Intel Xeon 6760P socket: LGA 4710

What the Xeon 6760P is

The Intel Xeon 6760P is a 64-core member of the Xeon 6 Granite Rapids stack on Socket LGA 4710. It runs 64 Performance-cores with Hyper-Threading for 128 threads at 2.2 GHz base with boost to 3.8 GHz and 3.4 GHz all-core turbo, backed by 320 MB of cache and a 330 W TDP. Intel launched the 6700P and 6500P range on February 24, 2025 at an 8739 USD recommended price, built on Intel 3 for dual-socket racks, with server and compute SST modes.

Sixty-four cores suit dense virtualization hosts, storage clusters and private clouds where balanced threads and power matter more than peak clocks. The 320 MB cache pool is slightly smaller than the 336 MB of its bin siblings, which reflects its position in the stack. The 2.2 GHz base keeps the 330 W envelope workable, while bursts to 3.8 GHz clear interactive spikes.

Against the 64-core Intel Xeon 6761P below it, the 6760P trades single-socket simplicity for dual-socket scaling with slightly less cache. Against the 64-core Intel Xeon 6767P above it, the 6760P gives up base frequency for a lower price. Dual-socket support doubles the node where boards allow. See Socket vs chipset: what decides whether a CPU works for how socket, platform and firmware fit together on server boards.

Socket and motherboard compatibility

The 6760P fits LGA 4710 in the FCLGA4710 package with the E2A carrier, measuring 77.5 × 56.5 mm. Boards support one or two sockets with this dual-capable part, so one 6760P fills a dense node or pairs with an identical 6760P in a dual-socket rack. LGA 4710 boards are platform designs with vendor-qualified power delivery, memory lists and firmware.

Granite Rapids shares the LGA 4710 socket with Sierra Forest E-core parts, so a board can host either family where the vendor lists it, after a BIOS update where needed. Dual-socket builds require identical part numbers in both sockets. Moving from any other socket is a full platform change with board, memory and heatsinks replaced together.

Memory, PCIe and cooling

Memory on LGA 4710 for this class is DDR5 up to 6400 MT/s in eight channels. Eight channels at these rates keep 128 threads per socket supplied in virtualization and storage mixes. Population order varies by board, so the vendor memory list governs every build, with matched DIMMs across sockets.

PCI Express connectivity is Gen 5 with up to 88 lanes on dual-socket designs. That lane budget feeds NVMe arrays and high-speed networking without lane sharing pressure. Lane bifurcation follows board firmware, so architects confirm slot maps before committing to a consolidation layout.

Cooling follows the board vendor list for the 330 W class. No cooler ships with the tray server part. Firmware power limits can cap draw below the default where a cabinet demands it, at some cost in sustained clocks.

Upgrade paths

On the same socket, the path up from the 6760P starts with the 64-core Intel Xeon 6767P for higher clocks on LGA 4710 boards where the budget allows. The 64-core Intel Xeon 6768P follows for 8-socket scaling. Each move keeps memory investments where the board allows, plus a BIOS that already supports Granite Rapids.

The step down to the single-socket 64-core Intel Xeon 6761P trims scaling for simpler nodes. A move to BGA 5026 is a different soldered platform with 64 single-socket cores for edge nodes. That change replaces board, memory and cooling from scratch.