered)
- Family
- AMD Ryzen AI 7
- Clocks
- 2.0 / 5.0 GHz
AMD Ryzen AI 7 PRO 350 specifications
| Cores | 8 (4 Zen 5 and 4 Zen 5c) |
|---|---|
| Threads | 16 |
| Core architecture | Zen 5 and Zen 5c, monolithic Krackan Point die |
| Clocks | 2.0 GHz base, up to 5.0 GHz maximum boost (Zen 5c cores up to 3.5 GHz) |
| Cache | 16 MB L3 and 8 MB L2 (24 MB total) |
| Default TDP | 28 W |
| Configurable TDP | 15 to 54 W |
| Manufacturing process | TSMC 4 nm |
| Memory support | DDR5-5600 or soldered LPDDR5X up to 8000 MT/s, two channels, ECC with platform support |
| PCI Express | PCIe 4.0, 16 total lanes and 16 usable, for NVMe storage and expansion |
| Integrated graphics | Radeon 860M, 8 compute units, up to 3000 MHz |
| NPU | XDNA 2, up to 50 TOPS (up to 66 TOPS platform total) |
| Multiplier | Locked |
| Package | FP8 (BGA1140, 25 × 40 mm, soldered) |
Motherboard compatibility
AMD Ryzen AI 7 PRO 350 needs a motherboard with a FP8 socket. Chipset by chipset data for this codename is not recorded yet. See the FP8 chipset list and the board maker's CPU support list.
FP8 at a glance
| Type | BGA, 1,140 contacts |
|---|---|
| Package size | 25 × 40 mm |
| Introduced | 2023 |
| Memory | DDR5 SODIMM or soldered LPDDR5X depending on board design, up to LPDDR5X-8533 on Gorgon Point, dual channel with ECC and Link-ECC options on embedded P100 boards |
| Cooler mounting holes | Not applicable (soldered) |
What the Ryzen AI 7 PRO 350 is
The Ryzen AI 7 PRO 350 brings the PRO management story to the smaller Krackan Point die. Four full-size Zen 5 cores and four compact Zen 5c cores give 16 threads at 2.0 GHz base, with the fast cores boosting to 5.0 GHz and the compact cores to 3.5 GHz. Cache totals 8 MB of L2 plus 16 MB of L3. The chip is built on TSMC 4 nm as a single monolithic die that is smaller than Strix Point, and its default TDP is 28 W inside a 15 to 54 W configurable range.
Graphics come from 8 RDNA 3.5 compute units as Radeon 860M at up to 3000 MHz. That size covers office work, video meetings and light creation tasks without a discrete card, and it fits the power budget of thin business laptops. The XDNA 2 NPU reaches up to 50 TOPS, with combined platform throughput up to 66 TOPS. Local AI features run on the NPU while the CPU cores stay free for the applications in front of the user.
Against the Strix Point PRO 360, the PRO 350 keeps the same thread count and boost clock on a smaller die with a smaller GPU. Corporate buyers get nearly the same office performance in cheaper and thinner chassis. AMD lists a March 27, 2025 launch date for this SKU, and business lines such as EliteBook and ThinkPad designs carried Krackan PRO chips through that year. AMD PRO Technologies add remote management and hardware backed security for those fleets.
Socket and motherboard compatibility
The chip solders into FP8, the 25 × 40 mm BGA that carries recent AMD mobile generations, so it cannot be removed or swapped after manufacture. Buyers choose a complete laptop with fixed processor, memory and cooling, and service means board replacement. There is no socket lever, no retention bracket and no secondhand upgrade market for the processor itself. The LGA, PGA and BGA: CPU package types explained guide explains how soldered packages differ from socketed ones.
Krackan Point boards reuse the FP8 footprint of their Strix Point cousins, which let laptop makers ship PRO 350 designs on mature chassis with updated firmware. Firmware and management support come from the laptop maker, so the support page for the exact laptop model is the reference that matters. A failed board is replaced as a unit under the service plan.
Memory, PCIe and cooling
Systems pair the PRO 350 with DDR5 SODIMM modules or soldered LPDDR5X, over two memory channels. DDR5-5600 is the fastest socketed speed AMD lists for the platform, while soldered LPDDR5X reaches 8000 MT/s for extra graphics bandwidth. ECC works where the platform supports it, which suits reliability sensitive deployments. Soldered memory sizes freeze at purchase, and Copilot+ features need 16 GB or more in the system.
Expansion comes from 16 usable PCIe Gen4 lanes for NVMe storage and add-on devices. USB4 ports from the SoC handle docking stations, fast external drives and extra displays, with up to four monitors supported from the integrated graphics. Most office desks get their screens and wired networking from a dock rather than from inside the chassis.
Cooling spans 15 to 54 W around the 28 W default and belongs to the laptop maker, with heat pipes and fans drawn for the configured TDP of each model. Boost behavior tracks power and temperature on each machine, so the same APU scores differently in a thin ultrabook and a thicker performance chassis. Fleet buyers should compare complete laptop models on noise and sustained performance, not on the APU name alone.
Upgrade paths
Soldered laptop silicon cannot be upgraded, so buyers pick the core count, graphics size and memory at purchase and judge used machines on battery health, panel quality and chassis condition. The PRO 350 suits buyers who want eight current generation cores for office multitasking inside a managed fleet. Heavier multitaskers who compile code or edit video regularly should step to a 12-core Strix Point PRO part at the same 28 W envelope.
The PRO badge is the deciding factor against the consumer Ryzen AI 7 350, which shares the Krackan Point die and clocks but lacks the fleet management set. A company that images and manages many laptops buys PRO; a home buyer with one machine gains nothing from it. Compare complete laptops on display, keyboard, battery and service options, which decide daily experience more than the APU badge.
Frequently asked questions
What socket does the Ryzen AI 7 PRO 350 use?
It uses FP8, a 25 × 40 mm grid array. The chip is soldered, so a laptop upgrade means replacing the whole system.
How are the 8 cores of the PRO 350 arranged?
Four full-size Zen 5 cores reach up to 5.0 GHz, and four compact Zen 5c cores reach up to 3.5 GHz, sharing 16 MB of L3 cache for 16 threads in total.
What memory does the PRO 350 support?
Boards use DDR5 SODIMM modules at up to DDR5-5600 or soldered LPDDR5X up to 8000 MT/s over two channels, with ECC where the platform supports it.
Does the PRO 350 include an NPU?
Yes, an XDNA 2 NPU with up to 50 TOPS, plus up to 66 TOPS of combined platform throughput, which clears the bar for Copilot+ features with enough system memory.
Sources and verification
Facts last checked against these sources on . Page last edited on .