AMD Ryzen 3 3250U socket: FP5
The AMD Ryzen 3 3250U uses the FP5 package, a soldered grid array with 1140 balls. It is a 2-core Dali processor at 15 W, and the soldered chip cannot be replaced.
- Socket
- FP5
- Launched
- January 6, 2020
- Cores and threads
- 2 and 4
- Default TDP
- 15 W
- Codename
- Dali
- Segment
- Mobile (soldered)
- Family
- AMD Ryzen 3
- Clocks
- 2.6 / 3.5 GHz
AMD Ryzen 3 3250U specifications
| Cores | 2 |
|---|---|
| Threads | 4 |
| Core architecture | Zen (Dali) |
| Clocks | 2.6 GHz base, up to 3.5 GHz boost |
| Cache | 4 MB L3, 1 MB L2 and 192 KB L1 |
| Default TDP | 15 W (12 to 25 W configurable) |
| Manufacturing process | 14 nm |
| Memory support | DDR4 up to 2400 MT/s, two channels |
| PCI Express | PCIe 3.0 from the CPU |
| Integrated graphics | Radeon Graphics with 3 cores at up to 1200 MHz |
| Multiplier | Locked |
| Package | FP5 soldered, 1140 balls |
| Cooler in the box | None (laptop cooling) |
Motherboard compatibility
AMD Ryzen 3 3250U needs a motherboard with a FP5 socket. Chipset by chipset data for this codename is not recorded yet. See the FP5 chipset list and the board maker's CPU support list.
FP5 at a glance
| Type | BGA, 1,140 contacts |
|---|---|
| Package size | 35 × 25 mm |
| Introduced | January 2018 |
| Memory | DDR4 up to 2400 MT/s, two channels |
| Cooler mounting holes | Not applicable (soldered) |
What the Ryzen 3 3250U is
The Ryzen 3 3250U is a 2-core mobile processor that AMD listed on January 6 2020 with the Dali FP5 range for entry laptops. Its Zen cores run 2.6 GHz base with boost up to 3.5 GHz across 4 threads. Cache is 4 MB of L3 with 1 MB of L2 and 192 KB of L1, and the 14 nm process keeps costs low for study bodies.
The chip targets entry laptops that need two strong threads at low heat. The 15 W default with 12 to 25 W configurability lets makers tune the same die for silent running or active cooling. The FP5 package solders to the board with 1140 balls, so there is no socket retention.
Radeon graphics handle display output, with 3 cores at up to 1200 MHz. The multiplier is locked. The 95 C maximum operating temperature suits small chassis with simple cooling.
Socket and motherboard compatibility
The 3250U fits the FP5 package only. The chip solders to the laptop board, so there is no socket retention and no later processor upgrade. Board support is fixed to the FP5 platform with DDR4 memory placed near the processor.
Because the package is soldered, buyers compare complete entry laptops rather than separate parts. A buyer who needs similar efficiency with newer graphics steps to Picasso based Ryzen 3 mobile parts on the same footprint. The Dali refresh stays in its value role for its whole service life.
The How to find your CPU socket type guide explains how to confirm a soldered package from the system specifications. For service, a failed processor means a board replacement through the laptop maker. The related AMD Athlon Silver 3050U shows the Athlon entry point on the same FP5 Dali footprint.
Memory, PCIe and cooling
The memory controller supports DDR4 up to 2400 MT/s across two channels. Entry designs use DDR4 SO-DIMM or soldered DDR4 for cost reasons, with 2 x 4 GB common for study use. There is no DDR5 path on FP5.
The processor exposes PCIe 3.0 lanes for storage and wireless. Laptop boards split the lanes between NVMe or SATA storage and Wi-Fi, with exact splits fixed per design. Cooler mounting uses no desktop pattern. Cooling follows the laptop thermal design with a single heat pipe and fan sized for 15 W, and the CPU cooler compatibility by socket guide places soldered mobile cooling against desktop mounts.
Power configurability matters for battery life. A 12 W setting stretches unplugged time with lower sustained clocks, while a 25 W setting holds 2.6 GHz base longer with more fan noise. Makers publish the configured value per model, so two laptops with the same 3250U can differ under load.
Upgrade paths
On the same FP5 footprint there is no CPU upgrade path, since the chip is soldered. Owners who need more threads move to a 4-thread Ryzen 5 Dali laptop or a newer Picasso design rather than a chip swap. Memory and storage remain the only practical upgrades.
Within Dali, the nearby steps are the AMD Athlon Silver 3050U for Athlon branding at lower clocks and the AMD Athlon Gold 3150U for slightly higher clocks. All three share 2 cores, 4 threads and FP5, so the choice is clocks and graphics rather than core count.
Moving past FP5 entirely means a new laptop on FP6 or later with DDR4-3200 or DDR5 memory. For buyers choosing in 2020, the 3250U suited entry study designs near 15 W, while 4-core Picasso parts asked for higher prices. The two share the FP5 package, but they do not share boards across generations.
Frequently asked questions
What socket does the AMD Ryzen 3 3250U use?
It uses FP5, a soldered ball grid array with 1140 balls. The chip cannot be removed or replaced.
What memory does the Ryzen 3 3250U support?
DDR4 up to 2400 MT/s in two channels. Entry boards use SO-DIMM or soldered DDR4, so capacity is often fixed at purchase on the cheapest models.
Can the Ryzen 3 3250U be overclocked?
No. The multiplier is locked, and laptop firmware does not expose desktop overclocking controls. Sustained speed follows the maker configured value between 12 W and 25 W.
How does the 3250U differ from the Athlon Silver 3050U?
The 3250U runs 2.6 GHz base with boost to 3.5 GHz, while the AMD Athlon Silver 3050U runs 2.2 GHz base with boost to 3.2 GHz. Both share 2 cores, 4 threads, FP5 and 15 W.
Sources and verification
- AMD Ryzen 3 3250U specifications (AMD)
- List of AMD Athlon processors - Dali 14nm (Wikipedia)
- Ryzen - Dali dual-core mobile parts (Wikipedia)
Facts last checked against these sources on . Page last edited on .