AMD Ryzen AI 5 PRO 340 socket: FP8
The AMD Ryzen AI 5 PRO 340 uses the FP8 package, a 25 × 40 mm grid array that solders to the laptop board. It is a 6-core Krackan Point APU with a 28 W default TDP, and the soldered processor cannot be replaced.
- Socket
- FP8
- Launched
- March 27, 2025
- Cores and threads
- 6 and 12
- Default TDP
- 28 W
- Codename
- Krackan Point
- Segment
- Mobile (soldered)
- Family
- AMD Ryzen AI 5
- Clocks
- 2.0 / 4.8 GHz
AMD Ryzen AI 5 PRO 340 specifications
| Cores | 6 (3 Zen 5 and 3 Zen 5c) |
|---|---|
| Threads | 12 |
| Core architecture | Zen 5 and Zen 5c, monolithic Krackan Point die |
| Clocks | 2.0 GHz base, up to 4.8 GHz maximum boost (Zen 5c cores up to 3.4 GHz) |
| Cache | 16 MB L3 and 6 MB L2 (22 MB total) |
| Default TDP | 28 W |
| Configurable TDP | 15 to 54 W |
| Manufacturing process | TSMC 4 nm |
| Memory support | DDR5-5600 or soldered LPDDR5X up to 8000 MT/s, two channels, up to 256 GB, ECC with platform support |
| PCI Express | PCIe 4.0, 16 total lanes and 16 usable, for NVMe storage and expansion |
| Integrated graphics | Radeon 840M, 4 compute units, up to 2900 MHz |
| NPU | XDNA 2, up to 50 TOPS (up to 59 TOPS platform total) |
| Multiplier | Locked |
| Package | FP8 (BGA1140, 25 × 40 mm, soldered) |
Motherboard compatibility
AMD Ryzen AI 5 PRO 340 needs a motherboard with a FP8 socket. Chipset by chipset data for this codename is not recorded yet. See the FP8 chipset list and the board maker's CPU support list.
FP8 at a glance
| Type | BGA, 1,140 contacts |
|---|---|
| Package size | 25 × 40 mm |
| Introduced | 2023 |
| Memory | DDR5 SODIMM or soldered LPDDR5X depending on board design, up to LPDDR5X-8533 on Gorgon Point, dual channel with ECC and Link-ECC options on embedded P100 boards |
| Cooler mounting holes | Not applicable (soldered) |
What the Ryzen AI 5 PRO 340 is
The Ryzen AI 5 PRO 340 is the entry business SKU of the Krackan Point PRO family. Three full-size Zen 5 cores and three compact Zen 5c cores give 12 threads at 2.0 GHz base, with the fast cores boosting to 4.8 GHz and the compact cores to 3.4 GHz. Cache totals 6 MB of L2 plus 16 MB of L3. The chip is built on TSMC 4 nm as a single monolithic die that is smaller than Strix Point, and its default TDP is 28 W inside a 15 to 54 W configurable range.
Graphics come from 4 RDNA 3.5 compute units as Radeon 840M at up to 2900 MHz. That size covers office work, video calls and everyday displays without a discrete card, which is exactly what entry business laptops need. The XDNA 2 NPU reaches up to 50 TOPS, with combined platform throughput up to 59 TOPS. Background effects, transcription and on-device assistance run on the NPU while the CPU cores handle the applications in front of the user.
Against the 8-core PRO 350 above it, the PRO 340 keeps the same L3 cache, NPU rating and PRO management set with two fewer cores and a smaller GPU. Office fleets that buy hundreds of machines save money per seat without losing manageability. AMD lists a March 27, 2025 launch date for this SKU, and it shipped in cost sensitive business lines through that year with AMD PRO Technologies for remote management and hardware backed security.
Socket and motherboard compatibility
The chip solders into FP8, the 25 × 40 mm BGA that carries recent AMD mobile generations, so it cannot be removed or swapped after manufacture. Buyers choose a complete laptop with fixed processor, memory and cooling, and service means board replacement. There is no socket lever, no retention bracket and no secondhand upgrade market for the processor itself. The LGA, PGA and BGA: CPU package types explained guide explains how soldered packages differ from socketed ones.
Entry business laptops pair this APU with DDR5 SODIMM slots in serviceable chassis or with soldered LPDDR5X in thinner ones. Firmware and management support come from the laptop maker, so the support page for the exact laptop model is the reference that matters. A failed board is replaced as a unit under the service plan.
Memory, PCIe and cooling
Systems pair the PRO 340 with DDR5 SODIMM modules or soldered LPDDR5X, over two channels to 256 GB. DDR5-5600 is the fastest socketed speed AMD lists for the platform, while soldered LPDDR5X reaches 8000 MT/s for extra graphics bandwidth. ECC works where the platform supports it, which suits reliability sensitive deployments. Soldered memory sizes freeze at purchase, and Copilot+ features need 16 GB or more in the system.
Expansion comes from 16 usable PCIe Gen4 lanes for NVMe storage and add-on devices. USB4 ports from the SoC handle docking stations, fast external drives and extra displays, with up to four monitors supported from the integrated graphics. Most office desks get their screens and wired networking from a dock rather than from inside the chassis.
Cooling spans 15 to 54 W around the 28 W default and belongs to the laptop maker, with heat pipes and fans drawn for the configured TDP of each model. Boost behavior tracks power and temperature on each machine, so the same APU scores differently in a thin ultrabook and a thicker performance chassis. Fleet buyers should compare complete laptop models on noise and sustained performance, not on the APU name alone.
Upgrade paths
Soldered laptop silicon cannot be upgraded, so buyers pick the core count, graphics size and memory at purchase and judge used machines on battery health, panel quality and chassis condition. The PRO 340 suits buyers who equip large office fleets with a current generation 6-core at a modest per-seat price. Teams with heavier multitasking needs should step to an 8-core PRO part at the same 28 W envelope.
The PRO badge is the deciding factor against the consumer Ryzen AI 5 340, which shares the Krackan Point die and clocks but lacks the fleet management set. A company that images and manages many laptops buys PRO; a home buyer with one machine gains nothing from it. Compare complete laptops on display, keyboard, battery and service options, which decide daily experience more than the APU badge.
Frequently asked questions
What socket does the Ryzen AI 5 PRO 340 use?
It uses FP8, a 25 × 40 mm grid array. The chip is soldered, so a laptop upgrade means replacing the whole system.
How are the 6 cores of the PRO 340 arranged?
Three full-size Zen 5 cores reach up to 4.8 GHz, and three compact Zen 5c cores reach up to 3.4 GHz, sharing 16 MB of L3 cache for 12 threads in total.
What memory does the PRO 340 support?
Boards use DDR5 SODIMM modules at up to DDR5-5600 or soldered LPDDR5X up to 8000 MT/s, over two channels to 256 GB, with ECC where the platform supports it.
Does the PRO 340 include an NPU?
Yes, an XDNA 2 NPU with up to 50 TOPS, plus up to 59 TOPS of combined platform throughput, which clears the bar for Copilot+ features with enough system memory.
Sources and verification
Facts last checked against these sources on . Page last edited on .