Intel Core i9-12900HK socket: BGA 1744
The Intel Core i9-12900HK uses the BGA 1744 package, a 50 × 25 mm grid array that solders to the laptop board. It is a 14-core Alder Lake-H processor at 45 W, and the soldered chip cannot be replaced.
- Socket
- BGA 1744
- Launched
- January 2022
- Cores and threads
- 14 and 20
- Base power
- 45 W
- Codename
- Alder Lake-H
- Segment
- Mobile (soldered)
- Family
- Intel Core i9
- Clocks
- 2.5 / 5.0 GHz
Intel Core i9-12900HK specifications
| Cores | 14 (6 Performance-cores and 8 Efficient-cores) |
|---|---|
| Threads | 20 |
| Core architecture | Golden Cove (P-cores) and Gracemont (E-cores) |
| Clocks | 2.5 GHz base, up to 5.0 GHz turbo |
| Cache | 24 MB Intel Smart Cache (L3) |
| Processor base power (TDP) | 45 W |
| Maximum turbo power | 115 W |
| Manufacturing process | Intel 7 |
| Memory support | DDR5 up to 4800 MT/s, DDR4 up to 3200 MT/s, LPDDR5 up to 5200 MT/s and LPDDR4x up to 4267 MT/s, two channels, up to 64 GB |
| PCI Express | PCIe 4.0, 28 lanes total |
| Integrated graphics | Intel Iris Xe Graphics (96 execution units, up to 1.45 GHz) |
| Multiplier | Unlocked |
| Package | FCBGA1744 (50 × 25 mm, soldered) |
Motherboard compatibility
Intel Core i9-12900HK needs a motherboard with a BGA 1744 socket. Chipset by chipset data for this codename is not recorded yet. See the BGA 1744 chipset list and the board maker's CPU support list.
BGA 1744 at a glance
| Type | BGA, 1,744 contacts |
|---|---|
| Package size | 50 × 25 mm |
| Introduced | December 2024 |
| Memory | DDR4-3200 and DDR5-5200 to DDR5-6400 SODIMM or soldered LPDDR4X-4267 and LPDDR5X-5200 to LPDDR5X-6400, two channels, up to 96 GB |
| Cooler mounting holes | Not applicable (soldered) |
What the Core i9-12900HK is
Intel released the Intel Core i9-12900HK in January 2022 as a 14-core option on BGA 1744. The layout uses 6 Performance-cores plus 8 Efficient-cores, so the operating system sees 20 threads. Base frequency is 2.5 GHz with up to 5.0 GHz boost, and cache totals 24 MB. Base power sits at 45 W with 115 W peak.
The memory controller supports DDR5, DDR4 and low-power variants over two channels to 64 GB, specifically DDR5 up to 4800 MT/s, DDR4 up to 3200 MT/s, LPDDR5 up to 5200 MT/s and LPDDR4x up to 4267 MT/s, two channels, up to 64 GB. SODIMM boards allow later memory changes while soldered LPDDR designs trade that option for thinner bodies. PCIe arrives as Gen4 with 28 lanes in total for graphics and NVMe on typical boards. Intel Iris Xe Graphics (96 execution units, up to 1.45 GHz) drives laptop displays with hardware video decode. The Socket vs chipset: what decides whether a CPU works guide covers soldered mobile layouts.
Mainstream performance laptops take this 14-core H part for performance laptops for study, office work and light creation. The 45 W base with turbo headroom to 115 W suits bodies with solid cooling. Buyers choose memory size and display at order time because the chip solders down. The HK suffix marks an unlocked multiplier for tuning where the laptop firmware allows it. A nearby option is Intel Core 7 250H on the same package.
Socket and motherboard compatibility
The 12900HK fits the BGA 1744 soldered package at 50 × 25 mm. The chip is soldered and cannot be replaced. Laptop or embedded makers solder it with cooling for the 45 W band, so configuration happens once at order time.
There is no socketed variant and no board choice beyond the system design. Memory type, display outputs and expansion follow the laptop or board design, not a retail motherboard list. Systems on the same package range from fewer cores to flagships such as Intel Core 7 250H, which helps lineup planning across price bands.
Memory, PCIe and cooling
DDR5 up to 4800 MT/s, DDR4 up to 3200 MT/s, LPDDR5 up to 5200 MT/s and LPDDR4x up to 4267 MT/s, two channels, up to 64 GB. Dual-channel fitting stays mandatory for graphics performance, with 2 x 16 GB a common pick for study and office work with large documents.
PCIe 4.0 lanes total 28 with graphics and storage links on typical boards. Fast Gen4 SSDs saturate laptop storage duty, while board wiring decides how many slots run at full speed.
Cooling follows the chassis across 45 W base to 115 W turbo with heat pipes sized for sustained 45 W. No boxed cooler exists. Long renders settle at the sustained power the body can reject, so cooling reviews of the exact model matter for purchase decisions.
Upgrade paths
No CPU upgrade exists on soldered boards for performance laptops. The lineup moves from fewer cores through this 14-core part to flagships such as Intel Core 7 250H, chosen at purchase with display and memory. Storage and SODIMM memory are the only later changes for owners who keep the chassis for years.
Beyond this generation the replacement is a whole laptop on newer platforms with faster memory. The LGA, PGA and BGA: CPU package types explained guide explains the soldered tradeoff behind mobile designs.
Frequently asked questions
What socket does the Intel Core i9-12900HK use?
It uses BGA 1744, a soldered grid array. The chip cannot be replaced.
How many cores does the Intel Core i9-12900HK have?
14 cores with 20 threads: 6 Performance-cores plus 8 Efficient-cores, with 24 MB of Smart Cache.
What graphics does the Intel Core i9-12900HK include?
Intel Iris Xe Graphics (96 execution units, up to 1.45 GHz).
What memory does the Intel Core i9-12900HK support?
DDR5, DDR4 and low-power variants over two channels to 64 GB.
What is the TDP of the Intel Core i9-12900HK?
45 W base power with turbo up to 115 W.
Sources and verification
- Intel Intel Core i9-12900HK specifications (Intel ARK)
- Intel Intel Core i9-12900HK benchmarks and specs (Notebookcheck)
Facts last checked against these sources on . Page last edited on .