BGA 1284 socket: CPUs, chipsets and cooler fit
BGA 1284, also called FCBGA1284, is the Intel soldered package for Sandy Bridge and Gladden embedded processors. It carries 1,284 balls in a 37.5 × 37.5 mm footprint and solders directly to the carrier board. Intel introduced it in May 2012 with the Gladden Xeon E3-1105C and E3-1125C plus the Pentium B915C and Core i3-2115C, all embedded parts with long lifecycles.
Quick facts
| Maker | Intel |
|---|---|
| Package type | BGA |
| Contacts | 1,284 |
| Package size | 37.5 × 37.5 mm |
| Introduced | May 2012 |
| Status | Legacy |
| Memory | DDR3-1066 to 1600 with ECC, two channels |
| PCIe from the CPU | PCIe 2.0, up to 20 lanes (layout varies by board design) |
| Cooler mounting holes | Not applicable (soldered) |
| Replaces | None |
| Replaced by | None |
Overview
The package covers dual core parts at 15 W to 25 W and quad core parts at 25 W to 40 W, with ECC memory on qualified carriers. Because the chip is soldered, carriers qualify each model with a fixed board and BIOS, and a later swap is impossible outside factory rework. Some databases list the Gladden quads under the nearby name BGA 1283, which differs by one ball from the ARK name FCBGA1284 but refers to the same soldered class.
Do not confuse BGA 1284 with BGA 1283. That package carries 1,283 balls for Centerton Atom server SoCs at 6 W to 9 W with single channel memory, while BGA 1284 carries larger Sandy Bridge and Gladden dies with dual channel ECC memory. The ball counts, silicon and carriers never interchange. Later Intel embedded parts moved to newer BGA packages with DDR4 memory.
Processor generations
| Codename | Marketing name | Years | Notes |
|---|---|---|---|
| Gladden | Xeon E3-1100C and Pentium embedded | 2012 to 2013 | Soldered Gladden embedded parts including the Xeon E3-1105C and E3-1125C plus the Pentium B915C, launched in May 2012 with ECC memory. |
| Sandy Bridge | Core i3 embedded | 2012 | Soldered Sandy Bridge embedded parts including the Core i3-2115C at 2.0 GHz with 25 W, launched in May 2012. |
Soldered embedded package
BGA 1284 processors solder with 1,284 balls and cannot be removed or replaced in the field. There is no lever, no pin grid and no retail cooler mount. Thermal design uses the carrier heatsink sized for 15 W duals through 40 W quads, with directed airflow in communications and control enclosures.
Because the chip cannot be swapped, the check before buying a used BGA 1284 carrier is the whole system. Firmware revision, memory population and I/O mezzanines matter more than small differences between SKUs. A board replacement is the only CPU path, and carriers rarely exchange models because each BIOS qualifies a fixed string.
Memory and I/O
BGA 1284 carriers use DDR3 with ECC in two channels, commonly at 1066 to 1600 MT/s for up to 32 GB. ECC catches single bit errors in always on service, which is the point of the embedded qualification. Capacity follows the carrier design, which can sit below the CPU maximum in compact boxes.
PCI Express is revision 2.0 with up to 20 lanes from the CPU, split by the carrier as 1x16 plus 1x4, 2x8 plus 1x4 or 1x8 plus 3x4 for networking, storage and expansion. Embedded boards spend lanes on reliable I/O rather than gaming graphics, and the Gladden quads have no on die graphics at all.
Platform lifecycle
BGA 1284 belongs to the Sandy Bridge embedded generation of 2012. Intel later moved embedded designs to Haswell and newer BGA packages with DDR4 memory and different ball counts. New BGA 1284 carriers are not current retail, so working systems are used stock with fixed firmware.
For a running carrier the useful work is maintenance: clean airflow paths, confirm ECC logs stay clear, and keep storage healthy. A platform move means a new embedded box on a current package. The How to find your CPU socket type guide shows how to confirm the package before ordering parts.
CPUs on BGA 1284
4 processor pages in the database, newest first.
| Processor | Cores / threads | Base / boost | TDP | Launched |
|---|---|---|---|---|
| Intel Core i3-2115C | 2 / 4 | 2.0 GHz | 25 W | May 2012 |
| Intel Pentium B915C | 2 / 4 | 1.5 GHz | 15 W | May 2012 |
| Intel Xeon E3-1105C | 4 / 8 | 1.0 GHz | 25 W | May 2012 |
| Intel Xeon E3-1125C | 4 / 8 | 2.0 GHz | 40 W | May 2012 |
Frequently asked questions
Can a BGA 1284 processor be replaced or upgraded?
No. The chip solders with 1,284 balls. A faster carrier means a new board or a new box.
Which processors fit BGA 1284?
Sandy Bridge and Gladden embedded parts such as the Xeon E3-1105C and E3-1125C, the Pentium B915C and the Core i3-2115C. Centerton Atom parts use the different BGA 1283 package.
What memory does BGA 1284 use?
DDR3 with ECC in two channels, 1066 to 1600 MT/s, up to 32 GB. Capacity follows the carrier design.
Is BGA 1284 the same as BGA 1283?
No. BGA 1284 has 1,284 balls for Sandy Bridge and Gladden embedded parts, while BGA 1283 has 1,283 balls for Centerton Atom SoCs. The packages and carriers never interchange.
Sources and verification
- Intel Xeon E3-1105C Specifications (ARK, FCBGA1284)
- Intel Xeon Processors BGA1284 Support Article (Intel)
- Intel Xeon E3-1105C Specs (TechPowerUp)
Facts last checked against these sources on . Page last edited on .