Intel Xeon Phi 7295 socket: LGA 3647

The Intel Xeon Phi 7295 uses the LGA 3647 socket on HPC server boards. It is a 72 core Knights Mill flagship at 320 W with boost to 1.6 GHz.

Socket
LGA 3647
Launched
December 2017
Cores and threads
72 and 288
Base power
320 W
Codename
Knights Mill
Segment
Server
Clocks
1.5 / 1.6 GHz

Intel Xeon Phi 7295 specifications

Cores72
Threads288
Core architectureKnights Mill on 14 nm
Clocks1.5 GHz base, up to 1.6 GHz Turbo
Cache36 MB L2
On-package memory16 GB MCDRAM, 400+ GB/s
Processor base power (TDP)320 W
Manufacturing process14 nm
Memory supportDDR4-2400, six channels, up to 384 GB with ECC
PCI ExpressPCIe 3.0, 16 lanes from the CPU
Integrated graphicsNone
MultiplierLocked
ECC memoryYes
PackageFCLGA3647 (76.0 × 56.5 mm)

Motherboard compatibility

Intel Xeon Phi 7295 needs a motherboard with a LGA 3647 socket. Chipset by chipset data for this codename is not recorded yet. See the LGA 3647 chipset list and the board maker's CPU support list.

LGA 3647 at a glance

TypeLGA, 3,647 contacts
Package size76.0 × 56.5 mm
Introduced2016
MemoryDDR4-2933 ECC, six channels, up to 2 TB
Cooler mounting holesBoard specific (narrow and square ILM heatsinks)

Read the full LGA 3647 socket guide

What the Xeon Phi 7295 is

The Xeon Phi 7295 is a seventy two core, two hundred eighty eight thread flagship accelerator from Knights Mill. It launched in December 2017 with a 1.5 GHz base and up to 1.6 GHz Turbo at 320 W. Seventy two cores cover top training nodes where maximum throughput matters.

Thirty six megabytes of shared L2 cache feed seventy two cores. The 1.5 GHz base leads Phi parts on clocks, while 1.6 GHz burst helps single thread setup. Three hundred twenty watts demand the highest airflow in the Phi set.

Sixteen gigabytes of MCDRAM plus six channel DDR4-2400 up to 384 GB hold large models. MCDRAM flat mode gives explicit placement for tuned training loops. Cache mode speeds untuned code.

Knights Mill vector neural instructions accelerate mixed precision integer math for training. Throughput per watt suits data center training before later accelerators arrived. Locked multiplier keeps large clusters uniform.

Socket and motherboard compatibility

The 7295 fits LGA 3647 on HPC boards with flagship power delivery for 320 W. BIOS must list 72 core Phi parts. Single socket nodes are the design.

MCDRAM modes follow Intel tuning guides for training frameworks. DDR4-2400 ECC covers dataset capacity. The Socket vs chipset: what decides whether a CPU works guide covers server socket use.

The Xeon Phi 7285 on the same socket trims cores and power where cost matters. There is no higher Knights Mill above the 7295.

Memory, PCIe and cooling

DDR4-2400 ECC in six channels up to 384 GB plus 16 GB MCDRAM is the flagship design. Bandwidth peaks near 115.2 GB per sec on DDR4 plus 400+ GB/s on MCDRAM. ECC protects week long runs.

Sixteen PCIe lanes wire fabric and storage. Training fabrics take x16 slots. Node local NVMe holds datasets.

Three hundred twenty watts need liquid or top air with high static pressure. Cool ambients sustain boost best.

Upgrade paths

On LGA 3647 there is no higher Phi above the 7295, so growth means more nodes or newer accelerators on other platforms.

Fabric bandwidth and storage upgrades often help training clusters more than CPU swaps.

Frequently asked questions

What socket does the Xeon Phi 7295 use?

It uses LGA 3647 on HPC server boards.

How many cores does the Phi 7295 have?

Seventy two cores with two hundred eighty eight threads at 1.5 GHz base with up to 1.6 GHz Turbo.

What is MCDRAM on the Phi 7295?

16 GB of on package memory at 400+ GB/s, plus DDR4-2400 up to 384 GB.

When did the Phi 7295 launch?

December 2017 as the Knights Mill flagship.

Sources and verification

  1. Intel Xeon Phi Processor 7295 specifications (Intel)
  2. Xeon Phi 7295 on WikiChip

Facts last checked against these sources on . Page last edited on .