Intel Core i3-1125G4 socket: BGA 1449
The Intel Core i3-1125G4 uses the BGA 1449 package, a grid array that solders to the board. It is a 4-core Tiger Lake-U processor at 28 W, and the soldered chip cannot be replaced.
- Socket
- BGA 1449
- Launched
- January 2021
- Cores and threads
- 4 and 8
- Base power
- 28 W
- Codename
- Tiger Lake-U
- Segment
- Mobile (soldered)
- Family
- Intel Core i3
- Clocks
- 2.0 / 3.7 GHz
Intel Core i3-1125G4 specifications
| Cores | 4 |
|---|---|
| Threads | 8 |
| Core architecture | Willow Cove (Tiger Lake-U) |
| Clocks | 2.0 GHz base at 28 W, up to 3.7 GHz turbo |
| Cache | 8 MB Intel Smart Cache (L3) |
| Processor base power (TDP) | 28 W |
| Manufacturing process | 10 nm SuperFin |
| Memory support | DDR4 up to 3200 MT/s or LPDDR4x up to 3733 MT/s, two channels, up to 64 GB |
| PCI Express | PCIe Gen4 from the CPU plus Thunderbolt 4 through the board |
| Integrated graphics | Intel UHD Graphics for 11th Gen (48 execution units, up to 1.25 GHz) |
| Multiplier | Locked |
| Package | FCBGA1449 soldered, 45.5 × 25 mm |
| Cooler in the box | None (laptop cooling) |
Motherboard compatibility
Intel Core i3-1125G4 needs a motherboard with a BGA 1449 socket. Chipset by chipset data for this codename is not recorded yet. See the BGA 1449 chipset list and the board maker's CPU support list.
BGA 1449 at a glance
| Type | BGA, 1,449 contacts |
|---|---|
| Package size | 45.5 × 25 mm |
| Introduced | January 2021 |
| Memory | DDR4 up to 3200 MT/s or LPDDR4x up to 4267 MT/s, two channels, up to 64 GB |
| Cooler mounting holes | Not applicable (soldered) |
What the Core i3-1125G4 is
The Core i3-1125G4 is a 4-core mobile processor that Intel released in the first quarter of 2021 for thin laptops in the UP3 range. Its Willow Cove cores run a 2.0 GHz base at 28 W to 3.7 GHz turbo with Hyper-Threading for 8 threads. Cache is 8 MB of Intel Smart Cache.
The chip gives thin buyers a lower cost entry to Tiger Lake without dropping to two cores. The 10 nm SuperFin process keeps burst clocks useful for web work and office tasks. Configurable power from 12 W to 28 W lets makers tune the same die for fanless moments or active cooling.
Intel UHD Graphics for 11th Gen processors handle display output, with 48 execution units at 400 MHz base and up to 1.25 GHz boost. The multiplier is locked. The package is FCBGA1449 soldered at 45.5 × 25 mm.
Socket and motherboard compatibility
The 1125G4 fits BGA 1449 only. The chip solders to the laptop board, so there is no socket retention and no later processor upgrade. Board support is fixed to the UP3 platform with DDR4 or LPDDR4x memory soldered nearby.
Because the package is soldered, buyers compare complete thin laptops rather than separate parts. A buyer who needs more graphics in the same power band steps to an i5 UP3 part in a different chassis. The i3 stays in its study and office role for its whole service life.
The How to find your CPU socket type guide explains how to confirm a soldered package from the system specifications. For service, a failed processor means a board replacement through the laptop maker.
Memory, PCIe and cooling
The memory controller supports DDR4 up to 3200 MT/s or LPDDR4x up to 3733 MT/s in two channels, up to 64 GB. Thin study laptops often shipped with 8 GB LPDDR4x for battery life, since soldered memory near the die saves power. Dual channel remains important for graphics speed.
The CPU supplies PCIe Gen4 lanes for storage through the board, with Thunderbolt 4 on many designs for docks and external drives. The board layout decides lane use, so the laptop specifications state which SSD slots run at full speed. Integrated graphics drive the internal panel and external monitors.
Cooling is part of the thin chassis, not a boxed cooler. The 28 W base with turbo headroom needs a single fan and slim heat pipe. Lower 12 W settings trade sustained clocks for silence. No LGA cooler fits, and the CPU cooler compatibility by socket guide covers why desktop brackets do not apply.
Upgrade paths
Against the Intel Core i5-11300H, the 1125G4 trades cache and graphics units for lower cost. The H35 i5 part suits thin gaming with faster graphics, while this i3 part suits study and office work with lighter loads. Both share memory limits and soldered boards.
There is no CPU upgrade path on the soldered board. The next step is a full laptop replacement, either with another UP3 system of higher tier or a move to a later platform. Storage moves with the drive when the chassis allows it, while memory stays as ordered.
For used buyers, the i3 UP3 makes sense for low cost thin machines with four cores. When graphics speed matters more, the Iris Xe i5 parts give more execution units in the same socket family.
Frequently asked questions
What socket does the Intel Core i3-1125G4 use?
It uses BGA 1449, a soldered grid array. The chip cannot be replaced.
How many cores does the Intel Core i3-1125G4 have?
4 cores with 8 threads, 2.0 GHz base at 28 W and up to 3.7 GHz turbo, with 8 MB of Intel Smart Cache.
What memory does the Intel Core i3-1125G4 support?
DDR4 up to 3200 MT/s or LPDDR4x up to 3733 MT/s in two channels, up to 64 GB. Memory solders to the board.
What graphics does the Intel Core i3-1125G4 include?
Intel UHD Graphics with 48 execution units up to 1.25 GHz for study panels and external displays.
What is the TDP of the Intel Core i3-1125G4?
28 W configurable up with a 12 W down option. The thin chassis cooler handles turbo bursts above the base.
Sources and verification
- Intel Core i3-1125G4 specifications (Intel)
- Intel Core i3-1125G4 Processor Benchmarks and Specs (Notebookcheck)
Facts last checked against these sources on . Page last edited on .