AMD E2-7110 socket: Socket FT3
The AMD E2-7110 uses the Socket FT3 socket as a soldered BGA chip and cannot be replaced. It is a quad core Carrizo-L APU at 1.8 GHz and 15 W with Radeon R2 graphics for entry notebooks.
- Socket
- Socket FT3
- Launched
- May 2015
- Cores and threads
- 4 and 4
- Default TDP
- 15 W
- Codename
- Carrizo-L
- Segment
- Mobile (soldered)
- Family
- AMD E2
- Clocks
- 1.8 GHz
AMD E2-7110 specifications
| Cores | 4 |
|---|---|
| Threads | 4 |
| Core architecture | Puma (Carrizo-L) cores on 28 nm |
| Clocks | 1.8 GHz (no boost) |
| Cache | 2 MB L2 (shared, no L3) |
| Default TDP | 15 W |
| Manufacturing process | 28 nm |
| Memory support | DDR3L-1600 |
| PCI Express | PCIe 2.0, up to 8 lanes |
| Integrated graphics | AMD Radeon R2 Graphics (600 MHz) |
| Multiplier | Locked |
| Package | Socket FT3 (BGA, 769 contacts) |
Motherboard compatibility
AMD E2-7110 needs a motherboard with a Socket FT3 socket. Chipset by chipset data for this codename is not recorded yet. See the Socket FT3 chipset list and the board maker's CPU support list.
Socket FT3 at a glance
| Type | BGA, 769 contacts |
|---|---|
| Package size | 24.5 × 24.5 mm |
| Introduced | May 2013 |
| Memory | DDR3-1600, one or two channels, ECC on selected designs |
| Cooler mounting holes | Not applicable (soldered) |
What the E2-7110 is
The E2-7110 brings Carrizo-L to FT3 for entry notebooks with DDR3L. It launched in May 2015 with four Puma cores at a fixed 1.8 GHz and 15 W. AMD targets subnotebooks that need four cores with graphics on one chip.
Two megabytes of shared L2 carry classroom work and browsing. The fixed clock suits predictable loads. Four threads cover foreground tasks plus background services.
Radeon R2 graphics at 600 MHz drive notebook panels and external monitors. The process is 28 nm. The multiplier is locked. DDR3L-1600 feeds CPU and graphics with modest bandwidth.
Buyers choose the notebook at order time with memory size and display tier. The 15 W rating suits thin bodies with long battery life. A compact BGA footprint helps small chassis designs.
Socket and motherboard compatibility
The E2-7110 is soldered to the board on Socket FT3 and cannot be replaced. Upgrading means replacing the board or the whole notebook, so choose memory at purchase. Boards pair the SoC with SODIMM slots for DDR3L and eDP for panels.
FT3 boards wire PCIe 2.0, SATA and USB per notebook design. FM2+ desktops cannot take this BGA chip. The LGA, PGA and BGA: CPU package types explained guide explains soldered packages.
Single socket notebooks are the deployment. Growth means another FT3 notebook rather than a chip swap. Service follows the maker manual.
Memory, PCIe and cooling
DDR3L-1600 suits entry notebooks with eMMC or small SSDs. Dual channel operation helps R2 graphics where boards wire both slots. Start with 4 GB for classroom use.
PCIe 2.0 with up to 8 lanes from the SoC serves storage and board devices. Most builds rely on R2 graphics. The hub adds SATA and USB.
Cooling has no retail mount pattern because the chip is soldered. Vendors design heat spreaders for 15 W classes. Keep vents clear. ECC is not supported.
Upgrade paths
On the same socket, the AMD E1-6015 drops to two cores at 1.4 GHz for cheaper notebooks. Beema A6 parts add graphics where listed. All share FT3 boards and DDR3.
Stoney Ridge E2-9010 covers newer entry notebooks on FP4. It requires new boards and memory.
Past entry portables move to Stoney Ridge. The E2-7110 covers 2015 notebooks where four cores with R2 must run at 15 W.
Frequently asked questions
What socket does the AMD E2-7110 use?
It uses Socket FT3 as a soldered chip and cannot be replaced.
How many cores does the E2-7110 have?
Four cores and four threads at a fixed 1.8 GHz with no boost.
Which graphics does the E2-7110 include?
Radeon R2 graphics for notebook panels.
What memory does the E2-7110 support?
DDR3L-1600.
When did the E2-7110 launch?
May 2015 with Carrizo-L mobile parts.
Sources and verification
Facts last checked against these sources on . Page last edited on .