BGA 2197 socket: CPUs, chipsets and cooler fit
BGA 2197 is the AMD soldered ball grid array package with 2197 balls for the Ryzen 4700S desktop kit from June 2021. The processor solders directly to the kit board next to GDDR6 memory chips, a layout borrowed from console hardware rather than from socketed desktops. There is no socketed upgrade path.
Quick facts
| Maker | AMD |
|---|---|
| Package type | BGA |
| Contacts | 2,197 |
| Package size | n/a |
| Introduced | June 2021 |
| Status | Legacy |
| Memory | GDDR6 soldered, up to 16 GB |
| PCIe from the CPU | PCIe 2.0 x4 from the APU plus SATA via the board chipset |
| Cooler mounting holes | Not applicable (soldered) |
| Replaces | None |
| Replaced by | None |
Overview
The kit pairs an 8-core Zen 2 processor with soldered GDDR6 memory that games consoles also use, which keeps board costs down but removes memory choice. Four PCIe 2.0 lanes from the APU serve a single expansion slot, with SATA ports behind the board chipset for bulk storage. The graphics units stay disabled, so every build needs a discrete card.
Buyers choose the 4700S kit for low-cost productivity boxes where the bundled board, memory and cooling arrive as one unit. Against AM4 with DDR4 slots and upgrade paths, BGA 2197 trades flexibility for price. Against BGA 2963 used by the faster 4800S kit, it serves the lower tier of the same console-derived family.
Processor generations
| Codename | Marketing name | Years | Notes |
|---|---|---|---|
| Cardinal | Ryzen 4700S desktop kit | 2021 | 8-core Zen 2 kit processor with disabled graphics and soldered GDDR6, launched in June 2021 as a bundled board. |
Kit design and limits
The 4700S arrives as a bundled kit with the processor soldered, GDDR6 memory fitted and a heatsink in the box. Buyers cannot change memory size or move the chip to another board. The single Gen2 x4 slot takes a low-profile discrete card for displays and light acceleration.
Because graphics units stay disabled, office and browsing duty still need a discrete card. Builders should confirm card clearance and power connectors in the compact kit case before ordering.
Cooling and power
The bundled heatsink covers the 65 W band with case airflow doing the rest. Kit cases run small fans at steady speeds, so owners keep vents clear for long sessions.
Power draw stays modest for an 8-core desktop, which suits always-on home office boxes. There is no overclocking headroom on the soldered kit.
GDDR6 memory
Soldered GDDR6 in 8 GB or 16 GB kit variants feeds the eight Zen 2 cores with console-style bandwidth. Capacity ends at 16 GB with no upgrade path, which bounds heavy multitasking and large projects from the start.
Because memory solders next to the processor, buyers choose the size once at purchase. Builders who need 32 GB or DDR4 flexibility choose AM4 boards with slots instead of a kit.
CPUs on BGA 2197
1 processor page in the database, newest first.
| Processor | Cores / threads | Base / boost | TDP | Launched |
|---|---|---|---|---|
| AMD Ryzen 4700S | 8 / 16 | 3.6 / 4.0 GHz | 65 W | Jun 2021 |
Frequently asked questions
Can a BGA 2197 processor be replaced or upgraded?
No. The Ryzen 4700S is soldered to the kit board with GDDR6 memory. Upgrading means replacing the whole kit. Choose the 8 GB or 16 GB variant at purchase.
What memory does BGA 2197 use?
Soldered GDDR6 up to 16 GB, fixed at order time with no slots.
Does the Ryzen 4700S have integrated graphics?
No. The graphics units stay disabled, so a discrete card is required.
What is the difference between BGA 2197 and BGA 2963?
BGA 2197 serves the Ryzen 4700S kit while BGA 2963 serves the faster 4800S kit. Both are soldered console-derived desktop kits.
What is the TDP of the Ryzen 4700S kit chip?
65 W for the chip, cooled by the kit heatsink with case airflow.
Sources and verification
Facts last checked against these sources on . Page last edited on .