Intel Xeon W-11865MRE socket: BGA 1787
The Intel Xeon W-11865MRE uses the BGA 1787 package, a grid array that solders to the board. It is an 8-core Tiger Lake-H embedded processor at 35 W with ECC memory, and the soldered chip cannot be replaced.
- Socket
- BGA 1787
- Launched
- August 2021
- Cores and threads
- 8 and 16
- Base power
- 35 W
- Codename
- Tiger Lake-H
- Segment
- Embedded
- Family
- Intel Xeon W
- Clocks
- 2.1 / 4.7 GHz
Intel Xeon W-11865MRE specifications
| Cores | 8 |
|---|---|
| Threads | 16 |
| Core architecture | Willow Cove (Tiger Lake-H) |
| Clocks | 2.1 GHz base at 35 W (2.6 GHz at 45 W), up to 4.7 GHz turbo |
| Cache | 24 MB Intel Smart Cache (L3) |
| Processor base power (TDP) | 35 W |
| Manufacturing process | 10 nm SuperFin |
| Memory support | DDR4 up to 3200 MT/s ECC, two channels, up to 128 GB |
| PCI Express | PCIe Gen4 with 20 lanes from the CPU |
| Integrated graphics | Intel UHD Graphics for 11th Gen (32 execution units, up to 1.35 GHz) |
| Multiplier | Locked |
| ECC memory | Yes |
| Package | FCBGA1787 soldered, 50 × 26.5 mm |
| Cooler in the box | None (embedded system cooling) |
| Launch price | $480 (Intel RCP) |
Motherboard compatibility
Intel Xeon W-11865MRE needs a motherboard with a BGA 1787 socket. Chipset by chipset data for this codename is not recorded yet. See the BGA 1787 chipset list and the board maker's CPU support list.
BGA 1787 at a glance
| Type | BGA, 1,787 contacts |
|---|---|
| Package size | 50 × 26.5 mm |
| Introduced | May 2021 |
| Memory | DDR4 up to 3200 MT/s, two channels, up to 128 GB |
| Cooler mounting holes | Not applicable (soldered) |
What the Xeon W-11865MRE is
The Xeon W-11865MRE is an 8-core embedded processor that Intel released in the third quarter of 2021 for industrial systems built around Tiger Lake-H. Its Willow Cove cores run a 2.1 GHz base at 35 W to 4.7 GHz turbo with Hyper-Threading for 16 threads. Cache is 24 MB of Intel Smart Cache.
The MRE suffix marks an embedded variant with extended temperature range and long availability for industrial boards. The power envelope spans 35 W with a 2.1 GHz base to 45 W with a 2.6 GHz base, so carriers tune the same die for fanless moments or active cooling. The 10 nm SuperFin process keeps burst clocks high for vision and control tasks.
Intel UHD Graphics for 11th Gen processors handle display output, with 32 execution units at 350 MHz base and up to 1.35 GHz boost. ECC memory support guards data in long running systems. The launch price was $480 (Intel RCP). The package is FCBGA1787 soldered at 50 × 26.5 mm.
Socket and motherboard compatibility
The W-11865MRE fits BGA 1787 only. The chip solders to the carrier at the factory, so there is no socket retention and no later processor upgrade. Board support is fixed to embedded carriers with mobile chipsets for this generation, with ECC enabled through firmware and the board design.
Because the package is soldered, buyers compare complete embedded systems rather than separate boards and chips. A single board computer listing names the W-11865MRE at 8 cores and 16 threads with 35 W cooling needs. The board, cooler and firmware ship as one unit for industrial use.
The LGA, PGA and BGA: CPU package types explained guide explains why soldered BGA packages list no cooler mounting pattern. For repair, a failed processor means a carrier replacement through the system maker.
Memory, PCIe and cooling
The memory controller supports DDR4 up to 3200 MT/s in two channels, up to 128 GB, with ECC support. Industrial builds often use ECC SODIMM pairs for data integrity across long uptime. The controller does not accept DDR5.
The CPU supplies 20 PCIe Gen4 lanes through the carrier, with Thunderbolt 4 on many designs for machine vision links and fast storage. The carrier layout decides lane use, so the system specifications state which slots run at full speed. Integrated graphics drive control panels and up to four displays.
Cooling is part of the industrial chassis, not a boxed cooler. The 35 W base with headroom to 45 W needs conduction or fanned cooling rated for extended temperature. No LGA cooler fits, and the CPU cooler compatibility by socket guide covers why desktop brackets do not apply here.
Upgrade paths
Against the Intel Core i7-11800H, the W-11865MRE adds ECC memory and embedded availability in a similar 8-core layout. The gaming laptop part suits short product cycles, while this embedded part suits industrial systems that must stay available for years. Both share 24 MB of cache and Gen4 links.
There is no CPU upgrade path on the soldered carrier. The next step is a carrier or system replacement, either with another BGA1787 embedded system or a move to a later platform. Storage can move with the drive, while memory moves only when the carrier uses slots.
For system builders, the MRE part makes sense when extended temperature and ECC matter. When a standard laptop chassis is enough, the mobile workstation parts give similar cores without the embedded options.
Frequently asked questions
What socket does the Intel Xeon W-11865MRE use?
It uses BGA 1787, a soldered grid array. The chip cannot be replaced.
How many cores does the Intel Xeon W-11865MRE have?
8 cores with 16 threads, 2.1 GHz base at 35 W and up to 4.7 GHz turbo, with 24 MB of Intel Smart Cache.
What memory does the Intel Xeon W-11865MRE support?
DDR4 up to 3200 MT/s with ECC in two channels, up to 128 GB. ECC guards data in long running systems.
What graphics does the Intel Xeon W-11865MRE include?
Intel UHD Graphics for 11th Gen with 32 execution units up to 1.35 GHz for control panels and up to four displays.
What is the TDP of the Intel Xeon W-11865MRE?
35 W base with a 45 W configurable up option. The embedded chassis cooler handles turbo bursts above the base.
Sources and verification
Facts last checked against these sources on . Page last edited on .