AMD A10 Micro-6700T socket: Socket FT3

The AMD A10 Micro-6700T uses the Socket FT3 socket as a soldered BGA chip and cannot be replaced. It is a quad core Mullins flagship from 1.2 GHz to 2.2 GHz at 4.5 W with Radeon R6 graphics.

Launched
April 2014
Cores and threads
4 and 4
Default TDP
4.5 W
Codename
Mullins
Segment
Mobile (soldered)
Clocks
1.2 / 2.2 GHz

AMD A10 Micro-6700T specifications

Cores4
Threads4
Core architecturePuma+ cores on 28 nm
Clocks1.2 GHz base, up to 2.2 GHz boost
Cache2 MB L2 cache
Processor base power (TDP)4.5 W (2.8 W SDP)
Manufacturing process28 nm
Memory supportDDR3L-1333, single channel
PCI ExpressPCIe 2.0, up to 8 lanes
Integrated graphicsAMD Radeon R6 (128 shaders, 500 MHz)
MultiplierLocked
PackageSocket FT3 (BGA769, soldered)

Motherboard compatibility

AMD A10 Micro-6700T needs a motherboard with a Socket FT3 socket. Chipset by chipset data for this codename is not recorded yet. See the Socket FT3 chipset list and the board maker's CPU support list.

Socket FT3 at a glance

TypeBGA, 769 contacts
Package size24.5 × 24.5 mm
IntroducedMay 2013
MemoryDDR3-1600, one or two channels, ECC on selected designs
Cooler mounting holesNot applicable (soldered)

Read the full Socket FT3 socket guide

What the A10 Micro-6700T is

The A10 Micro-6700T tops Mullins tablets on Socket FT3 for premium hybrids. It runs 4 Puma+ cores and 4 threads at 1.2 GHz base with bursts to 2.2 GHz. Two megabytes of L2 cache cover tablet multitasking. Power is 4.5 W with a 2.8 W SDP rating on 28 nm from April 2014.

The 2.2 GHz burst leads all Mullins parts in single thread response. Four threads handle detachable productivity with background sync. Radeon R6 with 128 shaders at 500 MHz leads Mullins graphics for video. The soldered package means the hybrid choice locks everything.

DDR3L-1333 over one channel feeds cores and graphics. The A10 Micro-6700T covers premium convertibles where top Mullins threads with R6 must fit 4.5 W.

Socket and motherboard compatibility

The A10 Micro-6700T solders to the board on Socket FT3 and cannot be replaced. Premium hybrid memory and SSD lock at purchase. Boards wire high resolution eDP panels with small batteries.

FT3 tablets share SoC I/O. The LGA, PGA and BGA: CPU package types explained guide explains soldered limits.

Memory, PCIe and cooling

DDR3L-1333 over a single channel suits premium hybrids. Low speed memory saves battery. Single channel is fixed.

PCIe 2.0 with up to 8 lanes from the SoC serves storage and radios. Hybrids use little wired expansion. R6 graphics cover detachable displays.

Cooling is passive for 4.5 W with skin limits. Bursts to 2.2 GHz trim under sustained load. Thin hybrids throttle first.

Upgrade paths

On the same socket, the AMD A4 Micro-6400T at 1.0 GHz to 1.6 GHz below saves cost with R3 graphics, while the AMD A6 Micro-6500T at 5 W covers notebooks. All share FT3 boards.

Newer tablets moved past Mullins. The A10 Micro-6700T remains the Mullins tablet lead.

Frequently asked questions

What socket does the AMD A10 Micro-6700T use?

It uses Socket FT3 as a soldered chip.

How many cores does the A10 Micro-6700T have?

Four cores and four threads at 1.2 GHz base with bursts to 2.2 GHz.

Which graphics does the A10 Micro-6700T include?

AMD Radeon R6 with 128 shaders at 500 MHz.

What is the TDP of the A10 Micro-6700T?

4.5 W with a 2.8 W SDP rating.

Sources and verification

  1. AMD Mullins and Beema APU models (Tom's Hardware)
  2. AMD unveils low power Mullins APUs (CNX Software)

Facts last checked against these sources on . Page last edited on .