Micro-BGA2 socket: CPUs, chipsets and cooler fit
Micro-BGA2 is the Intel soldered ball grid array package that carried low-voltage Mobile Pentium III Coppermine processors. It uses 495 solder balls in a 31 mm by 27 mm area array with a 100 MT/s bus.
Quick facts
| Maker | Intel |
|---|---|
| Package type | BGA |
| Contacts | 495 |
| Package size | 31 × 27 mm |
| Introduced | October 1999 |
| Status | Legacy |
| Memory | SDRAM through the board chipset (soldered processor) |
| PCIe from the CPU | Front side bus 100 MT/s to the chipset; expansion hangs off the chipset |
| Cooler mounting holes | Not applicable (soldered) |
| Replaces | MMC-2 |
| Replaced by | Micro-FCBGA |
Overview
The package served thin laptops and applied-computing boards where a socket has no room. Chips are fixed to the board at the factory and the processor cannot be replaced or upgraded.
Processor generations
| Codename | Marketing name | Years | Notes |
|---|---|---|---|
| Coppermine | Mobile Pentium III Coppermine LV and ULV | 2000 to 2001 | 180 nm soldered single cores with 256 KB of L2 cache on a 100 MT/s bus, including the 700 MHz LV part at 16.1 W and the 500 MHz ULV part at 8.1 W. |
Who Micro-BGA2 serves
Micro-BGA2 targets thin laptops and embedded boards with soldered low-power chips. Boards with 440MX and 815E chipsets pair the package with SDRAM in tight chassis. The soldered design removes the socket height for slimmer lids.
Memory and cooling
Memory is SDRAM through the board chipset with no DIMM choice at the CPU level. Thermal design is board-level with spreaders tuned for 8 W to 16 W envelopes. There is no CPU upgrade path; board or system replacement is the only move.
CPUs on Micro-BGA2
5 processor pages in the database, newest first.
| Processor | Cores / threads | Base / boost | TDP | Launched |
|---|---|---|---|---|
| Intel Mobile Pentium III 700 LV | 1 / 1 | 0.7 GHz | 16 W | Feb 2001 |
| Intel Mobile Pentium III 500 ULV | 1 / 1 | 0.5 GHz | 8 W | Jan 2001 |
| Intel Mobile Pentium III 600 LV | 1 / 1 | 0.6 GHz | 14.4 W | Jun 2000 |
| Intel Mobile Pentium III 500 LV | 1 / 1 | 0.5 GHz | n/a | Jan 2000 |
| Intel Mobile Pentium III 400 | 1 / 1 | 0.4 GHz | 10.1 W | Oct 1999 |
Frequently asked questions
Which processors fit Micro-BGA2?
Coppermine Mobile Pentium III low-voltage single cores with 256 KB of L2 cache, including the 700 MHz LV part at 16.1 W from February 2001 and the 500 MHz ULV part at 8.1 W from January 2001 covered here. Both are soldered and cannot be replaced.
Is Micro-BGA2 the same as Socket 495?
No. Micro-BGA2 uses 495 solder balls fixed to the board, while Socket 495 uses 495 pins with a removable chip. A soldered chip cannot move to a socket board.
What memory does Micro-BGA2 use?
SDRAM through the board chipset at the 100 MT/s bus rate. The board sets the exact type.
How many PCIe lanes does Micro-BGA2 provide?
No lanes come from these CPUs. A 100 MT/s bus ties the soldered chip to the board chipset, while expansion hangs off the chipset.
Sources and verification
- Mobile Intel Processor Package Types (Intel)
- Intel Pentium III Processor Low Power brief (Intel)
- List of Intel Pentium III processors (Wikipedia)
Facts last checked against these sources on . Page last edited on .