Intel Core Ultra 7 270HX Plus socket: BGA 2114
The Intel Core Ultra 7 270HX Plus uses the BGA 2114 socket. It is a 20 core soldered Arrow Lake-HX Refresh processor for performance laptops, and the chip cannot be replaced without replacing the board.
- Socket
- BGA 2114
- Launched
- March 2026
- Cores and threads
- 20 and 20
- Base power
- 55 W
- Codename
- Arrow Lake-HX Refresh
- Segment
- Mobile (soldered)
- Family
- Intel Core Ultra 7
- Clocks
- 2.4 / 5.3 GHz
Intel Core Ultra 7 270HX Plus specifications
| Cores | 20 (8 Performance-cores and 12 Efficient-cores) |
|---|---|
| Threads | 20 (no Hyper-Threading) |
| Core architecture | Lion Cove (P-cores) and Skymont (E-cores) |
| P-core clocks | 2.4 GHz base, up to 5.3 GHz boost |
| E-core clocks | 1.8 GHz base, up to 4.7 GHz boost |
| Cache | 30 MB Intel Smart Cache (L3) and 36 MB total L2 |
| Processor base power (TDP) | 55 W |
| Maximum turbo power | 160 W |
| Manufacturing process | TSMC N3B (compute tile) |
| Memory support | DDR5 up to 6400 MT/s, two channels, up to 256 GB |
| PCI Express | Up to 24 lanes (PCIe 5.0 and 4.0): 1x16 plus 2x4, 2x8 plus 2x4, 1x8 plus 4x4 |
| Integrated graphics | Intel Graphics, 4 Xe-cores, 300 MHz to 1.9 GHz |
| NPU | Intel AI Boost, 13 TOPS |
| ECC memory | No |
| Package | FCBGA2114 (soldered) |
Motherboard compatibility
Intel Core Ultra 7 270HX Plus needs a motherboard with a BGA 2114 socket. Chipset by chipset data for this codename is not recorded yet. See the BGA 2114 chipset list and the board maker's CPU support list.
BGA 2114 at a glance
| Type | BGA, 2,114 contacts |
|---|---|
| Package size | 30.2 × 37.5 mm |
| Introduced | January 2025 |
| Memory | DDR5 (speeds and capacity per laptop design) |
| Cooler mounting holes | Not applicable (soldered) |
What the Core Ultra 7 270HX Plus is
The Core Ultra 7 270HX Plus arrived in March 2026 as part of the Core Ultra 200HX Plus family under the codename Arrow Lake-HX Refresh. Intel builds it with 8 Performance-cores and 12 Efficient-cores for 20 cores and, with no Hyper-Threading, 20 threads. Performance-cores run from 2.4 GHz base to 5.3 GHz boost, while Efficient-cores run from 1.8 GHz base to 4.7 GHz boost. The 30 MB Intel Smart Cache is shared across the cores with 36 MB of total L2. Lion Cove powers the Performance-cores and Skymont powers the Efficient-cores.
The chip is rated at 55 W processor base power with maximum turbo power at 160 W and 45 W minimum assured power. The compute tile uses TSMC N3B. An Intel AI Boost NPU with 13 TOPS covers local AI features within 33 TOPS total platform throughput. Integrated Intel Graphics with 4 Xe-cores run from 300 MHz to 1.9 GHz for display output and media work in laptops that also carry a discrete GPU.
The Plus refresh keeps the same soldered package and power envelope while lifting the die to die link by up to 900 MHz against the prior HX parts. That faster CPU to memory controller link lowers latency in games and creation work. Intel announced the series on March 17, 2026 with systems from laptop partners through the year. The 270HX Plus sits below the 24 core 290HX Plus in the same family for buyers who want high thread count without the top bin.
Socket and motherboard compatibility
The Core Ultra 7 270HX Plus is soldered to the BGA 2114 package and cannot be replaced. The 2,114 ball array measures 37.5 × 30.2 mm and mounts directly to the laptop board at the factory. There is no retail motherboard choice and no socketed upgrade step.
Boards are designed around each laptop chassis with memory and power delivery fixed at design time. The socket file lists no desktop chipset groups, so compatibility follows the system vendor list for each model. Desktop builders who want a replaceable part use LGA 1851 instead, where Arrow Lake Refresh processors sit in a land grid array.
BIOS and firmware come from the laptop maker, not a retail board vendor. Buyers should check the vendor page for memory options and Thunderbolt 5 or Wi-Fi 7 fit before purchase. The CPU cooler compatibility by socket explains why soldered mobile packages have no aftermarket mounting pattern.
Memory, PCIe and cooling
The memory controller supports DDR5 up to 6400 MT/s in two channels up to 256 GB. ECC memory is not supported. Laptop vendors choose SODIMM or soldered layouts and set the final speed and capacity, so the same chip can ship with different memory totals.
For expansion the chip provides up to 24 PCI Express lanes across PCI Express 5.0 and 4.0. Boards split them in patterns such as 1x16 plus 2x4, 2x8 plus 2x4, or 1x8 plus 4x4 for discrete graphics and fast storage. The chipset link uses DMI 4.0 with 8 lanes, and Thunderbolt 4 is supported for docks and external devices.
Cooling uses the laptop heatsink sized for 55 W base power with headroom to 160 W turbo. There is no boxed cooler and no retail mounting choice. System fans and heat pipes are tuned for sustained loads, and performance follows the thermal design of each chassis.
Upgrade paths
There is no CPU upgrade path inside BGA 2114. When more performance is needed the path is a board replacement or a new laptop. The processor, memory layout, and heatsink stay together as one system.
Buyers choosing at purchase time can pick the 24 core 290HX Plus in the same package for more threads, or stay with the 270HX Plus for lower cost. Moving to a desktop platform needs a new board and DDR5 memory on LGA 1851, since neither the package nor the cooler carries over.
Coming from an older laptop the move needs a full system change. Owners of LGA 1700 desktops keep a replaceable socket, while BGA 2114 buyers trade that flexibility for density and power in a mobile chassis.
Frequently asked questions
What socket does the Intel Core Ultra 7 270HX Plus use?
The Intel Core Ultra 7 270HX Plus uses BGA 2114. It is a soldered mobile package with 2,114 balls, so the processor is fixed to the laptop board at the factory.
Can the 270HX Plus be upgraded to a faster CPU?
No. The chip is soldered and cannot be replaced. A performance move means a board replacement or a new laptop, often with a new heatsink and memory layout.
What memory does the 270HX Plus support?
DDR5 up to 6400 MT/s in two channels up to 256 GB. ECC is not supported. The laptop vendor sets the final SODIMM or soldered layout, speed, and capacity.
Does the 270HX Plus have integrated graphics and an NPU?
Yes. Integrated Intel Graphics with 4 Xe-cores up to 1.9 GHz drive the laptop display and media work. Performance laptops pair it with a discrete GPU for games and creation apps, and an Intel AI Boost NPU with 13 TOPS covers local AI features.
Sources and verification
- Intel Core Ultra 7 processor 270HX Plus specifications (Intel ARK)
- Intel Core Ultra 7 270HX Plus Processor Benchmarks and Specs (Notebookcheck)
- Intel Launches New Core Ultra 200HX Plus Series Mobile Processors (Intel Newsroom)
Facts last checked against these sources on . Page last edited on .