Intel Core i3-2330E socket: Socket G2

The Intel Core i3-2330E uses the Socket G2 socket. It is a 35 W dual core Sandy Bridge embedded part at 2.2 GHz with Hyper-Threading for socketed embedded boards.

Socket
Socket G2
Launched
June 2011
Cores and threads
2 and 4
Base power
35 W
Codename
Sandy Bridge
Segment
Embedded
Clocks
2.2 GHz

Intel Core i3-2330E specifications

Cores2
Threads4
Core architectureSandy Bridge cores on 32 nm
Clocks2.2 GHz (no turbo)
Cache3 MB Intel Smart Cache (L3)
Processor base power (TDP)35 W
Manufacturing process32 nm
Memory supportDDR3-1066 and 1333, two channels, up to 16 GB
PCI Express16 lanes from the CPU, PCIe 2.0
Integrated graphicsIntel HD Graphics 3000 (650 MHz to 1050 MHz)
MultiplierLocked
PackageFCPGA988 (37.5 × 37.5 mm)

Motherboard compatibility

Intel Core i3-2330E needs a motherboard with a Socket G2 socket. Chipset by chipset data for this codename is not recorded yet. See the Socket G2 chipset list and the board maker's CPU support list.

Socket G2 at a glance

TyperPGA, 988 contacts
Package size37.5 × 37.5 mm
IntroducedJanuary 2011
MemoryDDR3 and DDR3L, two channels, 1066 to 1600 MT/s
Cooler mounting holesBoard specific (laptop heatsink)

Read the full Socket G2 socket guide

What the Core i3-2330E is

Intel Core i3-2330E is a dual core Sandy Bridge embedded processor that Intel released in June 2011 for socketed embedded boards. It runs at a fixed 2.2 GHz with no turbo and includes Hyper-Threading, so 2 cores give 4 threads. Cache is 3 MB Intel Smart Cache. Power is 35 W on a 32 nm process with a 149 mm2 die.

The E suffix marks embedded availability with a longer supply window. Clocks match the mobile 2330M while the qualification targets kiosks and industrial boxes. Fixed clocks keep fleet behavior stable.

Graphics are Intel HD Graphics 3000 at 650 MHz to 1050 MHz. The block drives embedded panels through board outputs. Memory is DDR3 in two channels.

Socket and motherboard compatibility

The Core i3-2330E fits Socket G2 with 988 contacts in FCPGA988 form. Embedded carriers with HM65 and QM67 chipsets carry Sandy embedded parts. The board BIOS must list the exact 2330E string.

Carrier makers qualify each board for fixed strings. A mobile 2330M board may boot the chip electrically, but long term supply and support need the embedded carrier. The Socket vs chipset: what decides whether a CPU works guide covers list based pairing.

Memory, PCIe and cooling

Memory support is DDR3-1066 and 1333, two channels, up to 16 GB. Embedded carriers commonly use SODIMMs with locked BOMs. ECC is not supported on this SKU.

PCI Express is 16 lanes from the CPU at PCIe 2.0 for network, storage and expansion. Embedded boards spend lanes on reliable I/O rather than graphics slots.

Cooling is a 35 W embedded heatsink with directed airflow. The CPU cooler compatibility by socket guide notes socketed embedded cooling stays carrier specific.

Upgrade paths

On Socket G2 the 2330E can move to faster embedded M parts where the carrier lists them. Memory and storage carry over. A nearby socketed embedded reference on the same socket is the mobile 2330M class.

A platform move to a current embedded package needs a new carrier and memory. Keep the 2330E carrier for long life service.

Frequently asked questions

What socket does the Intel Core i3-2330E use?

It uses Socket G2 in FCPGA988 form on embedded carriers.

Does the Core i3-2330E have Hyper-Threading?

Yes. Two cores give 4 threads.

What memory does the Core i3-2330E use?

DDR3-1066 and 1333, two channels, up to 16 GB.

What is the upgrade path from a Core i3-2330E?

Faster embedded M parts where the carrier lists them. Otherwise a new carrier is needed.

Sources and verification

  1. Intel Core i3-2330E Embedded processor (CPU-World, Socket G2, June 2011)
  2. List of Intel Core i3 processors (Wikipedia, 2330E 2.2 GHz HD3000 650 to 1050 Socket G2 June 2011)

Facts last checked against these sources on . Page last edited on .