Intel Celeron 887 socket: BGA 1023
The Intel Celeron 887 uses the BGA 1023 package. It is a soldered 17 W dual core Sandy Bridge part and cannot be replaced.
- Socket
- BGA 1023
- Launched
- September 2012
- Cores and threads
- 2 and 2
- Base power
- 17 W
- Codename
- Sandy Bridge
- Segment
- Mobile (soldered)
- Family
- Intel Celeron
- Clocks
- 1.5 GHz
Intel Celeron 887 specifications
| Cores | 2 |
|---|---|
| Threads | 2 |
| Core architecture | Sandy Bridge cores on 32 nm |
| Clocks | 1.5 GHz (no turbo) |
| Cache | 2 MB Intel Smart Cache (L3) |
| Processor base power (TDP) | 17 W |
| Manufacturing process | 32 nm |
| Memory support | DDR3-1066 and 1333, two channels, up to 16 GB |
| PCI Express | PCIe lanes from the CPU (layout varies by board design) |
| Integrated graphics | Intel HD Graphics (350 MHz to 1000 MHz) |
| Multiplier | Locked |
| Package | BGA 1023 (FCBGA, 1023 balls, 31 × 24 mm, soldered) |
Motherboard compatibility
Intel Celeron 887 needs a motherboard with a BGA 1023 socket. Chipset by chipset data for this codename is not recorded yet. See the BGA 1023 chipset list and the board maker's CPU support list.
BGA 1023 at a glance
| Type | BGA, 1,023 contacts |
|---|---|
| Package size | 31 × 24 mm |
| Introduced | January 2011 |
| Memory | DDR3 and DDR3L, two channels, 1066 to 1600 MT/s |
| Cooler mounting holes | Not applicable (soldered) |
What the Celeron 887 is
Intel Celeron 887 is a dual core Sandy Bridge mobile processor that Intel released in September 2012 as the fastest ULV Celeron dual of the generation. It runs at a fixed 1.5 GHz with no turbo and no Hyper-Threading, so 2 cores give 2 threads. Cache is 2 MB Intel Smart Cache. Power is rated at 17 W on a 32 nm process.
Graphics are Intel HD Graphics for Sandy Bridge at 350 MHz to 1000 MHz. The block covers thin laptop displays and video without a card. The controller takes DDR3 at 1066 or 1333 MT/s.
Late 2012 thin bodies pair it with HM76 class boards and small SSDs for quiet classroom use. Fixed clocks keep behavior steady across fleets. The LGA, PGA and BGA: CPU package types explained guide contrasts this soldered thin part with socketed duals.
Socket and motherboard compatibility
The Celeron 887 solders to BGA 1023 with 1,023 balls in a 31 by 24 mm footprint and cannot be moved. Thin makers qualify each model with a fixed board and BIOS, so another BGA part is not a field swap.
The BIOS must list the exact Celeron 887 string. The CPU cooler compatibility by socket guide notes soldered mobile cooling stays board specific.
Memory, PCIe and cooling
Memory support is DDR3-1066 and 1333, two channels, up to 16 GB. Thin bodies may solder RAM and lock size. Matched channels help shared graphics.
PCI Express lanes come from the CPU for Wi-Fi and storage. No card upgrade fits this envelope.
Cooling is a slim 17 W spreader and fan. Low fixed clocks need little airflow.
Upgrade paths
There is no CPU upgrade path on soldered BGA 1023. The Celeron 887 cannot be removed, so a faster thin laptop means a new board or a new device. A nearby soldered dual is Intel Celeron 877, though boards rarely exchange models.
A platform move means a new thin laptop on a current BGA package. Keep the old body for basic duty after a wipe.
Frequently asked questions
What socket does the Intel Celeron 887 use?
It uses BGA 1023, a soldered package. The chip cannot be removed.
How is the Celeron 887 different from the 877?
Base is 1.5 GHz instead of 1.4 GHz. Cache, power and graphics match.
What memory does the Celeron 887 use?
DDR3-1066 and 1333, two channels, up to 16 GB.
Can the Celeron 887 be upgraded?
No. Soldered BGA parts need a board or laptop replacement for more speed.
Sources and verification
Facts last checked against these sources on . Page last edited on .