Intel Core i7-3555LE socket: BGA 1023

What the Core i7-3555LE is

Intel Core i7-3555LE is a dual core Ivy Bridge embedded processor that Intel released in June 2012 for carriers that need more base clock than 17 W parts allow. It runs at 2.5 GHz base with turbo to 3.2 GHz, with 4 MB Intel Smart Cache and Hyper-Threading for 4 threads. Power is rated at 25 W on a 22 nm process. The LE suffix marks embedded use with ECC on qualified boards.

Graphics are Intel HD Graphics 4000 at 550 MHz to 1000 MHz, a higher base than U parts that steadies display work. The block covers control monitors and video without a card. Memory is DDR3 and DDR3L at 1333 or 1600 MT/s for up to 16 GB, with ECC to catch single bit errors in always on service.

The 25 W step suits sealed boxes with directed airflow and small active sinks. Carrier firmware locks the image for years, so the fixed clocks and ECC matter more than peak turbo. The How to find your CPU socket type guide shows how to confirm the soldered package.

Socket and motherboard compatibility

The Core i7-3555LE solders to BGA 1023 with 1,023 balls in a 31 by 24 mm footprint and cannot be moved. Carriers qualify each model with a fixed board and BIOS for a long lifecycle, so another LE or UE part is not a field swap.

The BIOS must list the exact Core i7-3555LE string with ECC wiring where used. The 25 W heatsink is sized by the carrier for the enclosure, not by a retail mount. The CPU cooler compatibility by socket guide notes soldered parts have no desktop pattern.

Memory, PCIe and cooling

Memory support is DDR3 and DDR3L at 1333 or 1600 MT/s, two channels, up to 16 GB, with ECC where the board enables it. ECC suits control, medical and signage loads that run for months. Capacity follows the carrier, which may solder RAM in compact boxes.

PCI Express is 16 lanes from the CPU at PCIe 3.0, arranged by the carrier for I/O, storage and expansion. Embedded boards keep graphics internal and spend lanes on reliable I/O rather than gaming slots.

Cooling uses the carrier heatsink for 25 W. Ambient ratings and enclosure airflow decide sustained turbo more than fan speed. Service is limited to cleaning and drive swaps where access exists.

Upgrade paths

There is no CPU upgrade path on soldered BGA 1023. The Core i7-3555LE cannot be removed, so a faster box means a new board or a new carrier. Within embedded BGA, Intel Celeron 1047UE shows a slower UE option, but carriers rarely exchange models.

A platform move means a new embedded box on a current BGA package with DDR4 support. Recycle the old unit through a proper e waste path once data is wiped.