Intel Mobile Pentium III 600 LV socket: Micro-BGA2

The Intel Mobile Pentium III 600 LV uses the Micro-BGA2 package. It is a soldered 14.4 W single-core Coppermine mobile part at 600 MHz with 256 KB of L2 cache and it cannot be replaced.

Launched
June 19, 2000
Cores and threads
1 and 1
Base power
14.4 W
Codename
Coppermine
Segment
Mobile (soldered)
Clocks
0.6 GHz

Intel Mobile Pentium III 600 LV specifications

Cores1
Threads1
Core architectureCoppermine (P6)
Clocks600 MHz base, no turbo
Cache32 KB L1, 256 KB full-speed L2
Processor base power (TDP)14.4 W
Manufacturing process180 nm
Memory supportSDRAM through the board chipset
Front side bus100 MHz
PackageMicro-BGA2 (soldered BGA, 495 balls)
MultiplierLocked (6x)
Integrated graphicsNone

Motherboard compatibility

Intel Mobile Pentium III 600 LV needs a motherboard with a Micro-BGA2 socket. Chipset by chipset data for this codename is not recorded yet. See the Micro-BGA2 chipset list and the board maker's CPU support list.

Micro-BGA2 at a glance

TypeBGA, 495 contacts
Package size31 × 27 mm
IntroducedOctober 1999
MemorySDRAM through the board chipset (soldered processor)
Cooler mounting holesNot applicable (soldered)

Read the full Micro-BGA2 socket guide

What the Mobile Pentium III 600 LV is

The Intel Mobile Pentium III 600 LV is a 600 MHz single-core soldered mobile processor from June 2000. It runs one P6 Coppermine core at 600 MHz with no turbo, so 1 core gives 1 thread. Cache is 256 KB of full-speed L2 with 32 KB of L1 on a 180 nm process. Power is rated at 14.4 W max in a Micro-BGA2 soldered package with 495 balls on a 100 MHz front side bus with a 6x multiplier at 1.1 to 1.35 V.

Low voltage at 1.1 V battery mode trims the envelope over standard 600 parts at 20 W, which is why the 600 LV suited thin X-series laptops. Intel sold the LV 600 in June 2000. The chip supports MMX, SSE and SpeedStep.

A 600 MHz clock with a 14 W class envelope suits thin soldered layouts with SDRAM. The 6x ratio is standard for 100 MHz mobile boards. That is why the 600 LV shipped in slim ThinkPads.

Socket and motherboard compatibility

The 600 LV is soldered to Micro-BGA2 boards and cannot be replaced. It fits thin boards with BGA2 solder lands, a 100 MHz bus and a BIOS that lists Mobile Pentium III LV 600. The Socket vs chipset: what decides whether a CPU works guide covers pairing rules.

Thin SDRAM boards are the natural match. Boards built for the 600 LV carry the soldered chip with a board spreader for the 14 W class.

Memory, PCIe and cooling

Memory is SDRAM through the board chipset at the 100 MHz bus rate, set by the board. The soldered CPU has no memory controller. Thin boards commonly pair PC100 SDRAM.

A 100 MHz front side bus ties the soldered chip to the chipset, while expansion hangs off the chipset. No PCIe lanes originate on the die. Thermal design is board-level with a spreader.

Upgrade paths

There is no CPU upgrade path from a soldered 600 LV. The chip cannot move to a faster part. A board or system replacement is the only move.

For socketed planning, a Mobile Pentium III 600 such as Intel Mobile Pentium III 600 shows the socketed counterpart on Socket 495. The Micro-BGA2 page lists the soldered range. Note: the queue row lists 9 W typical; this page uses the verified 14.4 W max.

Frequently asked questions

What socket does the Mobile Pentium III 600 LV use?

Micro-BGA2 as a soldered 495-ball package. It is a 14.4 W low-voltage Coppermine mobile part at 600 MHz and it cannot be replaced.

Can the 600 LV be replaced?

No. The balls are soldered to the board.

What memory does the 600 LV use?

SDRAM through the board chipset.

What is the upgrade path from the 600 LV?

There is none at the CPU level.

Sources and verification

  1. Intel Mobile Pentium III LV 600 14.4W ThinkWiki
  2. Low Voltage Mobile 600MHz Jun 2000 (HandWiki PIII)
  3. Mobile Intel Processor Package Types BGA2 (Intel)

Facts last checked against these sources on . Page last edited on .