Intel Xeon D-1537 socket: BGA 1667
The Intel Xeon D-1537 uses the BGA 1667 package soldered to server boards. It is an 8 core Broadwell-DE SoC with 16 threads from 1.7 GHz to 2.3 GHz at 35 W.
- Socket
- BGA 1667
- Launched
- November 2015
- Cores and threads
- 8 and 16
- Base power
- 35 W
- Codename
- Broadwell
- Segment
- Server
- Family
- Intel Xeon D
- Clocks
- 1.7 / 2.3 GHz
Intel Xeon D-1537 specifications
| Cores | 8 |
|---|---|
| Threads | 16 |
| Core architecture | Broadwell cores on 14 nm |
| Clocks | 1.7 GHz base, up to 2.3 GHz turbo |
| Cache | 12 MB Smart Cache |
| Processor base power (TDP) | 35 W |
| Manufacturing process | 14 nm |
| Memory support | DDR4 and DDR3 ECC, two channels, up to 128 GB |
| PCI Express | PCIe 2.0 and 3.0, up to 32 lanes |
| Integrated graphics | None |
| ECC memory | Supported |
| Package | FCBGA1667 (37.5 × 37.5 mm, soldered) |
Motherboard compatibility
Intel Xeon D-1537 needs a motherboard with a BGA 1667 socket. Chipset by chipset data for this codename is not recorded yet. See the BGA 1667 chipset list and the board maker's CPU support list.
BGA 1667 at a glance
| Type | BGA, 1,667 contacts |
|---|---|
| Package size | 37.5 × 37.5 mm |
| Introduced | February 2016 |
| Memory | DDR4 and DDR3L with ECC, two channels, up to 128 GB |
| Cooler mounting holes | Not applicable (soldered) |
What the Xeon D-1537 is
The Xeon D-1537 packs 8 cores into 35 W on BGA 1667 for dense low power edge servers. Intel set 8 cores and 16 threads at 1.7 GHz base with turbo to 2.3 GHz. Twelve megabytes of Smart Cache feed workers. Power is 35 W on 14 nm from November 2015.
Eight slow cores favor parallel edge loads over latency. Sixteen threads consolidate containers per socket. Low base clocks protect thermals in compact chassis. On package networking keeps node power in check.
DDR4 and DDR3 ECC over two channels to 128 GB feed guests. ECC suits remote operation. Buyers pick the D-1537 where 8 cores must fit 35 W for parallel throughput.
Socket and motherboard compatibility
The D-1537 solders to BGA 1667 with 35 W board cooling. No swap exists. Dense edge designs lock memory with the SoC. Vendors qualify low power firmware profiles.
SoC integration suits short depth servers. The LGA, PGA and BGA: CPU package types explained guide covers soldered limits. Verify container throughput on the low base before ordering fleets.
Memory, PCIe and cooling
DDR4 and DDR3 ECC over two channels to 128 GB suit dense edge VMs. Two channels share across eight cores, so right size per thread memory. ECC is mandatory.
PCIe 2.0 and 3.0 with up to 32 lanes serve flash and NICs. Parallel nodes need fabric more than accelerators. Integrated NICs cover base traffic.
Cooling uses efficient heatsinks for 35 W. Low clocks ease heat density. Packed racks still need aisle airflow.
Upgrade paths
No upgrade exists soldered. Compare the Intel Xeon D-1540 at 2.0 GHz to 2.6 GHz with 45 W tuning above, or the Intel Xeon D-1528 at 6 cores nearby. All share BGA-1667.
A new generation needs a new board. The How to find your CPU socket type guide helps audit dense edge nodes.
Frequently asked questions
What socket does the Intel Xeon D-1537 use?
It uses BGA 1667, soldered.
How many cores does the Xeon D-1537 have?
8 cores and 16 threads at 1.7 GHz base with turbo to 2.3 GHz.
What is the TDP of the Xeon D-1537?
35 W.
When did the Xeon D-1537 launch?
November 2015.
Sources and verification
Facts last checked against these sources on . Page last edited on .