Qualcomm Snapdragon X2E-78-100 socket: Qualcomm BGA 2620
The Qualcomm Snapdragon X2E-78-100 uses Qualcomm BGA 2620, soldered with 2,620 balls. It is a 12-core Snapdragon X2 Elite part running to 4.0 GHz, and the soldered chip cannot be replaced or upgraded.
- Socket
- Qualcomm BGA 2620
- Launched
- April 2026
- Cores and threads
- 12 and 12
- Base power
- n/a
- Codename
- Glymur
- Segment
- Mobile (soldered)
- Clocks
- 4.0 / 4.0 GHz
Qualcomm Snapdragon X2E-78-100 specifications
| Cores | 12 (6 prime cores plus 6 performance cores) |
|---|---|
| Threads | 12 (one thread per core) |
| Core architecture | 3rd Gen Qualcomm Oryon (Oryon v3), ARM64 compatible |
| Clocks | Prime cores 4.0 GHz multi-core, to 4.0 GHz single and dual-core; performance cores to 3.4 GHz |
| Cache | 34 MB total |
| Manufacturing process | 3 nm (TSMC) |
| Memory support | LPDDR5X-9523, 128-bit bus, 152 GB/s, to 128 GB |
| PCI Express | 8 lanes Gen 5 plus 4 lanes Gen 4 |
| Integrated graphics | Adreno X2-85 to 1.35 GHz |
| NPU | Hexagon NPU to 80 TOPS (INT8) |
| Package | Soldered BGA with 2,620 balls (BGA 2620) |
Motherboard compatibility
Qualcomm Snapdragon X2E-78-100 needs a motherboard with a Qualcomm BGA 2620 socket. Chipset by chipset data for this codename is not recorded yet. See the Qualcomm BGA 2620 chipset list and the board maker's CPU support list.
Qualcomm BGA 2620 at a glance
| Type | BGA, 2,620 contacts |
|---|---|
| Package size | n/a |
| Introduced | April 2026 |
| Memory | LPDDR5X up to 9523 MT/s |
| Cooler mounting holes | Not applicable (soldered) |
What the Snapdragon X2E-78-100 is
The Snapdragon X2E-78-100 is the most modest twelve-core model of the Snapdragon X2 Elite line, announced in September 2025 with laptops reaching retail in April 2026. It combines six third-generation Oryon prime cores with six performance cores for twelve cores and twelve threads, one thread per ARM core. Prime cores run at a flat 4.0 GHz multi-core rating with a 4.0 GHz single and dual-core ceiling, so this SKU skips the higher boost tables of its siblings. Performance cores hold 3.4 GHz and total cache is 34 MB.
Graphics use the Adreno X2-85 at up to 1.35 GHz, the lowest GPU clock in the Elite range, which still covers office applications, video playback and external high-resolution displays. The Hexagon NPU delivers up to 80 TOPS for local Copilot+ AI features. TSMC 3 nm fabrication keeps power draw modest, which suits fanless-leaning thin designs and long-battery school or office laptops.
The 78-100 trades peak clocks for cost and efficiency while keeping the full X2 platform: fast LPDDR5X, modern PCIe storage, USB4 and Wi-Fi 7 designs. Single-threaded bursts trail the 4.7 GHz SKUs, but sustained office throughput remains strong across twelve cores. Buyers who browse, write, present and stream will find it capable, while frequent render users should look higher in the range.
Socket and motherboard compatibility
The X2E-78-100 fits Qualcomm BGA 2620 with a permanent soldered joint. Balls under the package fuse to board pads during manufacture, leaving no socket to open later. Laptop vendors set cooling and power policy for this exact part, so shoppers compare finished machines. The LGA, PGA and BGA: CPU package types explained guide explains the sealed-package approach used across modern thin laptops.
Chipset matching as desktop buyers know it does not occur here. Compute, graphics, AI, memory and I/O share the SoC die, so capabilities follow the vendor board: ports, screens, wireless and drive slots. Verify memory size and storage on the precise configuration, since these vary between laptops carrying the same processor.
Service expectations come from the laptop manual. Some designs permit SSD or wireless exchange while the processor and memory remain sealed. Reading the manual before purchase clarifies which repairs stay possible.
Memory, PCIe and cooling
Memory support is LPDDR5X at 9523 MT/s over a 128-bit bus, giving 152 GB/s of shared bandwidth with up to 128 GB of capacity. That pool serves the CPU, the X2-85 graphics and the 80 TOPS NPU together. Memory ships soldered, so the size ordered at purchase is the size kept for the life of the laptop.
PCI Express provides 8 lanes of Gen 5 plus 4 lanes of Gen 4 on twelve-core X2 parts. Vendors use these lanes for NVMe SSD slots with UFS 4.0 and SD Express support, plus DisplayPort 1.4 outputs for external monitors. Reference I/O includes three USB4 ports at 40 Gbps, with final layouts decided per laptop.
Cooling is entirely a chassis matter with no mounting pattern and no boxed cooler. Qualcomm publishes no TDP for this SKU, so thermal behavior must be taken from vendor figures and reviews of the exact model. Modest clocks let thin chassis run quietly, which matches the efficiency brief of this part.
Upgrade paths
No processor upgrade exists on Qualcomm BGA 2620. The soldered X2E-78-100 cannot be removed, and faster X2 SKUs live in different laptops with their own boards. A later performance step means replacing the whole machine and moving data across. Standard backups and portable storage keep that move simple.
At buying time the useful comparisons are memory, display, battery life, weight and price rather than future chip options. The 78-100 often anchors the lowest X2 Elite laptop prices, so savings can fund more RAM or a better screen. The LGA, PGA and BGA: CPU package types explained guide gives context on why sealed designs accept fixed processors.
For longevity, buy enough RAM for several years of browser and application growth, confirm SSD arrangements for later drive swaps, and keep vendor firmware updated. A thoughtfully chosen efficiency laptop remains pleasant long after its processor generation passes.
Frequently asked questions
What socket does the Snapdragon X2E-78-100 use?
Qualcomm BGA 2620, a soldered ball grid array with 2,620 contacts. The processor cannot be removed from its board.
What are the core counts and clock speeds of the X2E-78-100?
Six prime cores at 4.0 GHz multi-core with a 4.0 GHz single and dual-core ceiling, plus six performance cores at 3.4 GHz. Total cache is 34 MB.
What memory does the X2E-78-100 support?
LPDDR5X at 9523 MT/s on a 128-bit bus with 152 GB/s of bandwidth and up to 128 GB of capacity.
Can the X2E-78-100 be upgraded later?
No. The BGA package is soldered, so a faster chip means purchasing a different laptop.
Sources and verification
- Snapdragon X2 Elite Product Brief (Qualcomm)
- Qualcomm Snapdragon X2 Elite X2E-78-100 Processor Benchmarks and Specs (Notebookcheck)
- Qualcomm Snapdragon X2E-78-100 Specs (TechPowerUp)
Facts last checked against these sources on . Page last edited on .