Intel Xeon W-11865MLE socket: BGA 1787
The Intel Xeon W-11865MLE uses the BGA 1787 package, a grid array that solders to the board. It is an 8-core Tiger Lake-H embedded processor at 25 W with ECC memory, and the soldered chip cannot be replaced.
- Socket
- BGA 1787
- Launched
- August 2021
- Cores and threads
- 8 and 16
- Base power
- 25 W
- Codename
- Tiger Lake-H
- Segment
- Embedded
- Family
- Intel Xeon W
- Clocks
- 1.5 / 4.5 GHz
Intel Xeon W-11865MLE specifications
| Cores | 8 |
|---|---|
| Threads | 16 |
| Core architecture | Willow Cove (Tiger Lake-H) |
| Clocks | 1.5 GHz base, up to 4.5 GHz turbo |
| Cache | 24 MB Intel Smart Cache (L3) |
| Processor base power (TDP) | 25 W |
| Manufacturing process | 10 nm SuperFin |
| Memory support | DDR4 up to 3200 MT/s ECC, two channels, up to 128 GB |
| PCI Express | PCIe Gen4 with 20 lanes from the CPU |
| Integrated graphics | Intel UHD Graphics 11th Gen (32 execution units, up to 1.35 GHz) |
| Multiplier | Locked |
| ECC memory | Yes |
| Package | FCBGA1787 soldered, 50 × 26.5 mm |
| Cooler in the box | None (embedded system cooling) |
Motherboard compatibility
Intel Xeon W-11865MLE needs a motherboard with a BGA 1787 socket. Chipset by chipset data for this codename is not recorded yet. See the BGA 1787 chipset list and the board maker's CPU support list.
BGA 1787 at a glance
| Type | BGA, 1,787 contacts |
|---|---|
| Package size | 50 × 26.5 mm |
| Introduced | May 2021 |
| Memory | DDR4 up to 3200 MT/s, two channels, up to 128 GB |
| Cooler mounting holes | Not applicable (soldered) |
What the Xeon W-11865MLE is
The Xeon W-11865MLE is an 8-core embedded processor that Intel released in the third quarter of 2021 for low power industrial systems built around Tiger Lake-H. Its Willow Cove cores run 1.5 GHz base to 4.5 GHz turbo with Hyper-Threading for 16 threads. Cache is 24 MB of Intel Smart Cache.
The MLE suffix marks a 25 W embedded variant for systems that must hold heat down across long service. The low base clock keeps idle and sustained power low, while turbo still reaches 4.5 GHz for short control tasks. The 10 nm SuperFin process keeps burst efficiency in line for fanless capable designs.
Intel UHD Graphics 11th Gen handle display output, with 32 execution units at 350 MHz base and up to 1.35 GHz boost. ECC memory support guards data in long running systems. The package is FCBGA1787 soldered at 50 × 26.5 mm.
Socket and motherboard compatibility
The W-11865MLE fits BGA 1787 only. The chip solders to the carrier at the factory, so there is no socket retention and no later processor upgrade. Board support is fixed to embedded carriers with mobile chipsets for this generation, with ECC enabled through firmware and the board design.
Because the package is soldered, buyers compare complete embedded systems rather than separate boards and chips. A COM Express listing names the W-11865MLE at 8 cores and 16 threads with 1.5 GHz base and 25 W cooling needs. The board, cooler and firmware ship as one unit for industrial use.
The LGA, PGA and BGA: CPU package types explained guide explains why soldered BGA packages list no cooler mounting pattern. For repair, a failed processor means a carrier replacement through the system maker.
Memory, PCIe and cooling
The memory controller supports DDR4 up to 3200 MT/s in two channels, up to 128 GB, with ECC support. Industrial builds often use ECC SODIMM for data integrity across long uptime. The controller does not accept DDR5.
The CPU supplies 20 PCIe Gen4 lanes through the carrier, with Thunderbolt 4 on many designs for vision links and fast storage. The carrier layout decides lane use, so the system specifications state which slots run at full speed. Integrated graphics drive panels and up to three displays.
Cooling is part of the industrial chassis, not a boxed cooler. The 25 W base needs conduction or low airflow cooling rated for extended temperature. No LGA cooler fits, and the CPU cooler compatibility by socket guide covers why desktop brackets do not apply here.
Upgrade paths
Against the Intel Core i7-11800H, the W-11865MLE trades sustained clocks for lower heat with ECC and embedded availability. The gaming laptop part holds higher bases at 35 W, while this embedded part holds 1.5 GHz base at 25 W for quiet systems. Both share 8 cores and Gen4 links.
There is no CPU upgrade path on the soldered carrier. The next step is a carrier or system replacement, either with another BGA1787 embedded system or a move to a later platform. Storage can move with the drive, while memory moves only when the carrier uses slots.
For system builders, the MLE part makes sense when 25 W cooling limits dominate. When more sustained speed is possible, the 35 W MRE part gives higher bases in the same socket family.
Frequently asked questions
What socket does the Intel Xeon W-11865MLE use?
It uses BGA 1787, a soldered grid array. The chip cannot be replaced.
How many cores does the Intel Xeon W-11865MLE have?
8 cores with 16 threads at 1.5 GHz base and up to 4.5 GHz turbo, with 24 MB of Intel Smart Cache.
What memory does the Intel Xeon W-11865MLE support?
DDR4 up to 3200 MT/s with ECC in two channels, up to 128 GB. ECC guards data in long running systems.
What graphics does the Intel Xeon W-11865MLE include?
Intel UHD Graphics 11th Gen with 32 execution units up to 1.35 GHz for panels and up to three displays.
What is the TDP of the Intel Xeon W-11865MLE?
25 W. The embedded chassis cooler handles turbo bursts above the base.
Sources and verification
- Tiger Lake H embedded processors overview (Intel, 25 W industrial)
- Xeon W-11865MLE vs W-11555MLE specs (CPU-Monkey, 8 cores 25 W BGA 1787)
Facts last checked against these sources on . Page last edited on .