Intel Xeon E3-1258L v4 socket: BGA 1364
The Intel Xeon E3-1258L v4 uses the BGA 1364 package soldered to embedded boards. It is a 4 core Broadwell-DT part with 8 threads from 1.8 GHz to 3.2 GHz at 47 W.
- Socket
- BGA 1364
- Launched
- June 2015
- Cores and threads
- 4 and 8
- Base power
- 47 W
- Codename
- Broadwell-DT
- Segment
- Mobile (soldered)
- Family
- Intel Xeon E3
- Clocks
- 1.8 / 3.2 GHz
Intel Xeon E3-1258L v4 specifications
| Cores | 4 |
|---|---|
| Threads | 8 |
| Core architecture | Broadwell cores on 14 nm |
| Clocks | 1.8 GHz base, up to 3.2 GHz turbo |
| Cache | 6 MB Smart Cache |
| Processor base power (TDP) | 47 W |
| Manufacturing process | 14 nm |
| Memory support | DDR3L ECC, two channels, up to 32 GB |
| PCI Express | PCIe 3.0, 16 lanes |
| ECC memory | Supported |
| Package | FCBGA1364 (37.5 × 32 mm, soldered) |
Motherboard compatibility
Intel Xeon E3-1258L v4 needs a motherboard with a BGA 1364 socket. Chipset by chipset data for this codename is not recorded yet. See the BGA 1364 chipset list and the board maker's CPU support list.
BGA 1364 at a glance
| Type | BGA, 1,364 contacts |
|---|---|
| Package size | n/a |
| Introduced | March 2015 |
| Memory | DDR3L-1600 and 1866 and LPDDR3, two channels, up to 32 GB |
| Cooler mounting holes | Not applicable (soldered) |
What the Xeon E3-1258L v4 is
The Xeon E3-1258L v4 is a soldered Broadwell embedded part on BGA 1364 for long life systems. Intel set 4 cores and 8 threads at 1.8 GHz base with turbo to 3.2 GHz. Six megabytes of Smart Cache cover edge services. Power is 47 W on 14 nm from June 2015. The embedded tag marks extended availability for system vendors.
Low base clocks protect compact enclosures while turbo covers management bursts. Eight threads handle gateway services with background tasks. The FCBGA1364 package at 37.5 × 32 mm solders directly. Long life firmware keeps fleets stable for years.
DDR3L ECC over two channels feeds the node. ECC suits unattended operation. Buyers pick the 1258L v4 where soldered Broadwell with workstation threads must run embedded duty.
Socket and motherboard compatibility
The 1258L v4 solders to BGA 1364 with embedded cooling for 47 W. No socket and no later swap exist. Appliance vendors lock memory and I/O with the soldered chip. Extended lifecycle boards carry the same BOM for years.
Board designs center on NICs and serial around the package. The LGA, PGA and BGA: CPU package types explained guide explains soldered embedded tradeoffs. Confirm operating temperature ratings for field installs.
Memory, PCIe and cooling
DDR3L ECC over two channels to 32 GB suits embedded gateways. Paired modules protect bandwidth. ECC is required for unattended fleets.
PCIe 3.0 with 16 lanes from the CPU serves NICs and flash. Appliances use lanes for network expansion. Integrated platform I/O covers serial and USB.
Cooling uses embedded heatsinks for 47 W with chassis airflow. No boxed cooler ships. Wide temperature designs need validated thermal paths.
Upgrade paths
No soldered upgrade exists. Compare socketed Intel Xeon E3-1265L v4 parts on C226 boards where swaps are possible, or the soldered Intel Xeon E3-1278L v4 above with faster base on the same package. All share the Broadwell-DT family.
A new platform needs a new appliance. The How to find your CPU socket type guide helps identify soldered embedded servers.
Frequently asked questions
What socket does the Intel Xeon E3-1258L v4 use?
It uses BGA 1364, soldered. It cannot be replaced.
How many cores does the Xeon E3-1258L v4 have?
4 cores and 8 threads at 1.8 GHz base with turbo to 3.2 GHz.
What is the TDP of the Xeon E3-1258L v4?
47 W embedded tuning.
When did the Xeon E3-1258L v4 launch?
June 2015 with embedded Broadwell parts.
Sources and verification
- Intel Xeon Processor E3-1258L v4 specifications (Intel)
- Intel Xeon E3-1258L v4 vs E3-1278L v4 comparison (topcpu, package data)
Facts last checked against these sources on . Page last edited on .