Qualcomm Snapdragon X1P-64-100 socket: Qualcomm BGA 2073

The Qualcomm Snapdragon X1P-64-100 uses Qualcomm BGA 2073, soldered with 2,073 balls. It is a 10-core Snapdragon X Plus part running at 3.4 GHz, and the soldered chip cannot be replaced.

Launched
April 2024
Cores and threads
10 and 10
Base power
35 W
Codename
Oryon
Segment
Mobile (soldered)
Clocks
3.4 / 3.4 GHz

Qualcomm Snapdragon X1P-64-100 specifications

Cores10
Threads10 (one thread per core)
Core architectureQualcomm Oryon (Oryon v1), ARM64 compatible
Clocks3.4 GHz multi-core, no single-core boost
Cache42 MB total
Processor base power (TDP)35 W
Manufacturing process4 nm (TSMC)
Memory supportLPDDR5X-8448, 135 GB/s shared
PCI ExpressPCIe Gen4
Integrated graphicsQualcomm Adreno, up to 3.8 TFLOPS
NPUQualcomm Hexagon, 45 TOPS
MultiplierLocked
PackageBGA2073 (soldered, 2073 balls)

Motherboard compatibility

Qualcomm Snapdragon X1P-64-100 needs a motherboard with a Qualcomm BGA 2073 socket. Chipset by chipset data for this codename is not recorded yet. See the Qualcomm BGA 2073 chipset list and the board maker's CPU support list.

Qualcomm BGA 2073 at a glance

TypeBGA, 2,073 contacts
Package sizen/a
IntroducedApril 2024
MemoryLPDDR5X-8448, 135 GB/s shared bandwidth, up to 64 GB
Cooler mounting holesNot applicable (soldered)

Read the full Qualcomm BGA 2073 socket guide

What the Snapdragon X1P-64-100 is

The Snapdragon X1P-64-100 is a 10-core and 10-thread laptop processor that Qualcomm launched in April 2024 as the entry 10-core Plus tier. Ten Oryon cores with one thread each give 10 threads at 3.4 GHz multi-core with no single-core boost. Cache totals 42 MB. The 35 W class fits thin Copilot+ laptops that need more threads than 8-core Plus without boost pricing.

Adreno graphics at up to 3.8 TFLOPS cover everyday displays plus video. A 45 TOPS Hexagon NPU brings Copilot+ AI to 10-core tiers. LPDDR5X-8448 with 135 GB per s feeds all engines from a shared soldered pool.

Offices with heavy browser multitasking fit here. Ten cores keep many tabs smooth at steady 3.4 GHz. Buyers who need 4.0 GHz bursts for snaps should take the Qualcomm Snapdragon X1P-66-100 with single-core boost instead, since this 64-100 prioritizes threads over peaks.

Socket and motherboard compatibility

The X1P-64-100 solders to Qualcomm BGA 2073 with soldered LPDDR5X. Makers cool the 35 W band with thin fans. No socket and no memory change exist.

Boards use LPDDR5X-8448 with NVMe Gen4 storage. Display output covers panels plus UHD monitors. Power profiles balance battery with sustained throughput.

Plus shoppers compare 10-core parts on boost. The 64-100 trails the boosted twin on bursts. The LGA, PGA and BGA: CPU package types explained guide covers soldered ARM.

Memory, PCIe and cooling

LPDDR5X-8448 with 135 GB per s shared by CPU, GPU and NPU is fixed at order time. Multitasking loads fit comfortably. Soldered capacity cannot grow.

PCIe Gen4 serves NVMe and wireless. Fixed wiring means options vary.

Cooling is thin-body 35 W with quiet curves. No retail cooler ships with soldered parts.

Upgrade paths

No CPU or RAM upgrade exists. The Plus 10-core decision is boost tier at order time. Storage is the only later change.

The next platform is Snapdragon X2 with newer cores. A working 64-100 lasts office years.

Frequently asked questions

What socket does the Snapdragon X1P-64-100 use?

It uses Qualcomm BGA 2073, soldered with 2,073 balls. The chip cannot be changed.

How fast is the Snapdragon X1P-64-100?

Ten cores and 10 threads at 3.4 GHz with no single-core boost, with 42 MB of total cache.

What memory does the X1P-64-100 support?

LPDDR5X-8448 with 135 GB per s shared by CPU, GPU and NPU.

Can the X1P-64-100 be upgraded?

No. CPU and RAM solder together. Only storage can change.

Sources and verification

  1. Snapdragon X Elite ARM laptop processors specs X Plus table (Qualcomm)
  2. Qualcomm Snapdragon X Elite and X Plus laptop chips explained table (CNET)

Facts last checked against these sources on . Page last edited on .