BGA 676 socket: CPUs, chipsets and cooler fit
BGA 676 is Intel soldered ball grid array package for the Atom E600 Tunnel Creek embedded family. It carries 676 balls in a 22 × 22 mm FC-BGA package for Bonnell single core SoCs with Hyper-Threading. Intel lists the E620 through E680 parts covered here with FC-BGA 676 as the supported socket and September 14, 2010 as the launch date, from 3.3 W to 4.5 W.
Quick facts
| Maker | Intel |
|---|---|
| Package type | BGA |
| Contacts | 676 |
| Package size | 22 × 22 mm |
| Introduced | September 2010 |
| Status | Legacy |
| Memory | DDR2 single channel up to DDR2-800, up to 2 GB |
| PCIe from the CPU | PCIe 4 x1 lanes from the SoC |
| Cooler mounting holes | Not applicable (soldered) |
| Replaces | BGA 441 |
| Replaced by | None |
Overview
The package pairs a Bonnell core with two threads, 512 KB of L2 cache, GMA600 graphics at 320 MHz on the slower parts and 400 MHz on the faster parts, with single-channel DDR2 up to DDR2-800 and 4 PCIe x1 lanes. That balance suits fanless gateways, kiosks, HMIs and in-vehicle terminals where a few watts matter more than speed. Plain parts cover 0 to 70 C while T parts cover minus 40 to 85 C at identical clocks and power.
Like every soldered Intel BGA package, BGA 676 trades replacement for integration. The chip cannot be swapped, cooling is part of the board design for the configured TDP, and Intel backs the embedded SKUs with embedded lifecycle supply. Designs that combine the CPU with programmable logic use the Stellarton FPGA variant on BGA 1466 instead.
Processor generations
| Codename | Marketing name | Years | Notes |
|---|---|---|---|
| Tunnel Creek | Atom E600 series | 2010 | Bonnell single core SoCs with Hyper-Threading, 512 KB of L2 cache, GMA600 graphics and DDR2 controller, from the 600 MHz E620 at 3.3 W to the 1.6 GHz E680 at 4.5 W, launched September 14, 2010 with commercial and industrial ratings. |
A soldered package for small boards
BGA 676 follows the same rule as every BGA package on this site: the processor is soldered once at the factory and stays with the board for life. There are no pins to bend and no lever to lift, but there is also no CPU upgrade path. An embedded designer qualifies one SKU for the whole production run. Intel marks the E600 parts as embedded with tray supply and list prices from 19 to 85 USD at launch.
The T suffix marks the industrial temperature option. An E640T matches the E640 at 1 GHz, 512 KB of L2 cache and 3.6 W, but runs from minus 40 to 85 C instead of 0 to 70 C. Compatibility still depends on firmware, so a board revision needs a BIOS that knows the exact sSpec stepping.
Memory, expansion and cooling
Memory on BGA 676 is a board decision with one valid answer. Designs solder DDR2-800 in single channel up to 2 GB, which keeps power and cost low for single core workloads. ECC is not part of these SKUs, so designs that need error correction step up to a larger embedded platform.
Expansion comes from 4 PCIe x1 lanes plus USB, GMA600 display outputs with two video ports, HD audio and SPI. The lanes usually split between boot storage and wired networking, with the exact split fixed per board. Boards that need more than the SoC offers cannot add lanes, so the block diagram of the exact board decides real expansion.
Cooling has no retail answer on BGA 676. The same package spans 3.3 W to 4.5 W, and the heatsink or spreader is drawn for the configured TDP of that product. The industrial T rating to 85 C suits sealed cabinets with careful airflow, and mounting pressure follows the board maker specification.
CPUs on BGA 676
8 processor pages in the database, newest first.
| Processor | Cores / threads | Base / boost | TDP | Launched |
|---|---|---|---|---|
| Intel Atom E620 | 1 / 2 | 0.6 GHz | 3.3 W | Sep 2010 |
| Intel Atom E620T | 1 / 2 | 0.6 GHz | 3.3 W | Sep 2010 |
| Intel Atom E640 | 1 / 2 | 1.0 GHz | 3.6 W | Sep 2010 |
| Intel Atom E640T | 1 / 2 | 1.0 GHz | 3.6 W | Sep 2010 |
| Intel Atom E660 | 1 / 2 | 1.3 GHz | 3.6 W | Sep 2010 |
| Intel Atom E660T | 1 / 2 | 1.3 GHz | 3.6 W | Sep 2010 |
| Intel Atom E680 | 1 / 2 | 1.6 GHz | 4.5 W | Sep 2010 |
| Intel Atom E680T | 1 / 2 | 1.6 GHz | 4.5 W | Sep 2010 |
Frequently asked questions
Can a BGA 676 processor be replaced or upgraded?
No. The processor is soldered to the board in the FC-BGA 676 package. Upgrading means replacing the board or module, so choose clock and temperature range at design time.
Which processors fit BGA 676?
Atom E600 Tunnel Creek parts, including the 600 MHz E620 and E620T at 3.3 W through the 1.6 GHz E680 and E680T at 4.5 W covered here. Plain parts cover 0 to 70 C while T parts cover minus 40 to 85 C at the same clocks.
What memory does BGA 676 use?
DDR2 single channel up to DDR2-800 with up to 2 GB. The board design fixes the memory, so check the vendor list before committing.
What expansion does BGA 676 provide?
PCIe with 4 x1 lanes from the SoC plus GMA600 graphics, HD audio and SPI. That lane budget suits boot storage, wired networking and display bridges on small embedded boards.
Sources and verification
- List of Intel Atom processors (Wikipedia)
- Intel Atom E620 (Technical City)
- Intel Atom E640 (Technical City)
Facts last checked against these sources on . Page last edited on .