Intel Core i3-1115GRE socket: BGA 1449
The Intel Core i3-1115GRE uses the BGA 1449 package, a grid array that solders to the board. It is a 2-core Tiger Lake-U embedded processor at 15 W with ECC memory support, and the soldered chip cannot be replaced.
- Socket
- BGA 1449
- Launched
- September 2020
- Cores and threads
- 2 and 4
- Base power
- 15 W
- Codename
- Tiger Lake-U
- Segment
- Mobile (soldered)
- Family
- Intel Core i3
- Clocks
- 2.2 / 3.9 GHz
Intel Core i3-1115GRE specifications
| Cores | 2 |
|---|---|
| Threads | 4 |
| Core architecture | Willow Cove (Tiger Lake-U) |
| Clocks | 2.2 GHz base at 15 W, up to 3.9 GHz turbo |
| Cache | 6 MB Intel Smart Cache (L3) |
| Processor base power (TDP) | 15 W (12 to 28 W configurable) |
| Manufacturing process | 10 nm SuperFin |
| Memory support | DDR4 up to 3200 MT/s or LPDDR4x up to 3733 MT/s, two channels, up to 64 GB |
| PCI Express | PCIe Gen4 from the CPU plus Thunderbolt 4 through the board |
| Integrated graphics | Intel UHD Graphics for 11th Gen (48 execution units, up to 1.25 GHz) |
| Multiplier | Locked |
| ECC memory | Supported where the board enables it |
| Package | FCBGA1449 soldered, 45.5 × 25 mm |
| Cooler in the box | None (board heatsink) |
Motherboard compatibility
Intel Core i3-1115GRE needs a motherboard with a BGA 1449 socket. Chipset by chipset data for this codename is not recorded yet. See the BGA 1449 chipset list and the board maker's CPU support list.
BGA 1449 at a glance
| Type | BGA, 1,449 contacts |
|---|---|
| Package size | 45.5 × 25 mm |
| Introduced | January 2021 |
| Memory | DDR4 up to 3200 MT/s or LPDDR4x up to 4267 MT/s, two channels, up to 64 GB |
| Cooler mounting holes | Not applicable (soldered) |
What the Core i3-1115GRE is
The Core i3-1115GRE is a 2-core embedded mobile processor that Intel placed in the Tiger Lake-U UP3 range in September 2020 for industrial boards with error correction. Its Willow Cove cores run a 2.2 GHz base at 15 W to 3.9 GHz turbo with Hyper-Threading for 4 threads. Cache is 6 MB of Intel Smart Cache.
The GRE suffix marks an embedded option with ECC memory support for reliable operation. Compute specs match the G4E twin, with the same 10 nm SuperFin process and the same 12 to 28 W configurability. ECC corrects single bit errors in long running kiosks, which matters more than headline turbo in this segment.
Intel UHD Graphics for 11th Gen processors handle display output, with 48 execution units at up to 1.25 GHz. The multiplier is locked. The package is FCBGA1449 soldered at 45.5 × 25 mm for pick and place assembly.
Socket and motherboard compatibility
The 1115GRE fits BGA 1449 only. The chip solders to the embedded board, so there is no socket retention and no later processor upgrade. Board support is fixed to the UP3 embedded platform with ECC DDR4 or LPDDR4x memory.
Because the package is soldered, buyers compare complete boards rather than separate parts. A buyer who needs no error correction takes the Intel Core i3-1115G4E twin with matching clocks at lower board cost. A buyer who needs consumer firmware takes the standard Intel Core i3-1115G4 with higher turbo.
The How to find your CPU socket type guide explains how to confirm a soldered package from the board specifications. For service, a failed processor means a board replacement through the vendor.
Memory, PCIe and cooling
The memory controller supports DDR4 up to 3200 MT/s or LPDDR4x up to 3733 MT/s across two channels to 64 GB with ECC. Embedded vendors validate ECC SO-DIMM or soldered layouts per board for reliable kiosks. There is no DDR5 path on Tiger Lake-U.
The processor exposes PCIe Gen4 from the CPU plus board I/O for storage and networking. Embedded boards favor serial links and Ethernet over docks, with exact splits fixed per design. Cooler mounting uses no desktop pattern. Cooling follows the board thermal design with compact heatsinks sized around 15 W.
ECC joins the CPU as the deciding feature. Boards that route ECC correct single bit errors across months of uptime, which beats slightly higher turbo for unattended operation. Two cores with four threads cover control and display tasks without strain.
Upgrade paths
On the same BGA1449 footprint there is no CPU upgrade path, since the chip is soldered. Owners who need different memory support move to another UP3 board with an E or GRE sibling rather than a chip swap. Storage and memory configuration remain the only practical changes.
Within embedded i3, the twin is the Intel Core i3-1115G4E without ECC at matching clocks. Both share 2 cores, 4 threads and 6 MB cache, so the choice is error correction rather than speed.
Moving past UP3 entirely means a new board on a later embedded platform. For buyers choosing in 2020, the GRE suited ECC industrial designs at 15 W, while the G4E saved board cost without it. The two share Willow Cove and 10 nm SuperFin on the same package.
Frequently asked questions
What socket does the Intel Core i3-1115GRE use?
It uses BGA 1449, a soldered grid array with 1449 balls. The chip cannot be removed, so an upgrade means replacing the board.
What memory does the Core i3-1115GRE support?
DDR4 up to 3200 MT/s or LPDDR4x up to 3733 MT/s in two channels to 64 GB with ECC where the board enables it. Vendors validate ECC layouts per board.
Can the Core i3-1115GRE be overclocked?
No. The multiplier is locked, and embedded firmware does not expose desktop overclocking controls. The 15 W setting suits compact heatsinks.
How does the 1115GRE differ from the 1115G4E?
The GRE adds ECC memory support, while the Intel Core i3-1115G4E lacks it at matching clocks. Both share 2 cores, 4 threads and BGA1449.
Sources and verification
- Tiger Lake embedded UP3 1115GRE ECC (Wikipedia)
- Intel Core i3-1115G4 specifications - UP3 family reference (Intel ARK)
Facts last checked against these sources on . Page last edited on .