Intel Core Ultra 7 255H socket: BGA 2049

What the Core Ultra 7 255H is

The Intel Core Ultra 7 255H is the entry 16-core member of the Arrow Lake-H mobile stack on BGA 2049. It runs 16 cores at 2.0 GHz Performance-core base with boost to 5.1 GHz alongside 1.5 GHz Efficient-core base to 4.4 GHz and 700 MHz low-power base to 2.5 GHz boost, backed by 24 MB of Intel Smart Cache and a 28 W base power with 115 W maximum turbo power. Intel launched the H range in January 2025, building the compute tile on TSMC N3B 3 nm.

Sixteen cores at 28 W suit thin creator laptops and business flagships where core count and graphics matter more than sustained draw. The 2.0 GHz P-core base keeps the slim envelope in reach, while bursts to 5.1 GHz clear interactive spikes. An AI Boost NPU with 13 TOPS backs 96 platform TOPS for on-device assistance beside CPU and GPU.

Against the 16-core Intel Core Ultra 7 265H above it, the 255H gives up base frequency across the cores for a lower price. Against the 14-core Intel Core Ultra 5 235H below it, the 255H adds 2 P-cores for heavier parallel loads. Arc 140T graphics with 8 Xe-cores up to 2.25 GHz serve modern play without discrete silicon. See LGA, PGA and BGA: CPU package types explained for how soldered mobile packages differ from socketed desktops.

Socket and motherboard compatibility

The 255H fits BGA 2049, a 2,049-ball soldered package measuring 50 × 25 mm. The chip is soldered once at the factory and stays with the board for life, so there is no retention mechanism and no aftermarket mounting choice. Cooling is part of the laptop design for the 28 W class with 115 W turbo headroom and a 110 degree junction limit, usually slim dual-fan assemblies.

Board choice means laptop choice. Memory is LPDDR5X up to 8400 MT/s or DDR5 up to 6400 MT/s in two channels up to 128 GB. A chassis revision needs firmware that knows the Arrow Lake-H stepping. Moving from any other package is a full system change with memory and thermal design replaced together.

Memory, PCIe and cooling

Memory on BGA 2049 is LPDDR5X up to 8400 MT/s or DDR5 up to 6400 MT/s in two channels. Soldered LPDDR5X feeds both CPU and Arc graphics with high bandwidth, while DDR5 SODIMM slots keep some designs serviceable. ECC is not part of this SKU, so workstation designs that need error correction look elsewhere.

PCI Express connectivity spans PCIe 5.0 and 4.0 in a 1x8 Gen 5 plus 3x4 and 2x4 Gen 4 layout for up to 28 lanes, plus Thunderbolt 4. That lane budget feeds NVMe storage and compact discrete graphics on gaming designs without strain. Lane splits follow the board layout, so buyers confirm wiring before counting on multi-drive arrays.

Graphics come from Intel Arc 140T with 8 Xe-cores up to 2.25 GHz and 74 GPU TOPS, the balanced integrated tier in this batch for smooth modern play. Cooling follows the maker specification for the 28 W class with 115 W turbo headroom. Firmware power limits scale the chip down toward its 20 W minimum assured power in silent profiles, at some cost in sustained clocks.

Upgrade paths

On the same package, the path up from the 255H starts with the 16-core Intel Core Ultra 7 265H for higher clocks on BGA 2049 where the budget allows. The 45 W flagship Intel Core Ultra 9 285H follows for top clocks and power. Each move needs a chassis with matching thermal headroom.

The step down to the 14-core Intel Core Ultra 5 235H trims cores for budget designs. A move to BGA 2114 Arrow Lake-HX is a different soldered platform with many more cores at 55 W for desktop replacements. That change means a whole new system.