Intel Core i7-1180G7 socket: BGA 1598
The Intel Core i7-1180G7 uses the BGA 1598 package, a grid array that solders to the board. It is a 4-core Tiger Lake-U processor at 15 W, and the soldered chip cannot be replaced.
- Socket
- BGA 1598
- Launched
- January 2021
- Cores and threads
- 4 and 8
- Base power
- 15 W
- Codename
- Tiger Lake-U
- Segment
- Mobile (soldered)
- Family
- Intel Core i7
- Clocks
- 2.2 / 4.6 GHz
Intel Core i7-1180G7 specifications
| Cores | 4 |
|---|---|
| Threads | 8 |
| Core architecture | Willow Cove (Tiger Lake-U) |
| Clocks | 2.2 GHz base at 15 W, up to 4.6 GHz turbo |
| Cache | 12 MB Intel Smart Cache (L3) |
| Processor base power (TDP) | 15 W |
| Manufacturing process | 10 nm SuperFin |
| Memory support | LPDDR4x up to 4267 MT/s, two channels, up to 32 GB |
| PCI Express | PCIe Gen4 from the CPU plus Thunderbolt 4 through the board |
| Integrated graphics | Intel Iris Xe Graphics (96 execution units, up to 1.10 GHz) |
| Multiplier | Locked |
| Package | FCBGA1598 soldered, 26.5 × 18.5 mm |
| Cooler in the box | None (laptop cooling) |
Motherboard compatibility
Intel Core i7-1180G7 needs a motherboard with a BGA 1598 socket. Chipset by chipset data for this codename is not recorded yet. See the BGA 1598 chipset list and the board maker's CPU support list.
BGA 1598 at a glance
| Type | BGA, 1,598 contacts |
|---|---|
| Package size | n/a |
| Introduced | January 2021 |
| Memory | LPDDR4x up to 4267 MT/s, two channels, up to 32 GB |
| Cooler mounting holes | Not applicable (soldered) |
What the Core i7-1180G7 is
The Core i7-1180G7 is a 4-core mobile processor that Intel released in the first quarter of 2021 for small thin laptops in the UP4 range. Its Willow Cove cores run a 2.2 GHz base at 15 W to 4.6 GHz turbo with Hyper-Threading for 8 threads. Cache is 12 MB of Intel Smart Cache.
The chip drops the power envelope below the UP3 stack to fit smaller bodies. Configurable power spans 7 W with a 900 MHz base to 15 W with the full 2.2 GHz base, so makers tune the same die for silent travel modes or active office use. The 10 nm SuperFin process keeps burst clocks close to larger parts for short tasks.
Intel Iris Xe Graphics handle display output, with 96 execution units at 400 MHz base and up to 1.10 GHz boost. The multiplier is locked. The package is FCBGA1598 soldered at 26.5 × 18.5 mm.
Socket and motherboard compatibility
The 1180G7 fits BGA 1598 only. The chip solders to the laptop board, so there is no socket retention and no later processor upgrade. Board support is fixed to the UP4 platform with LPDDR4x memory soldered nearby.
Because the package is soldered, buyers compare complete small laptops rather than separate parts. A buyer who needs higher sustained clocks in a larger body steps to a UP3 part such as the Intel Core i5-1155G7 on BGA 1449. The UP4 part stays in its compact travel role for its whole service life.
The LGA, PGA and BGA: CPU package types explained guide explains why soldered BGA packages list no cooler mounting pattern. For service, a failed processor means a board replacement through the laptop maker.
Memory, PCIe and cooling
The memory controller supports LPDDR4x up to 4267 MT/s in two channels, up to 32 GB. Small travel laptops often shipped with 16 GB LPDDR4x for battery life, since soldered memory near the die saves power in sleep and idle. Capacity is fixed at order time.
The CPU supplies PCIe Gen4 lanes for storage through the board, with Thunderbolt 4 on many designs for docks and external drives. The board layout decides lane use, so the laptop specifications state which SSD slots run at full speed. Integrated Iris Xe graphics drive the internal panel and up to four displays.
Cooling is part of the compact chassis, not a boxed cooler. The 15 W base with turbo headroom needs a single slim fan and heat pipe. Lower 7 W settings trade sustained clocks for silence and surface temperature. No LGA cooler fits, and the CPU cooler compatibility by socket guide covers why desktop brackets do not apply.
Upgrade paths
Against the Intel Core i5-11300H, the 1180G7 trades sustained power for size and battery life. The H35 part holds 35 W with higher all core clocks, while this UP4 part holds 15 W with similar burst speed for short tasks. Both carry soldered memory limits but use different sockets.
There is no CPU upgrade path on the soldered board. The next step is a full laptop replacement, either with another UP4 travel system or a move to a larger UP3 system or a later platform. Storage moves with the drive when the chassis allows it, while memory stays as ordered.
For used buyers, the UP4 i7 makes sense for compact travel machines with full Iris Xe graphics. When sustained creation speed matters, the 28 W UP3 i7 parts give more headroom in the same generation.
Frequently asked questions
What socket does the Intel Core i7-1180G7 use?
It uses BGA 1598, a soldered grid array. The chip cannot be replaced.
How many cores does the Intel Core i7-1180G7 have?
4 cores with 8 threads, 2.2 GHz base at 15 W and up to 4.6 GHz turbo, with 12 MB of Intel Smart Cache.
What memory does the Intel Core i7-1180G7 support?
LPDDR4x up to 4267 MT/s in two channels, up to 32 GB. Memory solders to the board.
What graphics does the Intel Core i7-1180G7 include?
Intel Iris Xe Graphics with 96 execution units up to 1.10 GHz for travel panels and external displays.
What is the TDP of the Intel Core i7-1180G7?
15 W configurable up with a 7 W down option. The compact chassis cooler handles turbo bursts above the base.
Sources and verification
Facts last checked against these sources on . Page last edited on .