Qualcomm Snapdragon X2P-64-100 socket: Qualcomm BGA 2620
The Qualcomm Snapdragon X2P-64-100 uses Qualcomm BGA 2620, soldered with 2,620 balls. It is a 10-core Snapdragon X2 Plus part with a 4.04 GHz boost, and the soldered chip cannot be replaced or upgraded.
- Socket
- Qualcomm BGA 2620
- Launched
- April 2026
- Cores and threads
- 10 and 10
- Base power
- n/a
- Codename
- Glymur
- Segment
- Mobile (soldered)
- Clocks
- 4.0 / 4.04 GHz
Qualcomm Snapdragon X2P-64-100 specifications
| Cores | 10 (6 prime cores plus 4 performance cores) |
|---|---|
| Threads | 10 (one thread per core) |
| Core architecture | 3rd Gen Qualcomm Oryon (Oryon v3), ARM64 compatible |
| Clocks | Prime cores 4.0 GHz multi-core, to 4.04 GHz single-core boost; performance cores to 3.4 GHz |
| Cache | 34 MB total |
| Manufacturing process | 3 nm (TSMC) |
| Memory support | LPDDR5X-9523, 128-bit bus, 152 GB/s, to 128 GB |
| PCI Express | 8 lanes Gen 5 plus 4 lanes Gen 4 |
| Integrated graphics | Adreno X2-45 to 1.7 GHz |
| NPU | Hexagon NPU to 80 TOPS (INT8) |
| Package | Soldered BGA with 2,620 balls (BGA 2620) |
Motherboard compatibility
Qualcomm Snapdragon X2P-64-100 needs a motherboard with a Qualcomm BGA 2620 socket. Chipset by chipset data for this codename is not recorded yet. See the Qualcomm BGA 2620 chipset list and the board maker's CPU support list.
Qualcomm BGA 2620 at a glance
| Type | BGA, 2,620 contacts |
|---|---|
| Package size | n/a |
| Introduced | April 2026 |
| Memory | LPDDR5X up to 9523 MT/s |
| Cooler mounting holes | Not applicable (soldered) |
What the Snapdragon X2P-64-100 is
The Snapdragon X2P-64-100 leads the Snapdragon X2 Plus line with ten third-generation Oryon cores, announced at CES in January 2026 with laptops reaching retail in April 2026. Six prime cores pair with four performance cores for ten cores and ten threads, one thread per ARM core. Prime cores carry a 4.0 GHz multi-core rating with a 4.04 GHz single-core boost while performance cores run at 3.4 GHz, and total cache is 34 MB. That cache matches the twelve-core Elite parts, which helps threaded office and creation work punch above the Plus price tier.
Graphics use the Adreno X2-45 at up to 1.7 GHz, nearly double the clock of the six-core Plus sibling, with DirectX 12.2 Ultimate, Vulkan 1.4 and OpenCL 3.0 support. The Hexagon NPU delivers up to 80 TOPS with a dual micro NPU on the sensing hub, equal to Elite SKUs for Copilot+ tasks. TSMC 3 nm fabrication keeps the ten-core die efficient in thin laptops.
Qualcomm cites 35 percent better single-core and 17 percent faster multi-core performance than the previous ten-core X Plus on Geekbench 6.5, with 29 percent faster graphics in 3DMark Steel Nomad Light. The 64-100 therefore suits buyers who want genuine multitasking headroom and stronger integrated graphics without Elite pricing. Heavy render users still gain from eighteen-core Elite dies, but office power users and students will find ten Oryon cores ample.
Socket and motherboard compatibility
The X2P-64-100 fits Qualcomm BGA 2620 as a soldered, non-serviceable part. Solder balls join the package to board pads at the factory with no socket mechanism between them. Vendors tune cooling and firmware power policy per SKU, so shoppers compare laptop models rather than boards. The LGA, PGA and BGA: CPU package types explained guide explains how sealed BGA mounting differs from desktop sockets.
Chipset compatibility questions from the desktop world do not map onto this SoC. CPU, GPU, NPU, memory controller and I/O share one die, so port selection, display support, wireless and storage follow the laptop design. Confirm RAM and SSD details on the exact configuration sheet, since machines with the same chip can ship different equipment.
The service manual of the laptop records what stays reachable. SSD and wireless modules are sometimes exchangeable while processor and memory never are. Checking before purchase avoids wrong assumptions about later maintenance.
Memory, PCIe and cooling
Memory support is LPDDR5X at 9523 MT/s across a 128-bit bus, giving 152 GB/s of shared bandwidth with up to 128 GB of capacity. CPU threads, the 1.7 GHz Adreno GPU and the 80 TOPS NPU all draw from this pool, so generous capacity flatters both creation work and local AI models. Soldered memory makes the factory configuration final.
PCI Express gives 8 lanes of Gen 5 plus 4 lanes of Gen 4. Laptop designs spend these on NVMe SSD storage over dual Gen 5 links with UFS 4.0 and SD support, plus DisplayPort outputs driving up to three 4K displays at 144 Hz. Three USB4 Type-C ports at 40 Gbps complete the typical I/O picture.
Thermal design belongs to the chassis with no mounting pattern and no boxed cooler. Qualcomm gives no chip-level TDP for this SKU while system designs span roughly 18 to 28 W, so sustained behavior must come from vendor ratings and reviews. Ten cores at modest clocks suit quiet thin laptops that still multitask with ease.
Upgrade paths
No processor upgrade path exists on Qualcomm BGA 2620. The soldered X2P-64-100 cannot be removed, and faster chips require different boards in different laptops. Future performance gains arrive through full system replacement with data migrated over. Regular backups simplify that eventual step.
Purchase decisions should weigh RAM size, storage, display, battery and price rather than hypothetical swaps. The 64-100 sits at the top of the Plus line, so its premium over the 42-100 buys four extra cores, more cache and a far faster GPU. The LGA, PGA and BGA: CPU package types explained guide outlines why sealed laptops make this tradeoff.
For longevity, order memory above present needs, verify SSD slots for future drive upgrades, and keep vendor firmware current. A well-configured ten-core laptop remains capable for years even though its processor never changes.
Frequently asked questions
What socket does the Snapdragon X2P-64-100 use?
Qualcomm BGA 2620, a soldered ball grid array with 2,620 contacts. The processor ships permanently attached to its board.
What are the core counts and clock speeds of the X2P-64-100?
Six prime cores at 4.0 GHz multi-core with a 4.04 GHz single-core boost, plus four performance cores at 3.4 GHz. Total cache is 34 MB.
How does the X2P-64-100 differ from the X2P-42-100?
Six prime cores only, 22 MB of cache and a 0.9 GHz GPU on the 42-100, against six prime plus four performance cores, 34 MB of cache and a 1.7 GHz GPU on the 64-100.
Can the X2P-64-100 be upgraded later?
No. The BGA chip is soldered, so more performance later requires a new laptop rather than a chip exchange.
Sources and verification
- Snapdragon X2 Plus Product Brief (Qualcomm)
- Qualcomm Snapdragon X2 Plus X2P-64-100 Processor Benchmarks and Specs (Notebookcheck)
- Qualcomm Snapdragon X2P-64-100 Specs (TechPowerUp)
Facts last checked against these sources on . Page last edited on .