Intel Xeon E3-1278L v4 socket: BGA 1364

The Intel Xeon E3-1278L v4 uses the BGA 1364 package soldered to workstation boards. It is a 4 core Broadwell-DT part with 8 threads from 2.0 GHz to 3.3 GHz at 47 W with Iris Pro Graphics P6300.

Socket
BGA 1364
Launched
June 2015
Cores and threads
4 and 8
Base power
47 W
Codename
Broadwell-DT
Segment
Mobile (soldered)
Clocks
2.0 / 3.3 GHz

Intel Xeon E3-1278L v4 specifications

Cores4
Threads8
Core architectureBroadwell cores on 14 nm
Clocks2.0 GHz base, up to 3.3 GHz turbo
Cache6 MB Smart Cache plus 128 MB eDRAM
Processor base power (TDP)47 W
Manufacturing process14 nm
Memory supportDDR3L ECC, two channels, up to 32 GB
PCI ExpressPCIe 3.0, 16 lanes
Integrated graphicsIntel Iris Pro Graphics P6300 (800 MHz to 1000 MHz)
ECC memorySupported
PackageFCBGA1364 (soldered)

Motherboard compatibility

Intel Xeon E3-1278L v4 needs a motherboard with a BGA 1364 socket. Chipset by chipset data for this codename is not recorded yet. See the BGA 1364 chipset list and the board maker's CPU support list.

BGA 1364 at a glance

TypeBGA, 1,364 contacts
Package sizen/a
IntroducedMarch 2015
MemoryDDR3L-1600 and 1866 and LPDDR3, two channels, up to 32 GB
Cooler mounting holesNot applicable (soldered)

Read the full BGA 1364 socket guide

What the Xeon E3-1278L v4 is

The Xeon E3-1278L v4 is a soldered Broadwell workstation part on BGA 1364 for compact video boxes. Intel set 4 cores and 8 threads at 2.0 GHz base with turbo to 3.3 GHz. Six megabytes of Smart Cache plus 128 MB of eDRAM feed cores and graphics. Power is 47 W on 14 nm from June 2015.

Low base clocks protect small chassis while turbo covers encode bursts. Iris Pro Graphics P6300 from 800 MHz to 1000 MHz accelerates transcodes without a discrete card. Eight threads handle streams with background tasks. The soldered package means vendors tune cooling once.

DDR3L ECC over two channels feeds the node. ECC suits 24 hour video duty. Buyers pick the 1278L v4 where soldered Iris Pro must transcode in a compact workstation.

Socket and motherboard compatibility

The 1278L v4 solders to BGA 1364 with workstation cooling for 47 W. No socket and no later swap exist. Compact video appliances lock memory with the SoC style package. Check Quick Sync support in the application stack.

Board designs center on display outputs and NICs around the soldered chip. The LGA, PGA and BGA: CPU package types explained guide explains soldered workstation tradeoffs. Confirm 4K output needs before ordering.

Memory, PCIe and cooling

DDR3L ECC over two channels to 32 GB suits video appliances. Paired modules feed Iris Pro encodes. ECC protects long running jobs.

PCIe 3.0 with 16 lanes from the CPU serves capture cards and NVMe. Most builds use integrated Iris Pro for transcodes. A capture card fits where live inputs need it.

Cooling uses compact workstation heatsinks for 47 W. No boxed cooler ships. Sustained encodes need steady chassis airflow.

Upgrade paths

No soldered upgrade exists. Compare the Intel Xeon E3-1258L v4 at 1.8 GHz to 3.2 GHz nearby for lower base, or socketed Intel Xeon E3-1285L v4 parts on C226 boards where swaps are possible. All share the Broadwell-DT family.

A new platform needs a new board. The How to find your CPU socket type guide helps identify soldered workstation boxes.

Frequently asked questions

What socket does the Intel Xeon E3-1278L v4 use?

It uses BGA 1364, soldered. It cannot be replaced.

How many cores does the Xeon E3-1278L v4 have?

4 cores and 8 threads at 2.0 GHz base with turbo to 3.3 GHz.

Which graphics does the Xeon E3-1278L v4 include?

Intel Iris Pro Graphics P6300 from 800 MHz to 1000 MHz.

When did the Xeon E3-1278L v4 launch?

June 2015.

Sources and verification

  1. Intel Xeon Processor E3-1278L v4 specifications (Intel)
  2. Intel Xeon E3-1200 v4 Family Brief (Intel, Iris Pro P6300)

Facts last checked against these sources on . Page last edited on .