Qualcomm Snapdragon X2P-42-100 socket: Qualcomm BGA 2620
The Qualcomm Snapdragon X2P-42-100 uses Qualcomm BGA 2620, soldered with 2,620 balls. It is a 6-core Snapdragon X2 Plus part with a 4.04 GHz boost, and the soldered chip cannot be replaced or upgraded.
- Socket
- Qualcomm BGA 2620
- Launched
- April 2026
- Cores and threads
- 6 and 6
- Base power
- n/a
- Codename
- Glymur
- Segment
- Mobile (soldered)
- Clocks
- 4.0 / 4.04 GHz
Qualcomm Snapdragon X2P-42-100 specifications
| Cores | 6 (6 prime cores, no performance cores) |
|---|---|
| Threads | 6 (one thread per core) |
| Core architecture | 3rd Gen Qualcomm Oryon (Oryon v3), ARM64 compatible |
| Clocks | Prime cores 4.0 GHz multi-core, to 4.04 GHz single-core boost |
| Cache | 22 MB total |
| Manufacturing process | 3 nm (TSMC) |
| Memory support | LPDDR5X-9523, 128-bit bus, 152 GB/s, to 128 GB |
| PCI Express | 8 lanes Gen 5 plus 4 lanes Gen 4 |
| Integrated graphics | Adreno X2-45 to 0.9 GHz |
| NPU | Hexagon NPU to 80 TOPS (INT8) |
| Package | Soldered BGA with 2,620 balls (BGA 2620) |
Motherboard compatibility
Qualcomm Snapdragon X2P-42-100 needs a motherboard with a Qualcomm BGA 2620 socket. Chipset by chipset data for this codename is not recorded yet. See the Qualcomm BGA 2620 chipset list and the board maker's CPU support list.
Qualcomm BGA 2620 at a glance
| Type | BGA, 2,620 contacts |
|---|---|
| Package size | n/a |
| Introduced | April 2026 |
| Memory | LPDDR5X up to 9523 MT/s |
| Cooler mounting holes | Not applicable (soldered) |
What the Snapdragon X2P-42-100 is
The Snapdragon X2P-42-100 is the six-core entry of the Snapdragon X2 Plus line, announced at CES in January 2026 with laptops reaching retail in April 2026. It carries six third-generation Oryon prime cores and no performance cores, giving six cores and six threads with one thread per ARM core. The multi-core rating is 4.0 GHz with a 4.04 GHz single-core boost, and total cache is 22 MB. Qualcomm positions the Plus line for thin low-power Copilot+ laptops where battery life and price matter more than render throughput.
Graphics use the Adreno X2-45 at up to 0.9 GHz, the gentlest GPU clock in the X2 family, aimed at office applications, video and everyday displays rather than heavy 3D work. The Hexagon NPU still delivers up to 80 TOPS with a dual micro NPU on the sensing hub, matching the Elite parts for local AI features. TSMC 3 nm fabrication underpins the efficiency story, and Notebookcheck records a configurable TDP window around 10 to 22 W at the system level.
Against its ten-core Plus sibling the 42-100 gives up four performance cores, 12 MB of cache and much GPU clock speed while keeping the same NPU, memory and I/O. Qualcomm cites gains of 35 percent single-core and 10 percent multi-core over the previous eight-core X Plus part, plus 39 percent faster graphics and 78 percent faster NPU. Students and office buyers who live in browsers and documents gain affordable Copilot+ access, while creators should step up to more cores.
Socket and motherboard compatibility
The X2P-42-100 fits Qualcomm BGA 2620 as a permanent soldered resident. The package connects through solder balls straight to board pads, with no socket hardware involved. Laptop vendors validate the heatsink and power limits for this SKU, so the purchase decision is a laptop model, not a board. The LGA, PGA and BGA: CPU package types explained guide explains the sealed approach common to thin ARM laptops.
Desktop chipset logic does not transfer to this platform. With compute, graphics, NPU, memory and I/O integrated, the machine capabilities follow vendor design choices around ports, displays, wireless and storage. Check the exact configuration for RAM size, SSD capacity and modem support, since these differ between laptops sharing the same chip.
Service planning belongs to the laptop manual. SSD or wireless modules may be reachable on some designs while the processor and memory stay sealed. Confirming this before ordering sets the right expectations for repairs and later drive changes.
Memory, PCIe and cooling
Memory support is LPDDR5X at 9523 MT/s on a 128-bit bus, giving 152 GB/s of shared bandwidth with up to 128 GB of capacity. CPU, GPU and the 80 TOPS NPU all draw from one pool, so even this entry part handles local AI models alongside office work. Memory is soldered in shipping laptops, fixing the ordered capacity for good.
PCI Express provides 8 lanes of Gen 5 plus 4 lanes of Gen 4. Vendors route these to NVMe storage over dual Gen 5 links with UFS 4.0 and SD support, plus DisplayPort outputs for up to three 4K displays at 144 Hz. Three USB4 Type-C ports at 40 Gbps round out typical I/O, with exact layouts per vendor.
Cooling follows the thin chassis brief with no mounting pattern and no boxed cooler. Qualcomm publishes no TDP for this SKU at the chip level while system designs span roughly 10 to 22 W, so fan behavior and sustained clocks come from vendor data and reviews. Modest clocks and six cores let slim fan-quiet designs stay comfortable under office loads.
Upgrade paths
There is no processor upgrade on Qualcomm BGA 2620. The soldered X2P-42-100 cannot be removed, and faster Plus or Elite chips ship in different laptops. A future step up means replacing the system and migrating files. Cloud sync and external drives keep that eventual move painless.
Buying comparisons should focus on RAM, storage, display, battery and price rather than chip swaps. The 42-100 typically anchors the lowest X2 laptop prices, so the saving can fund more memory or a better panel. The LGA, PGA and BGA: CPU package types explained guide gives background on sealed-design tradeoffs.
For a long service life, order RAM for several years of use, verify SSD expandability for later drive exchanges, and apply vendor firmware updates. An honestly specified entry laptop remains a pleasant daily machine long after its launch season.
Frequently asked questions
What socket does the Snapdragon X2P-42-100 use?
Qualcomm BGA 2620, a soldered ball grid array with 2,620 contacts. The chip is fixed to the board at manufacture.
What are the core counts and clock speeds of the X2P-42-100?
Six third-generation Oryon prime cores with a 4.0 GHz multi-core rating and a 4.04 GHz single-core boost, with no performance cores. Total cache is 22 MB.
What memory does the X2P-42-100 support?
LPDDR5X at 9523 MT/s on a 128-bit bus with 152 GB/s of bandwidth and up to 128 GB of capacity.
Can the X2P-42-100 be upgraded later?
No. The soldered BGA package cannot be swapped, so a faster processor means a different laptop.
Sources and verification
- Snapdragon X2 Plus Product Brief (Qualcomm)
- Qualcomm Snapdragon X2 Plus X2P-42-100 Processor Benchmarks and Specs (Notebookcheck)
- Snapdragon X2 Plus 6-core and 10-core processors target low-power Windows Copilot+ PCs (CNX Software)
Facts last checked against these sources on . Page last edited on .