BGA 2106 Socket: Compatible CPUs, Chipsets and Coolers

Maker	Intel
Package type	BGA
Contacts	2,106
Package size	47.5 × 47.5 mm
Introduced	2020
Status	Previous generation
Memory	DDR4 with ECC, 2 channels, up to 256 GB (2400 or 2933 MT/s by SKU)
PCIe from the CPU	PCIe Gen3 with SKU-dependent lanes (12, 16 or 32)
Cooler mounting holes	Not applicable (soldered)
Replaces	None
Replaced by	None

Overview

Boards pair BGA 2106 with DDR4 memory with ECC in two channels up to 256 GB, at 2400 MT/s on small SKUs and 2933 MT/s on large SKUs. The SoC provides PCIe Gen3 lanes that scale with the SKU: 12 lanes on small C parts, 16 lanes on mid range parts, and 32 lanes on P parts plus the storage focused C5115. The fixed clocks across the range keep validation simple, since no boost table changes lane or memory behavior.

Like every soldered BGA package, BGA 2106 trades socket flexibility for board integration. The chip cannot be swapped after assembly, cooling is part of the appliance chassis with a board heatsink for 32 W to 78 W parts, and buyers choose core count with memory and lanes as one system. When a design needs socketed Xeon scale instead of soldered Atom efficiency, LGA server sockets carry the larger silicon instead.

Codename	Marketing name	Years	Notes
Snow Ridge	Intel Atom P5000 series	2022	Tremont network silicon for edge and wireline workloads, launched in 2022 on BGA 2106 boards with DDR4 and PCIe Gen3.
Parker Ridge	Intel Atom C5000 series	2022	Tremont communications silicon for network appliances and storage control, launched in 2022 on the same BGA 2106 grid array.

A large soldered network package

BGA 2106 follows the soldered grid array rule: the processor joins the board through 2106 solder balls with no retention lever and no pins to bend. Unlike LGA server sockets, the chip cannot be swapped for another SKU where the board supports it. The 47.5 by 47.5 mm flip chip package needs factory assembly with reflow equipment, which matters more at this ball count than on small client BGA packages.

The package choice shapes the appliance more than buyers expect. BGA 2106 needs a carrier board with two-channel DDR4 ECC layout and Gen3 lane routing that matches the SKU lane count, since a 12-lane C part and a 32-lane P part share the footprint but not the wiring. Compatibility lives in the board design files rather than a CPU support list, so the SKU choice is final at layout time.

Memory, expansion and cooling

Memory on BGA 2106 is ECC DDR4 in a two-channel layout up to 256 GB. Small SKUs run 2400 MT/s while large SKUs reach 2933 MT/s. Capacity and ECC join the SKU as lasting choices, since appliance memory is often soldered or fixed at build time.

Expansion comes from SoC Gen3 lanes with board switches for NICs, NVMe and storage controllers. The 32-lane P parts split lanes across multiple 25 GbE ports and NVMe, while 12-lane C parts cover lighter templates. Boards that need more than the SoC offers add switches for extra ports.

Cooling has no single retail answer on BGA 2106. The same footprint spans 32 W storage parts to 78 W flagship P parts, and the heatsink is drawn for that appliance with board level airflow. The large package needs even mounting pressure across the grid array, so the thermal design follows the board maker specification rather than a generic cooler manual.

Where BGA 2106 designs are used

BGA 2106 covers network appliances from 2022: wireline access, edge routing, storage control and SD-WAN boxes with soldered simplicity. The P stack scales from 12-core parts through 20-core flagships in one footprint, with fixed clocks for deterministic forwarding.

Small desktop builders meet LGA desktop platforms instead, while large throughput designs use Xeon D or Xeon Scalable sockets with more lanes and channels. BGA 2106 stays the soldered home of Tremont network silicon. The Socket vs chipset: what decides whether a CPU works guide covers why embedded compatibility lives in board design files.

Processor	Cores / threads	Base / boost	TDP	Launched
Intel Atom C5115	4 / 4	2.8 GHz	43 W	Jun 2022
Intel Atom C5125	8 / 8	2.8 GHz	50 W	Jun 2022
Intel Atom C5310	4 / 4	1.6 GHz	32 W	Jun 2022
Intel Atom C5315	4 / 4	2.4 GHz	38 W	Jun 2022
Intel Atom C5320	8 / 8	2.4 GHz	41 W	Jun 2022
Intel Atom C5325	8 / 8	2.4 GHz	41 W	Jun 2022
Intel Atom P5332	12 / 12	2.2 GHz	61 W	Jun 2022
Intel Atom P5342	16 / 16	2.2 GHz	71 W	Jun 2022
Intel Atom P5352	20 / 20	2.2 GHz	78 W	Jun 2022
Intel Atom P5362	24 / 24	2.2 GHz	83 W	Jun 2022
Intel Atom P5721	8 / 8	2.2 GHz	48 W	Jun 2022
Intel Atom P5731	12 / 12	2.2 GHz	54.5 W	Jun 2022
Intel Atom P5742	16 / 16	2.2 GHz	67 W	Jun 2022
Intel Atom P5752	20 / 20	2.2 GHz	74.5 W	Jun 2022
Intel Atom C5335C1	12 / 12	2.4 GHz	50 W	2022
Intel Atom P5921B	8 / 8	2.2 / 2.2 GHz	n/a	Mar 2020
Intel Atom P5931B	12 / 12	2.2 / 2.2 GHz	n/a	Mar 2020
Intel Atom P5942B	16 / 16	2.2 / 2.2 GHz	n/a	Mar 2020
Intel Atom P5962B	24 / 24	2.2 / 2.2 GHz	n/a	Mar 2020

Frequently asked questions

Which processors fit BGA 2106?

Intel Atom P5000 Snow Ridge parts such as the P5352 and P5742, plus Atom C5000 Parker Ridge parts such as the C5315 and C5115. Desktop Core parts do not fit this soldered grid array.

Can a BGA 2106 chip be replaced?

No. The chip solders to the board with 2106 balls, so replacement means a board swap. Buyers choose the SKU at design time.

What memory does BGA 2106 use?

DDR4 with ECC in two channels up to 256 GB, at 2400 or 2933 MT/s depending on the SKU. Population follows the board layout with soldered or DIMM memory.

How many PCIe lanes does BGA 2106 provide?

PCIe Gen3 with a lane count that depends on the SKU: 12 lanes on small C parts, 16 lanes on mid range parts, and 32 lanes on P parts and the C5115. Check the SKU specifications before laying out the board.

BGA 2106 socket: CPUs, chipsets and cooler fit

Quick facts