Intel Mobile Pentium III 700 LV socket: Micro-BGA2

What the Mobile Pentium III 700 LV is

The Intel Mobile Pentium III 700 LV is a 700 MHz single-core soldered mobile processor from February 2001. It runs one P6 Coppermine core at 700 MHz with no turbo, so 1 core gives 1 thread. Cache is 256 KB of full-speed L2 with 32 KB of L1 on a 180 nm process. Power is rated near 16.1 W max in a Micro-BGA2 soldered package with 495 balls on a 100 MHz front side bus with a 7x multiplier at 1.1 V to 1.35 V.

Low voltage trims the envelope over standard mobile 700 parts at 23 W, which is why the 700 LV suited thin laptops with small batteries. Intel sold the LV 700 in February 2001 with other low-voltage Coppermine mobile parts. The chip supports MMX, SSE and SpeedStep with battery optimized modes.

A 700 MHz clock with a full cache and a 16 W class envelope suits thin Socket-era predecessor boards with soldered layouts and SDRAM. The low core voltage keeps board heat down. That is why the 700 LV shipped in slim laptops with long battery targets.

Socket and motherboard compatibility

The 700 LV is soldered to Micro-BGA2 boards and cannot be replaced. It fits thin laptop boards with BGA2 solder lands, a 100 MHz bus and a BIOS that lists Mobile Pentium III LV 700. The Socket vs chipset: what decides whether a CPU works guide covers pairing rules.

Thin SDRAM laptops with 440MX paths are the natural match. Boards built for the LV 700 carry the soldered chip from the factory with a board spreader tuned for the 16 W class. Socketed Micro-PGA2 boards cannot accept the ball package.

Memory, PCIe and cooling

Memory is SDRAM through the board chipset at the 100 MHz bus rate, with the exact type set by the laptop board. The soldered CPU has no memory controller. Boards commonly pair PC100 SDRAM with 700 LV layouts.

A 100 MHz front side bus ties the soldered chip to the chipset, while AGP and PCI hang off the chipset. No PCIe lanes originate on the die. Thermal design is board-level with a spreader and chassis path for the 16 W class. There is no socket lever or clip cooler to swap.

Upgrade paths

There is no CPU upgrade path from a soldered 700 LV. The chip cannot move to a faster part. A board or laptop replacement with a newer Micro-BGA2 or Micro-PGA2 system is the only move, with memory and software moving only when the new board supports them.

For socketed planning, a Mobile Pentium III 1000 such as Intel Mobile Pentium III 1000 shows the socketed counterpart line on Socket 495 with replacement allowed. The Micro-BGA2 page lists the soldered Coppermine range. Note: the queue row lists 10 W; this page uses the verified 16.1 W max with typical near 10 W.