Intel Core Ultra 9 275HX socket: BGA 2114

What the Core Ultra 9 275HX is

The Intel Core Ultra 9 275HX is the second-bin 24-core member of the Arrow Lake-HX mobile stack on BGA 2114. It runs 24 cores at 2.7 GHz Performance-core base with boost to 5.4 GHz alongside 2.1 GHz Efficient-core base to 4.6 GHz, backed by 36 MB of Intel Smart Cache plus 40 MB of L2 and a 55 W base power with 160 W maximum turbo power. Intel launched the HX range in January 2025, building the compute tile on TSMC 3 nm with 17.8 billion transistors on a 243 square millimeter die.

Twenty-four desktop-derived cores suit high-end gaming notebooks, creator laptops and portable workstations that stay plugged in most of the time. The 2.7 GHz P-core base keeps sustained renders and compiles moving under full cooling, while bursts to 5.4 GHz clear single-threaded spikes. An AI Boost NPU with 13 TOPS backs 36 platform TOPS for on-device assistance beside CPU and GPU.

Against the flagship Intel Core Ultra 9 285HX above it, the 275HX gives up 100 MHz of P-core clocks for a lower price at identical core counts. Against the 20-core Intel Core Ultra 7 265HX below it, the 275HX adds 4 E-cores for heavier parallel loads. Unlocked multipliers invite tuning where firmware allows. See CPU cooler compatibility by socket for how soldered mobile cooling differs from socketed desktops.

Socket and motherboard compatibility

The 275HX fits BGA 2114, a 2,114-ball soldered package measuring 37.5 × 30.2 mm. The chip is soldered once at the factory and stays with the board for life, so there is no retention mechanism and no aftermarket mounting choice. Cooling is part of the laptop design for the 55 W base with 160 W turbo headroom and a 105 degree junction limit, usually dual-fan vapor chamber assemblies.

Board choice means laptop choice. Memory is DDR5 up to 6400 MT/s in two channels, and the chipset rides alongside as WM880 or HM870 depending on the design. A chassis revision needs firmware that knows the Arrow Lake-HX stepping. Moving from any other package is a full system change with memory and thermal design replaced together.

Memory, PCIe and cooling

Memory on BGA 2114 is DDR5 up to 6400 MT/s in two channels with up to 102.4 GB per second of bandwidth. Two channels keep 24 cores supplied in gaming, rendering and compilation mixes where the working set fits laptop memory sizes. Capacity and ECC behavior follow the laptop spec sheet, so buyers confirm each model.

PCI Express connectivity is Gen 5 with x20 lanes from the CPU plus x4 Gen 4 lanes for board devices. That lane budget feeds discrete graphics over a Gen 5 x16 link plus NVMe storage without strain. Lane splits between graphics, NVMe and Thunderbolt follow the board layout, so buyers confirm slot wiring before counting on multi-drive arrays.

Graphics come from Arc Xe-LPG with 64 execution units up to 1.9 GHz, enough for control displays and light play, while gaming designs add discrete graphics. Cooling follows the maker specification for the 55 W class with 160 W turbo headroom. Firmware power limits can cap draw below the default in quieter profiles, at some cost in sustained clocks.

Upgrade paths

On the same package, the path up from the 275HX is the flagship Intel Core Ultra 9 285HX for top-bin clocks on BGA 2114 where the budget allows. The move keeps core count and cache while lifting base and boost frequencies together.

The step down to the 20-core Intel Core Ultra 7 265HX trims 4 E-cores for slimmer designs. A move to BGA 2049 Arrow Lake-H is a different soldered platform with fewer cores and lower power for thin laptops. That change means a whole new system. The decision turns on sustained power against portability.