Intel Core i5-1030G7 socket: BGA 1377
The Intel Core i5-1030G7 uses BGA 1377, a soldered ultra mobile package. The quad core 9 W chip carries Iris Plus 64EU graphics.
- Socket
- BGA 1377
- Launched
- August 2019
- Cores and threads
- 4 and 8
- Base power
- 9 W
- Codename
- Ice Lake-Y
- Segment
- Mobile (soldered)
- Family
- Intel Core i5
- Clocks
- 0.8 / 3.5 GHz
Intel Core i5-1030G7 specifications
| Cores | 4 |
|---|---|
| Threads | 8 |
| Core architecture | Sunny Cove cores on 10 nm |
| Clocks | 0.8 GHz base, up to 3.5 GHz with Turbo Boost 2.0 |
| Cache | 6 MB Intel Smart Cache (L3) |
| Processor base power (TDP) | 9 W (12 W cTDP up) |
| Manufacturing process | 10 nm |
| Memory support | LPDDR4X-3733, two channels, up to 32 GB |
| PCI Express | PCIe 3.0 from the CPU |
| Integrated graphics | Intel Iris Plus Graphics (300 MHz base, up to 1.05 GHz, 64 execution units) |
| Multiplier | Locked |
| Package | BGA1377 (26.5 by 18.5 mm, soldered) |
Motherboard compatibility
Intel Core i5-1030G7 needs a motherboard with a BGA 1377 socket. Chipset by chipset data for this codename is not recorded yet. See the BGA 1377 chipset list and the board maker's CPU support list.
BGA 1377 at a glance
| Type | BGA, 1,377 contacts |
|---|---|
| Package size | 26.5 × 18.5 mm |
| Introduced | August 2019 |
| Memory | LPDDR4X-3733 and DDR4-3200 on Ice Lake-Y, LPDDR3-2133 and DDR3L-1600 on Amber Lake-Y, two channels |
| Cooler mounting holes | Not applicable (soldered) |
What the Core i5-1030G7 is
The Core i5-1030G7 is a four core, eight thread Ice Lake-Y processor for premium thin detachables. It launched in August 2019 with a 0.8 GHz base and up to 3.5 GHz boost at 9 W. It pairs the Y CPU with the top G7 graphics tier.
Six megabytes of Smart Cache back eight threads in travel multitasking. The 100 MHz base lift over the 1030G4 is small; the graphics tier is the real step with 64 execution units. All core turbo lands near 3.2 GHz.
Iris Plus G7 graphics up to 1.05 GHz cover pen drawing and 4K video in thin bodies. The chip fits premium detachables where graphics matter more than CPU bursts. Four cores keep meetings smooth.
Socket and motherboard compatibility
The 1030G7 solders to BGA 1377 on premium detachable boards. Intel documents 26.5 by 18.5 mm packaging with 9 W sustained. There is no socketed version.
LPDDR4X memory solders next to the package for graphics bandwidth. Makers tune 9 to 12 W per thickness. The LGA, PGA and BGA: CPU package types explained guide frames soldered device design.
U series boards cannot take the Y chip. The ultra mobile ball map is unique.
Memory, PCIe and cooling
LPDDR4X-3733 soldered in two channels up to 32 GB feeds Iris Plus graphics best. Premium detachables fix 8 or 16 GB. Bandwidth peaks near 58.3 GB per sec.
PCIe 3.0 wires internal NVMe storage in 256 to 512 GB sizes. Board lanes add wireless and sensors. USB-C carries external displays.
Passive cooling covers 9 W with graphics bursts above. Thin metal bodies spread heat silently. No cooler pattern exists.
Upgrade paths
Soldered packaging blocks upgrades. Premium pens and docks extend detachable use. Device replacement is the performance step.
At purchase time the i7-1060G7 adds cache and clocks on the same BGA 1377 family. The 1030G4 steps graphics down for lower prices.
Frequently asked questions
What socket does the Intel Core i5-1030G7 use?
It uses BGA 1377 soldered to the detachable board.
What graphics are in the 1030G7?
Intel Iris Plus with 64 execution units up to 1.05 GHz.
How is the G7 different from G4?
64 graphics execution units against 48, with the same CPU.
When did the 1030G7 launch?
August 2019 with the Ice Lake-Y family.
Can the 1030G7 be replaced?
No. Soldered BGA prevents processor swaps.
Sources and verification
Facts last checked against these sources on . Page last edited on .