Intel Xeon E7-8860 v3 socket: LGA 2011-1
The Intel Xeon E7-8860 v3 uses the LGA 2011-1 socket on Brickland 8S boards. It is a 16 core Haswell-EX part with 32 threads from 2.2 GHz to 3.2 GHz at 140 W.
- Socket
- LGA 2011-1
- Launched
- June 2015
- Cores and threads
- 16 and 32
- Base power
- 140 W
- Codename
- Haswell-EX
- Segment
- Server
- Family
- Intel Xeon E7
- Clocks
- 2.2 / 3.2 GHz
Intel Xeon E7-8860 v3 specifications
| Cores | 16 |
|---|---|
| Threads | 32 |
| Core architecture | Haswell cores on 22 nm |
| Clocks | 2.2 GHz base, up to 3.2 GHz turbo |
| Cache | 40 MB Last Level Cache |
| Processor base power (TDP) | 140 W |
| Manufacturing process | 22 nm |
| Memory support | DDR4 and DDR3 ECC, four channels, up to 1.5 TB per socket |
| PCI Express | PCIe 3.0, 32 lanes |
| Integrated graphics | None |
| ECC memory | Supported |
| Package | FCLGA2011 (52 × 45 mm) |
Motherboard and chipset compatibility
Intel Xeon E7-8860 v3 needs a motherboard with a LGA 2011-1 socket. The table shows which chipset series accept it.
| Series | Chipsets | Support |
|---|---|---|
| Brickland platform | C602J | Works out of the box Boards ship with E7 v3 support on Brickland. Check the system vendor matrix for BIOS and stepping. |
Board makers publish a CPU support list for every model. Check it for your exact board before buying. Chipset details for LGA 2011-1.
LGA 2011-1 at a glance
| Type | LGA, 2,011 contacts |
|---|---|
| Package size | 52 × 45 mm |
| Introduced | May 2015 |
| Memory | DDR4-1333 to 1866 and DDR3 with ECC, four channels, up to 1.5 TB per socket |
| Cooler mounting holes | Board specific (server heatsink) |
What the Xeon E7-8860 v3 is
The Xeon E7-8860 v3 opens 8S Haswell-EX on LGA 2011-1 for large memory analytics. Intel set 16 cores and 32 threads at 2.2 GHz base with turbo to 3.2 GHz. Forty megabytes of last level cache feed in memory joins. Power is 140 W on 22 nm from the second quarter of 2015.
Sixteen cores with 8S scale reach 128 cores per system for huge guests. Three QPI links at 9.6 GT/s mesh eight sockets. Turbo to 3.2 GHz helps single thread phases in analytics. The 140 W envelope needs enterprise cooling.
DDR4 and DDR3 ECC over four channels to 1.5 TB per socket scale to 12 TB in 8S. Buyers pick the 8860 v3 where 8S memory with 16 cores per node beats 4S clusters on interconnect cost.
Socket and motherboard compatibility
The 8860 v3 fits LGA 2011-1 on Brickland 8S boards. E7-8800 validates to eight sockets, unlike E7-4800 to four. Firmware must list the 8S stepping. Grantley v3 boards never accept EX parts.
Memory is DDR3 or DDR4 ECC per system, never mixed. The Socket vs chipset: what decides whether a CPU works guide covers ideas, vendor 8S guides decide DIMM and QPI cabling.
Memory, PCIe and cooling
Memory to 1.5 TB per socket with ECC suits 8S analytics. DDR4 at 1866 preferred. Rank sparing and mirroring options protect TB scale data.
PCIe 3.0 with 32 lanes per socket serves fabrics and accelerators across eight nodes. Interconnect bandwidth decides scale out efficiency. NUMA tuning is mandatory at 8S.
Cooling uses 8S chassis with 140 W heatsinks and managed airflow. No boxed cooler ships. Inlet control protects turbo across eight sockets.
Upgrade paths
On the same socket the Intel Xeon E7-4850 v3 at 14 cores covers 4S value below, while the Intel Xeon E7-8867 v3 at 16 faster cores lifts clocks above. All share LGA 2011-1 where listed.
A v4 move needs Broadwell-EX firmware. The 8860 v3 opens 8S Haswell-EX where socket count matters.
Frequently asked questions
What socket does the Intel Xeon E7-8860 v3 use?
It uses LGA 2011-1 on Brickland 8S boards.
How many cores does the Xeon E7-8860 v3 have?
16 cores and 32 threads at 2.2 GHz base with turbo to 3.2 GHz.
What is the TDP of the Xeon E7-8860 v3?
140 W.
When did the Xeon E7-8860 v3 launch?
June 2015.
Sources and verification
- Intel Xeon Processor E7-8860 v3 specifications (Intel)
- Intel Xeon E7 v3 Family Brief (Intel, SKU table)
Facts last checked against these sources on . Page last edited on .