AMD Ryzen AI 9 HX PRO 470 socket: FP8
The AMD Ryzen AI 9 HX PRO 470 uses the FP8 package, soldered in a 25 × 40 mm grid array. It is the 12-core Gorgon Point business laptop APU with a 55 TOPS NPU.
- Socket
- FP8
- Launched
- January 2026
- Cores and threads
- 12 and 24
- Default TDP
- 28 W
- Codename
- Gorgon Point
- Segment
- Mobile (soldered)
- Family
- AMD Ryzen AI 9 HX PRO
- Clocks
- 2.0 / 5.2 GHz
AMD Ryzen AI 9 HX PRO 470 specifications
| Cores | 12 (4 Zen 5 and 8 Zen 5c) |
|---|---|
| Threads | 24 |
| Core architecture | Zen 5 and Zen 5c, monolithic Gorgon Point die |
| Clocks | 2.0 GHz base, up to 5.2 GHz maximum boost |
| Cache | 24 MB L3 and 12 MB L2 (36 MB total) |
| Default TDP | 28 W |
| Configurable TDP | 15 to 54 W |
| Manufacturing process | TSMC 4 nm |
| Memory support | DDR5 or soldered LPDDR5X up to 8533 MT/s (at least 16 GB for Copilot+) |
| PCI Express | PCIe Gen4 lanes from the APU for NVMe storage and discrete graphics options |
| Integrated graphics | Radeon 890M, 16 compute units, up to 3100 MHz |
| NPU | XDNA 2, up to 55 TOPS |
| Multiplier | Locked |
| Package | FP8 (BGA, 25 × 40 mm, soldered) |
| Cooler in the box | None (laptop thermal solution by the OEM) |
Motherboard compatibility
AMD Ryzen AI 9 HX PRO 470 needs a motherboard with a FP8 socket. Chipset by chipset data for this codename is not recorded yet. See the FP8 chipset list and the board maker's CPU support list.
FP8 at a glance
| Type | BGA, 1,140 contacts |
|---|---|
| Package size | 25 × 40 mm |
| Introduced | 2023 |
| Memory | DDR5 SODIMM or soldered LPDDR5X depending on board design, up to LPDDR5X-8533 on Gorgon Point, dual channel with ECC and Link-ECC options on embedded P100 boards |
| Cooler mounting holes | Not applicable (soldered) |
What the Ryzen AI 9 HX PRO 470 is
The Ryzen AI 9 HX PRO 470 is the second business flagship of the Gorgon Point mobile range, announced at CES in January 2026. It matches the HX PRO 475 core for core: four Zen 5 plus eight Zen 5c cores for 24 threads at 2.0 GHz base to 5.2 GHz boost, 12 MB of L2 with 24 MB of L3, and the full 16 compute unit Radeon 890M at up to 3100 MHz. The single step down is the NPU at 55 TOPS instead of 60. Default TDP is 28 W in the 15 to 54 W range on TSMC 4 nm.
That 5 TOPS gap is the whole product difference, which makes the 470 the value alternative when local AI throughput does not need the maximum. CPU, graphics, cache, memory support and power figures repeat the flagship exactly, so laptop makers can offer both from one board design. Business qualification with fleet manageability features applies to both.
Gorgon Point refreshes Strix Point silicon with higher clocks and native LPDDR5X-8533, and the PRO line carries it to commercial laptops. Copilot+ certification follows from the NPU with sufficient system memory.
Socket and system compatibility
The chip solders into FP8, the 25 × 40 mm BGA common to Phoenix through Gorgon Point mobile designs. Buyers choose a laptop, not a socket: processor, memory and cooling arrive as one system, and later upgrades mean a new machine. Service depots replace boards, not chips.
Gorgon Point drops into Strix Point board designs with updated firmware, which is why business lines refreshed quickly after CES. OEM systems with PRO silicon rolled out through the first quarter of 2026.
The AMD Ryzen AI 9 HX PRO 475 is the 60 TOPS sibling above, and the 10-core PRO 465 sits below. Desktop efficiency seekers find the same silicon DNA on AM5.
Memory, PCIe and cooling
Memory is DDR5 SODIMM or soldered LPDDR5X to 8533 MT/s, with at least 16 GB needed for Copilot+ features. The fast pool feeds 16 graphics compute units that cover creative work and light gaming without a discrete card. Soldered configurations freeze size at purchase.
Platform I/O brings PCIe Gen4 lanes for NVMe and optional discrete graphics with USB4 and current display outputs. Business ultraportables usually skip the discrete GPU and bank the battery life, while mobile workstations may pair one for heavy 3D.
Cooling spans the 15 to 54 W configurable range around the 28 W default. Thin designs cap sustained power for acoustics, and performance shells sustain more. Boost behavior follows power and thermals on every laptop.
Platform and positioning
AMD positions the 470 for business buyers who want the full 12-core Gorgon die without paying for the top NPU bin. Creators, analysts and engineers get workstation-adjacent graphics with PRO fleet features, and the 55 TOPS NPU still clears Copilot+ comfortably. Compare exact laptops on panel, battery and ports rather than the 5 TOPS gap alone.
Upgrade paths
Soldered laptop silicon cannot be upgraded. Shoppers choose between the 470, the 60 TOPS 475 and smaller PRO SKUs at purchase, and used buyers judge battery, memory and panel. Desktop Gorgon efficiency parts live on AM5.
Frequently asked questions
What socket does the Ryzen AI 9 HX PRO 470 use?
It uses FP8, a 25 × 40 mm grid array. The chip is soldered and laptop upgrades mean replacing the system.
What is the difference between the HX PRO 470 and the HX PRO 475?
The 470 carries a 55 TOPS NPU instead of 60. Cores, clocks, graphics, cache and power are the same.
What memory does the HX PRO 470 use?
DDR5 SODIMM or soldered LPDDR5X to 8533 MT/s, with at least 16 GB for Copilot+ certification.
Does the HX PRO 470 include an NPU?
Yes, an XDNA 2 NPU with up to 55 TOPS for local AI features in business applications.
Sources and verification
- AMD Announces Ryzen AI 400 Series Gorgon Point Mobile Processors (TechPowerUp)
- AMD Ryzen AI 400 series includes the first Copilot desktop CPU (Tom's Hardware)
Facts last checked against these sources on . Page last edited on .