Intel Core i3-10110Y socket: BGA 1377
The Intel Core i3-10110Y uses BGA 1377, a soldered ultra mobile package. The dual core 7 W chip cannot be replaced.
- Socket
- BGA 1377
- Launched
- August 2019
- Cores and threads
- 2 and 4
- Base power
- 7 W
- Codename
- Amber Lake-Y
- Segment
- Mobile (soldered)
- Family
- Intel Core i3
- Clocks
- 1.0 / 4.0 GHz
Intel Core i3-10110Y specifications
| Cores | 2 |
|---|---|
| Threads | 4 |
| Core architecture | Skylake based cores on 14 nm |
| Clocks | 1.0 GHz base, up to 4.0 GHz with Turbo Boost 2.0 |
| Cache | 4 MB Intel Smart Cache (L3) |
| Processor base power (TDP) | 7 W (9 W cTDP up, 5.5 W cTDP down) |
| Manufacturing process | 14 nm |
| Memory support | LPDDR3-2133 and DDR3L-1600, two channels, up to 16 GB |
| PCI Express | 10 lanes, PCIe 3.0 |
| Integrated graphics | Intel UHD Graphics 615 (300 MHz base, up to 1000 MHz) |
| Multiplier | Locked |
| Package | BGA1377 (26.5 by 18.5 mm, soldered) |
Motherboard compatibility
Intel Core i3-10110Y needs a motherboard with a BGA 1377 socket. Chipset by chipset data for this codename is not recorded yet. See the BGA 1377 chipset list and the board maker's CPU support list.
BGA 1377 at a glance
| Type | BGA, 1,377 contacts |
|---|---|
| Package size | 26.5 × 18.5 mm |
| Introduced | August 2019 |
| Memory | LPDDR4X-3733 and DDR4-3200 on Ice Lake-Y, LPDDR3-2133 and DDR3L-1600 on Amber Lake-Y, two channels |
| Cooler mounting holes | Not applicable (soldered) |
What the Core i3-10110Y is
The Core i3-10110Y is a dual core, four thread ultra mobile processor from the 10th generation Amber Lake Y family. It launched in August 2019 for small tablets with a 1.0 GHz base and up to 4.0 GHz boost at 7 W. Intel ARK lists Amber Lake Y as its code name.
Four megabytes of Smart Cache back browsing and video on tiny screens. The 7 W envelope with 5.5 W down tuning fits fanless tablets with long standby. Boost to 4.0 GHz keeps single taps responsive.
UHD Graphics 615 up to 1000 MHz drive tablet displays and 4K video. The chip fits detachables where weight beats speed. Buyers who type all day meet enough performance with long battery.
Socket and motherboard compatibility
The 10110Y solders to BGA 1377 at 26.5 by 18.5 mm permanently. Tablet boards define soldered memory and storage for the life of the device. There is no socketed path.
Makers tune cTDP between 5.5 and 9 W per chassis thickness. Thinner bodies favor battery over burst. The LGA, PGA and BGA: CPU package types explained guide explains soldered tablet practice.
Desktop and U series boards cannot host the Y package. Power and ball maps are unique.
Memory, PCIe and cooling
LPDDR3-2133 or DDR3L-1600 soldered in two channels up to 16 GB is the tablet memory. Most devices fix 8 GB. No slots exist for upgrades.
Ten PCIe 3.0 lanes wire internal storage and board devices. Tablets pair 128 GB of eMMC or NVMe with the chip. USB-C carries external displays.
Cooling is passive spreading through the tablet body. There is no fan curve and no cooler pattern. Battery service extends travel life.
Upgrade paths
No internal upgrade exists on soldered Y devices. Cloud storage and keyboards extend tablet use. Device replacement is the performance path.
A move to the quad core Intel Core i5-10210Y on the same BGA 1377 family adds threads at purchase time. Later tablets moved to newer low power platforms.
Frequently asked questions
What socket does the Intel Core i3-10110Y use?
It uses BGA 1377 soldered to the tablet board.
Is the 10110Y Comet Lake or Amber Lake?
Intel ARK lists Amber Lake Y as its code name, launched with the 10th generation in August 2019.
How much power does the 10110Y use?
7 W base with 9 W cTDP up and 5.5 W down.
What memory does the 10110Y take?
Soldered LPDDR3-2133 or DDR3L-1600 in two channels up to 16 GB.
When did the 10110Y launch?
August 2019 with the 10th generation Y family.
Sources and verification
Facts last checked against these sources on . Page last edited on .