BGA 2227 Socket: Compatible CPUs, Chipsets and Coolers

Maker	Intel
Package type	BGA
Contacts	2,227
Package size	45 × 45 mm
Introduced	February 2022
Status	Legacy
Memory	DDR4 up to 2933 MT/s, 3 channels, up to 384 GB, ECC supported
PCIe from the CPU	PCIe Gen4 with 16 lanes from the SoC plus PCH Gen3 lanes for board devices
Cooler mounting holes	Not applicable (soldered)
Replaces	None
Replaced by	None

Overview

The platform pairs efficient Xeon D silicon of 4 to 10 cores with 3 channels of DDR4 ECC to 384 GB for compact network functions and edge workloads. Sixteen PCIe Gen4 lanes from the SoC plus PCH Gen3 lanes serve NICs and NVMe on small boards. ECC stays enabled for continuous operation.

Network builders choose the D-1700 series where the larger BGA 2579 package overshoots power and board space. Against BGA 2579 with 4 memory channels and 32 Gen4 lanes for dense appliances, BGA 2227 serves 40 W to 67 W designs with 3 channels and 16 lanes. ARK lists the socket as FCBGA2227 under package data, and that line decides fit.

Codename	Marketing name	Years	Notes
Ice Lake-D	Xeon D-1700 series	2022	Efficient network and edge SoCs with 10 nm Ice Lake cores, from the 4-core D-1712TR at 40 W to the 10-core D-1746TER at 67 W. Launched in February 2022 for single socket boards.

Memory and IO on BGA 2227 boards

BGA 2227 boards wire 3 channels of DDR4 ECC to 384 GB for edge network workloads. Speeds run DDR4-2400 to DDR4-2933 depending on the SKU, and ECC corrects single-bit errors during continuous duty. Population order follows the board manual with primary slots first.

Sixteen PCIe Gen4 lanes from the SoC serve NICs and NVMe, with PCH Gen3 lanes for board devices. Typical wiring feeds a pair of 25 GbE ports plus NVMe logs on compact edge boards. Builders should confirm lane splits in the manual before ordering NICs and storage together.

Cooling and board design

Every BGA 2227 processor is soldered with no retention, so cooling belongs to the appliance maker. Most 40 W to 67 W designs use compact active heatsinks with directed airflow, while fanless boxes spread heat across the chassis wall. Paste service follows the maker manual.

Because configuration is fixed at order time, core count and memory size decide the life of the box. An edge node that may later run extra containers should take higher core counts up front. Builders who standardise on one board across sites should qualify the highest-TDP SKU they may ever fit, since the heatsink and airflow follow the worst case.

Processor	Cores / threads	Base / boost	TDP	Launched
Intel Xeon D-1712TR	4 / 8	2.0 / 3.1 GHz	40 W	Feb 2022
Intel Xeon D-1715TER	4 / 8	2.4 / 3.5 GHz	50 W	Feb 2022
Intel Xeon D-1732TE	8 / 16	1.9 / 3.0 GHz	52 W	Feb 2022
Intel Xeon D-1735TR	8 / 16	2.2 / 3.4 GHz	59 W	Feb 2022
Intel Xeon D-1746TER	10 / 20	2.0 / 3.1 GHz	67 W	Feb 2022

Frequently asked questions

Can a BGA 2227 processor be replaced or upgraded?

No. The processor is soldered to the board. Upgrading means replacing the board or the whole appliance, so choose core count and memory at order time.

What is the difference between BGA 2227 and BGA 2579?

BGA 2227 at 45 × 45 mm serves Xeon D-1700 parts with 3 memory channels and 16 Gen4 lanes at 40 W to 67 W. BGA 2579 at 52.5 × 45 mm serves D-2700 parts with 4 channels and 32 lanes.

What memory does BGA 2227 use?

DDR4 ECC across 3 channels to 384 GB, at DDR4-2400 to DDR4-2933 depending on the SKU.

Does BGA 2227 support multi-socket operation?

No. Single socket only with no interconnect links.

What is the TDP range on BGA 2227?

40 W to 67 W across the D-1700 stack, from the 4-core D-1712TR to the 10-core D-1746TER.

BGA 2227 socket: CPUs, chipsets and cooler fit

Quick facts