BGA 1493 socket: CPUs, chipsets and cooler fit
BGA 1493 is Intel flip-chip ball grid array package with 1493 balls for Elkhart Lake Atom embedded processors including the x6214RE and x6416RE industrial parts launched in the first quarter of 2023. The package measures 35 × 24 mm and solders directly to industrial boards with an operating range down to minus 40 C on RE suffix parts. There is no socketed upgrade path.
Quick facts
| Maker | Intel |
|---|---|
| Package type | BGA |
| Contacts | 1,493 |
| Package size | 35 × 24 mm |
| Introduced | January 2023 |
| Status | Previous generation |
| Memory | DDR4-3200 or LPDDR4x-4267, single channel, up to 32 GB, board dependent with In-Band ECC where enabled |
| PCIe from the CPU | PCIe Gen3 with 8 lanes from the SoC for NVMe, wireless and expansion |
| Cooler mounting holes | Not applicable (soldered) |
| Replaces | None |
| Replaced by | None |
Overview
The platform pairs Tremont-class efficient cores without hyperthreading with Intel UHD graphics for 4K displays through eDP, DisplayPort, HDMI and MIPI-DSI. Memory covers LPDDR4x to 4267 MT/s and DDR4 to 3200 MT/s in single channel to 32 GB with In-Band ECC where the board enables it. Eight PCIe Gen3 lanes from the SoC serve NVMe, wireless and expansion on fanless Pico-ITX and board designs.
Industrial buyers choose RE parts for extended temperature and long supply rather than for peak speed. Two cores at 6 W suit gateways and HMIs, while 4 cores at 9 W suit vision and control workloads with graphics. Boards for BGA 1264 moved to Alder Lake-N Gracemont cores with DDR5, so BGA 1493 remains the Elkhart Lake DDR4 era embedded package.
Processor generations
| Codename | Marketing name | Years | Notes |
|---|---|---|---|
| Elkhart Lake | Atom x6000RE series | 2023 | Tremont efficient cores without hyperthreading for industrial boards, including 2-core x6214RE at 6 W and 4-core x6416RE at 9 W with UHD graphics. Launched in the first quarter of 2023. |
Memory and IO on BGA 1493 boards
BGA 1493 boards use a single DDR4 SODIMM to DDR4-3200 up to 32 GB or soldered LPDDR4x to 4267 MT/s depending on vibration and size targets. In-Band ECC works with standard memory where the board enables it, which suits industrial controllers without ECC DIMM cost. Single channel operation is fixed, so memory bandwidth trails dual channel laptop platforms at similar clocks.
Eight PCIe Gen3 lanes split into one by 4 plus smaller ports for NVMe, wireless and on-board devices. Display output covers three independent 4K panels at 60 Hz through the UHD block. USB, SATA and serial IO come from board wiring around the SoC. Builders should confirm lane splits in the manual before ordering Wi-Fi and storage together.
Cooling and board design
Every BGA 1493 processor is soldered with no retention, so cooling belongs to the board maker. Most 6 to 9 W RE designs run fanless with a spreader to the chassis, while enclosed boxes add a small fan for 85 C ambient. Paste or pad service follows the maker manual for die height and keep-out.
Because configuration is fixed at order time, core count and memory size decide the life of the box. A gateway that may later run vision models should take the 4-core part up front, while a fixed HMI image runs well on the 2-core part for years.
Identifying BGA 1493 against BGA 1264
BGA 1493 uses 1493 balls at 35 × 24 mm for Elkhart Lake with DDR4. BGA 1264 uses 1264 balls for Alder Lake-N with DDR4, DDR5 and LPDDR5 on newer Gracemont cores, so boards and chips do not cross. The Intel ARK page lists the socket as FCBGA1493 under package data, and that line decides fit.
Marketing names can mislead, since Atom x6000, x7000E and x7000RE span both sockets. When a support list names x6416RE it means BGA 1493, while x7425E means BGA 1264. The How to find your CPU socket type guide shows where ARK lists package data.
CPUs on BGA 1493
15 processor pages in the database, newest first.
| Processor | Cores / threads | Base / boost | TDP | Launched |
|---|---|---|---|---|
| Intel Atom x6214RE | 2 / 2 | 1.4 GHz | 6 W | Jan 2023 |
| Intel Atom x6416RE | 4 / 4 | 1.7 GHz | 9 W | Jan 2023 |
| Intel Atom x6200FE | 2 / 2 | 1.0 GHz | 4.5 W | Jan 2021 |
| Intel Atom x6211E | 2 / 2 | 1.3 / 3.0 GHz | 6 W | Jan 2021 |
| Intel Atom x6212RE | 2 / 2 | 1.2 GHz | 6 W | Jan 2021 |
| Intel Atom x6413E | 4 / 4 | 1.5 / 3.0 GHz | 9 W | Jan 2021 |
| Intel Atom x6414RE | 4 / 4 | 1.5 GHz | 9 W | Jan 2021 |
| Intel Atom x6425E | 4 / 4 | 2.0 / 3.0 GHz | 12 W | Jan 2021 |
| Intel Atom x6425RE | 4 / 4 | 1.9 GHz | 12 W | Jan 2021 |
| Intel Atom x6427FE | 4 / 4 | 1.9 GHz | 12 W | Jan 2021 |
| Intel Celeron J6412 | 4 / 4 | 2.0 / 2.6 GHz | 10 W | Jan 2021 |
| Intel Celeron J6413 | 4 / 4 | 1.8 / 3.0 GHz | 10 W | Jan 2021 |
| Intel Celeron N6211 | 2 / 2 | 1.2 / 3.0 GHz | 6.5 W | Jan 2021 |
| Intel Pentium J6426 | 4 / 4 | 2.0 / 3.0 GHz | 10 W | Jan 2021 |
| Intel Pentium N6415 | 4 / 4 | 1.2 / 3.0 GHz | 6.5 W | Jan 2021 |
Frequently asked questions
Can a BGA 1493 processor be replaced or upgraded?
No. The processor is soldered to the board. Upgrading means replacing the board, so choose core count at order time.
What memory does BGA 1493 use?
DDR4-3200 SODIMM to 32 GB or LPDDR4x-4267 soldered in single channel, with In-Band ECC where enabled.
How many PCIe lanes does BGA 1493 provide?
8 PCIe Gen3 lanes from the SoC for NVMe, wireless and expansion.
What is the difference between BGA 1493 and BGA 1264?
BGA 1493 is the 1493-ball DDR4 package for Elkhart Lake. BGA 1264 is the 1264-ball package for Alder Lake-N with DDR5 support. Chips do not cross between them.
Sources and verification
Facts last checked against these sources on . Page last edited on .