Intel Core i3-2310E socket: BGA 1023

The Intel Core i3-2310E uses the BGA 1023 package. It is a soldered 35 W dual core Sandy Bridge embedded part at 2.1 GHz with Hyper-Threading and cannot be replaced.

Socket
BGA 1023
Launched
February 2011
Cores and threads
2 and 4
Base power
35 W
Codename
Sandy Bridge
Segment
Embedded
Clocks
2.1 GHz

Intel Core i3-2310E specifications

Cores2
Threads4
Core architectureSandy Bridge cores on 32 nm
Clocks2.1 GHz (no turbo)
Cache3 MB Intel Smart Cache (L3)
Processor base power (TDP)35 W
Manufacturing process32 nm
Memory supportDDR3-1066 and 1333, two channels, up to 16 GB, ECC supported on embedded carriers
PCI ExpressPCIe lanes from the CPU (layout varies by board design)
Integrated graphicsIntel HD Graphics 3000
MultiplierLocked
ECC memorySupported (requires embedded carrier)
PackageBGA 1023 (FCBGA, 1023 balls, 31 × 24 mm, soldered)

Motherboard compatibility

Intel Core i3-2310E needs a motherboard with a BGA 1023 socket. Chipset by chipset data for this codename is not recorded yet. See the BGA 1023 chipset list and the board maker's CPU support list.

BGA 1023 at a glance

TypeBGA, 1,023 contacts
Package size31 × 24 mm
IntroducedJanuary 2011
MemoryDDR3 and DDR3L, two channels, 1066 to 1600 MT/s
Cooler mounting holesNot applicable (soldered)

Read the full BGA 1023 socket guide

What the Core i3-2310E is

Intel Core i3-2310E is a dual core Sandy Bridge embedded processor that Intel released in February 2011 for soldered embedded boards. It runs at a fixed 2.1 GHz with no turbo and includes Hyper-Threading, so 2 cores give 4 threads. Cache is 3 MB Intel Smart Cache. Power is 35 W on a 32 nm process with a 149 mm2 die.

The E suffix marks embedded availability with ECC memory on qualified carriers. Clocks match the mobile 2310M while the qualification targets kiosks and industrial boxes. Fixed clocks keep fleet behavior stable.

Graphics are Intel HD Graphics 3000. The block drives embedded panels through carrier outputs. Memory is DDR3 with ECC in two channels.

Socket and motherboard compatibility

The Core i3-2310E solders to BGA 1023 with 1,023 balls and cannot be moved. Embedded carriers qualify each board for fixed strings with long supply windows. A mobile 2310M board may boot the chip electrically, but long term support needs the embedded carrier.

The carrier BIOS must list the exact 2310E string. The Socket vs chipset: what decides whether a CPU works guide covers list based pairing for embedded parts.

Memory, PCIe and cooling

Memory support is DDR3-1066 and 1333, two channels, up to 16 GB with ECC on embedded carriers. ECC catches single bit errors in always on service. Capacity follows the carrier design.

PCI Express lanes come from the CPU for network, storage and expansion. Embedded boards spend lanes on reliable I/O rather than graphics slots.

Cooling is a 35 W embedded heatsink with directed airflow. The CPU cooler compatibility by socket guide notes soldered embedded cooling stays carrier specific.

Upgrade paths

There is no CPU upgrade path on soldered BGA 1023. The 2310E cannot be removed, so more speed means a new carrier. A nearby soldered embedded reference is the 2340UE class at 17 W.

A platform move to a current embedded package needs a new carrier and memory. Keep the 2310E carrier for long life service.

Frequently asked questions

What socket does the Intel Core i3-2310E use?

It uses BGA 1023, a soldered embedded package. The chip cannot be removed.

Does the Core i3-2310E have Hyper-Threading?

Yes. Two cores give 4 threads.

What memory does the Core i3-2310E use?

DDR3-1066 and 1333 with ECC on embedded carriers, two channels, up to 16 GB.

Can the Core i3-2310E be upgraded?

No. A faster embedded box means a new carrier.

Sources and verification

  1. Legacy Intel Core Processors (Intel ARK, i3-2310E Q1-11 HD3000)
  2. List of Intel Core i3 processors (Wikipedia, 2310E ECC, embedded Sandy Bridge)

Facts last checked against these sources on . Page last edited on .