AMD Ryzen 3 PRO 3300U socket: FP5
The AMD Ryzen 3 PRO 3300U uses the FP5 soldered package. It is a 4-core business Picasso laptop chip with PRO security.
- Socket
- FP5
- Launched
- April 2019
- Cores and threads
- 4 and 4
- Default TDP
- 15 W
- Codename
- Picasso
- Segment
- Mobile (soldered)
- Family
- AMD Ryzen 3
- Clocks
- 2.1 / 3.5 GHz
AMD Ryzen 3 PRO 3300U specifications
| Cores | 4 |
|---|---|
| Threads | 4 |
| Core architecture | Zen+ on 12 nm |
| Clocks | 2.1 GHz base, up to 3.5 GHz boost |
| Cache | 4 MB L3 |
| Default TDP | 15 W |
| Manufacturing process | 12 nm |
| Memory support | DDR4 up to 2400 MT/s, two channels, up to 32 GB |
| PCI Express | PCIe 3.0 with 12 lanes |
| Integrated graphics | Radeon Vega 6 (up to 1200 MHz) |
| Multiplier | Locked |
| Package | FP5 soldered, 1140 balls |
| Cooler in the box | None (laptop cooling) |
Motherboard compatibility
AMD Ryzen 3 PRO 3300U needs a motherboard with a FP5 socket. Chipset by chipset data for this codename is not recorded yet. See the FP5 chipset list and the board maker's CPU support list.
FP5 at a glance
| Type | BGA, 1,140 contacts |
|---|---|
| Package size | 35 × 25 mm |
| Introduced | January 2018 |
| Memory | DDR4 up to 2400 MT/s, two channels |
| Cooler mounting holes | Not applicable (soldered) |
What the PRO 3300U is
The Ryzen 3 PRO 3300U is a four core, four thread business mobile processor from Picasso. It launched in April 2019 for fleet laptops with a 2.1 GHz base and up to 3.5 GHz boost at 15 W. PRO branding adds GuardMI manageability and Memory Guard encryption.
Specs mirror the consumer 3300U with business firmware for remote management. Vega 6 graphics cover office displays and video calls. The 15 W envelope suits thin business bodies with all day batteries.
Four threads handle office suites and browsers without strain. Fleet buyers choose PRO for image stability and long support rather than peak speed. Students meet the same silicon in consumer bodies without management.
Socket and motherboard compatibility
The PRO 3300U solders to FP5 on business laptop boards. PRO management needs business firmware to activate. Consumer boards post the same silicon without fleet tools.
Cooling is a single fan assembly for 15 W with quiet office modes. Memory may be SODIMM or soldered per maker. The How to find your CPU socket type guide points to package lines in maker specs.
Desktop AM4 boards cannot take the mobile package. The soldered ball map is FP5 only.
Memory, PCIe and cooling
DDR4-2400 in two channels up to 32 GB is the business laptop standard. Fleet builds ship 8 GB with room to 16 GB. Dual channel mode helps graphics and calls.
Twelve PCIe 3.0 lanes wire NVMe storage and board devices. A 256 GB NVMe SSD is the typical fleet pairing. Docks add displays and networking through USB-C.
Thermal design is 15 W sustained with brief turbo for app launches. Fan profiles in business BIOS favor silence. No retail cooler pattern exists.
Upgrade paths
No processor upgrade exists on soldered FP5. Memory to 16 GB and a larger SSD extend fleet life. Battery service restores field use.
A laptop change to the Ryzen 5 PRO 3500U adds threads on the same PRO family. Newer Ryzen mobile generations bring more cores per watt for refresh cycles.
Frequently asked questions
What socket does the Ryzen 3 PRO 3300U use?
It uses the FP5 soldered package.
What makes PRO different?
GuardMI manageability and Memory Guard encryption for business fleets.
How many threads does the PRO 3300U have?
Four cores with four threads at 2.1 GHz base and up to 3.5 GHz boost.
When did the PRO 3300U launch?
April 2019 with the Ryzen PRO 3000U business family.
Can the PRO 3300U be replaced?
No. Soldered FP5 prevents processor swaps.
Sources and verification
Facts last checked against these sources on . Page last edited on .