BGA 2579 socket: CPUs, chipsets and cooler fit
BGA 2579 is Intel flip-chip ball grid array package with 2579 balls for Xeon D network processors including the 22-core D-2899NT refresh from December 2023. The package measures 52.5 × 45 mm and solders directly to network appliance boards with single socket operation only. There is no socketed upgrade path.
Quick facts
| Maker | Intel |
|---|---|
| Package type | BGA |
| Contacts | 2,579 |
| Package size | 52.5 × 45 mm |
| Introduced | December 2023 |
| Status | Previous generation |
| Memory | DDR4-3200, 4 channels, up to 1 TB, ECC supported |
| PCIe from the CPU | PCIe Gen4 with 32 lanes from the SoC plus PCH Gen3 lanes for board devices |
| Cooler mounting holes | Not applicable (soldered) |
| Replaces | None |
| Replaced by | None |
Overview
The platform pairs many-core Xeon D silicon with 4 channels of DDR4-3200 ECC to 1 TB for packet buffers and virtualised network functions. Thirty-two PCIe Gen4 lanes from the SoC plus PCH Gen3 lanes serve NICs, NVMe and accelerators on compact network boards. ECC stays enabled for carrier uptime.
Network builders choose soldered D-series for dense ports per watt rather than for socketed flexibility. The 22-core D-2899NT shares its board class with lower core D-2700 and D-2800 parts where validated. Boards for LGA 4677 serve higher power Xeon Scalable racks, while BGA 2579 remains the soldered network SoC package.
Processor generations
| Codename | Marketing name | Years | Notes |
|---|---|---|---|
| Ice Lake-D | Xeon D-2700 and D-2800 series | 2022 to 2023 | Network SoCs with 10 nm Ice Lake cores, from the 4-core D-2712T to the 20-core D-2799 launched in February 2022, plus the 22-core D-2899NT refresh from December 2023 for single socket network appliances. |
Memory and IO on BGA 2579 boards
BGA 2579 boards wire 4 channels of DDR4-3200 ECC to 1 TB for network workloads. ECC corrects single-bit errors during continuous packet work, which protects forwarding tables. Population order follows the board manual with primary slots first.
Thirty-two PCIe Gen4 lanes from the SoC serve high-speed NICs and NVMe, with PCH Gen3 lanes for board devices. Typical wiring feeds multiple 100 GbE ports plus NVMe logs. Builders should confirm lane splits in the manual before ordering NICs and storage together.
Cooling and board design
Every BGA 2579 processor is soldered with no retention, so cooling belongs to the appliance maker. Most 135 W designs use 1U active heatsinks with directed airflow, while short-depth boxes add ducting for inlet control. Paste service follows the maker manual for the large package.
Because configuration is fixed at order time, core count and memory size decide the life of the box. An appliance that may later run virtualised functions should take higher core counts up front.
Identifying BGA 2579 against LGA 4677
BGA 2579 uses 2579 balls at 52.5 × 45 mm for soldered Xeon D network SoCs with DDR4. LGA 4677 uses 4677 contacts with DDR5 for socketed Xeon Scalable racks, so boards and chips do not cross. ARK lists the socket as FCBGA2579 under package data, and that line decides fit.
Marketing names can mislead, since Xeon D and Xeon Scalable share cache and core counts at some tiers. When a support list names D-2899NT it means BGA 2579 soldered, while Gold 5416S means LGA 4677 socketed. The How to find your CPU socket type guide shows where ARK lists package data.
CPUs on BGA 2579
8 processor pages in the database, newest first.
| Processor | Cores / threads | Base / boost | TDP | Launched |
|---|---|---|---|---|
| Intel Xeon D-2899NT | 22 / 44 | 2.2 / 3.1 GHz | 135 W | Dec 2023 |
| Intel Xeon D-2712T | 4 / 8 | 1.9 / 3.0 GHz | 65 W | Feb 2022 |
| Intel Xeon D-2733NT | 8 / 16 | 2.1 / 3.2 GHz | 80 W | Feb 2022 |
| Intel Xeon D-2752TER | 12 / 24 | 1.8 / 2.8 GHz | 77 W | Feb 2022 |
| Intel Xeon D-2775TE | 16 / 32 | 2.0 / 3.1 GHz | 100 W | Feb 2022 |
| Intel Xeon D-2796TE | 20 / 40 | 2.0 / 3.1 GHz | 118 W | Feb 2022 |
| Intel Xeon D-2798NT | 20 / 40 | 2.1 / 3.1 GHz | 125 W | Feb 2022 |
| Intel Xeon D-2799 | 20 / 40 | 2.4 / 3.4 GHz | 129 W | Feb 2022 |
Frequently asked questions
Can a BGA 2579 processor be replaced or upgraded?
No. The processor is soldered to the appliance board. Upgrading means replacing the board.
What memory does BGA 2579 use?
DDR4-3200 in 4 channels to 1 TB with ECC support.
How many PCIe lanes does BGA 2579 provide?
32 PCIe Gen4 lanes from the SoC plus PCH Gen3 lanes for board devices.
What is the difference between BGA 2579 and LGA 4677?
BGA 2579 is a 2579-ball soldered package for Xeon D network SoCs with DDR4. LGA 4677 is a 4677-contact socket for Xeon Scalable racks with DDR5.
Sources and verification
Facts last checked against these sources on . Page last edited on .