Intel Celeron 867 socket: BGA 1023
The Intel Celeron 867 uses the BGA 1023 package. It is a soldered 17 W dual core Sandy Bridge part and cannot be replaced.
- Socket
- BGA 1023
- Launched
- January 2012
- Cores and threads
- 2 and 2
- Base power
- 17 W
- Codename
- Sandy Bridge
- Segment
- Mobile (soldered)
- Family
- Intel Celeron
- Clocks
- 1.3 GHz
Intel Celeron 867 specifications
| Cores | 2 |
|---|---|
| Threads | 2 |
| Core architecture | Sandy Bridge cores on 32 nm |
| Clocks | 1.3 GHz (no turbo) |
| Cache | 2 MB Intel Smart Cache (L3) |
| Processor base power (TDP) | 17 W |
| Manufacturing process | 32 nm |
| Memory support | DDR3-1066 and 1333, two channels, up to 16 GB |
| PCI Express | PCIe lanes from the CPU (layout varies by board design) |
| Integrated graphics | Intel HD Graphics (350 MHz to 1000 MHz) |
| Multiplier | Locked |
| Package | BGA 1023 (FCBGA, 1023 balls, 31 × 24 mm, soldered) |
Motherboard compatibility
Intel Celeron 867 needs a motherboard with a BGA 1023 socket. Chipset by chipset data for this codename is not recorded yet. See the BGA 1023 chipset list and the board maker's CPU support list.
BGA 1023 at a glance
| Type | BGA, 1,023 contacts |
|---|---|
| Package size | 31 × 24 mm |
| Introduced | January 2011 |
| Memory | DDR3 and DDR3L, two channels, 1066 to 1600 MT/s |
| Cooler mounting holes | Not applicable (soldered) |
What the Celeron 867 is
Intel Celeron 867 is a dual core Sandy Bridge mobile processor that Intel released in January 2012 for thin soldered laptops. It runs at a fixed 1.3 GHz with no turbo and no Hyper-Threading, so 2 cores give 2 threads. Cache is 2 MB Intel Smart Cache. Power is rated at 17 W on a 32 nm process.
Graphics are Intel HD Graphics for Sandy Bridge at 350 MHz to 1000 MHz. The block covers thin laptop panels and video without a card. The controller takes DDR3 at 1066 or 1333 MT/s.
Two cores at low clocks suit light multitasking in thin bodies with long battery targets. Laptops pair it with HM65 class boards and small drives. The LGA, PGA and BGA: CPU package types explained guide contrasts this soldered thin part with socketed duals.
Socket and motherboard compatibility
The Celeron 867 solders to BGA 1023 with 1,023 balls in a 31 by 24 mm footprint and cannot be moved. Thin makers qualify each model with a fixed board and BIOS, so another BGA part is not a field swap.
The BIOS must list the exact Celeron 867 string. Board selection is about screen and battery, not power delivery. The CPU cooler compatibility by socket guide notes soldered cooling stays board specific.
Memory, PCIe and cooling
Memory support is DDR3-1066 and 1333, two channels, up to 16 GB. Thin bodies may solder RAM and lock size. Matched channels help shared graphics.
PCI Express lanes come from the CPU for Wi-Fi and storage. No card upgrade fits this power class.
Cooling is a slim 17 W spreader and fan. Low fixed clocks need little airflow.
Upgrade paths
There is no CPU upgrade path on soldered BGA 1023. The Celeron 867 cannot be removed, so a faster thin laptop means a new board or a new device. A soldered single on the same package is Intel Celeron 797, though boards rarely exchange.
A platform move means a new thin laptop on a current BGA package. Keep the old body for travel duty after a wipe.
Frequently asked questions
What socket does the Intel Celeron 867 use?
It uses BGA 1023, a soldered package. The chip cannot be removed.
How many threads does the Celeron 867 have?
Two cores with 2 threads at a fixed 1.3 GHz.
What memory does the Celeron 867 use?
DDR3-1066 and 1333, two channels, up to 16 GB.
Can the Celeron 867 be upgraded?
No. Soldered BGA parts need a board or laptop replacement for more speed.
Sources and verification
Facts last checked against these sources on . Page last edited on .