Intel Core i3-1000G1 socket: BGA 1377
The Intel Core i3-1000G1 uses BGA 1377, a soldered ultra mobile package. The dual core 9 W Ice Lake-Y chip cannot be replaced.
- Socket
- BGA 1377
- Launched
- August 2019
- Cores and threads
- 2 and 4
- Base power
- 9 W
- Codename
- Ice Lake-Y
- Segment
- Mobile (soldered)
- Family
- Intel Core i3
- Clocks
- 1.1 / 3.2 GHz
Intel Core i3-1000G1 specifications
| Cores | 2 |
|---|---|
| Threads | 4 |
| Core architecture | Sunny Cove cores on 10 nm |
| Clocks | 1.1 GHz base, up to 3.2 GHz with Turbo Boost 2.0 |
| Cache | 4 MB Intel Smart Cache (L3) |
| Processor base power (TDP) | 9 W |
| Manufacturing process | 10 nm |
| Memory support | LPDDR4X-3733 and DDR4-3200, two channels |
| PCI Express | PCIe 3.0 from the CPU |
| Integrated graphics | Intel UHD Graphics |
| Multiplier | Locked |
| Package | BGA1377 (26.5 by 18.5 mm, soldered) |
Motherboard compatibility
Intel Core i3-1000G1 needs a motherboard with a BGA 1377 socket. Chipset by chipset data for this codename is not recorded yet. See the BGA 1377 chipset list and the board maker's CPU support list.
BGA 1377 at a glance
| Type | BGA, 1,377 contacts |
|---|---|
| Package size | 26.5 × 18.5 mm |
| Introduced | August 2019 |
| Memory | LPDDR4X-3733 and DDR4-3200 on Ice Lake-Y, LPDDR3-2133 and DDR3L-1600 on Amber Lake-Y, two channels |
| Cooler mounting holes | Not applicable (soldered) |
What the Core i3-1000G1 is
The Core i3-1000G1 is a dual core, four thread Ice Lake-Y processor for thin detachables. It launched in August 2019 with a 1.1 GHz base and up to 3.2 GHz boost at 9 W. Sunny Cove cores bring newer instructions to the entry Y tier.
Four megabytes of Smart Cache back browsing and video on small screens. The 9 W envelope suits fanless 2-in-1 designs with long standby. Compared with Amber Lake Y dual cores, IPC gains show in single application speed.
UHD Graphics cover the detachable display and 4K video without a discrete GPU. The G1 suffix marks standard graphics against G4 Iris Plus parts. Buyers who sketch and stream lightly fit here.
Socket and motherboard compatibility
The 1000G1 solders to BGA 1377 on thin detachable boards. All five Ice Lake-Y processors share this package. There is no socketed path.
Makers validate passive thermal paths for 9 W sustained in sealed bodies. Memory solders down next to the package. The LGA, PGA and BGA: CPU package types explained guide explains soldered device practice.
U series BGA1526 boards cannot host the Y chip. Power and ball maps differ.
Memory, PCIe and cooling
LPDDR4X-3733 or DDR4-3200 soldered in two channels is the detachable memory. Most devices fix 8 GB for cost reasons. Bandwidth peaks near 58.3 GB per sec with LPDDR4X.
PCIe 3.0 from the CPU wires internal NVMe storage in 128 to 256 GB sizes. Board lanes add Wi-Fi and touch controllers. External displays run through USB-C.
Passive spreading through the device shell cools 9 W silently. There is no fan curve and no cooler pattern. Battery service extends travel life.
Upgrade paths
No processor or memory upgrade exists on soldered Y devices. Cloud storage and keyboard covers extend classroom use. Device replacement is the performance path.
At purchase time the i3-1000G4 adds Iris Plus graphics on the same BGA 1377 family. Quad core Y parts add threads for heavier multitasking.
Frequently asked questions
What socket does the Intel Core i3-1000G1 use?
It uses BGA 1377 soldered to the detachable board.
What does G1 mean?
Standard UHD graphics tier, below G4 and G7 Iris Plus tiers.
How many threads does the 1000G1 have?
Two cores with four threads at 1.1 GHz base and up to 3.2 GHz boost.
When did the 1000G1 launch?
August 2019 with the Ice Lake-Y family.
Can the 1000G1 be upgraded?
No. Soldered packaging prevents any processor change.
Sources and verification
- Intel Ice Lake mobile specs (TrustedReviews)
- Intel launches 10nm Ice Lake mobility processors (WCCFTECH)
Facts last checked against these sources on . Page last edited on .